KR100890295B1 - 애블레이션을 위한 방법 및 장치 - Google Patents

애블레이션을 위한 방법 및 장치 Download PDF

Info

Publication number
KR100890295B1
KR100890295B1 KR1020067026294A KR20067026294A KR100890295B1 KR 100890295 B1 KR100890295 B1 KR 100890295B1 KR 1020067026294 A KR1020067026294 A KR 1020067026294A KR 20067026294 A KR20067026294 A KR 20067026294A KR 100890295 B1 KR100890295 B1 KR 100890295B1
Authority
KR
South Korea
Prior art keywords
area
dem
debris
substrate
ablation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067026294A
Other languages
English (en)
Korean (ko)
Other versions
KR20070039493A (ko
Inventor
네일 사이키스
요시나리 사사키
히데히사 무라세
나오키 야마다
코세이 아소
Original Assignee
엑사이텍 리미티드
소니 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엑사이텍 리미티드, 소니 가부시끼 가이샤 filed Critical 엑사이텍 리미티드
Publication of KR20070039493A publication Critical patent/KR20070039493A/ko
Application granted granted Critical
Publication of KR100890295B1 publication Critical patent/KR100890295B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020067026294A 2004-06-11 2005-06-13 애블레이션을 위한 방법 및 장치 Expired - Fee Related KR100890295B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0413029.0 2004-06-11
GB0413029A GB2414954B (en) 2004-06-11 2004-06-11 Process and apparatus for ablation
PCT/GB2005/002326 WO2005120763A2 (en) 2004-06-11 2005-06-13 Process and apparatus for ablation

Publications (2)

Publication Number Publication Date
KR20070039493A KR20070039493A (ko) 2007-04-12
KR100890295B1 true KR100890295B1 (ko) 2009-03-26

Family

ID=32732303

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067026294A Expired - Fee Related KR100890295B1 (ko) 2004-06-11 2005-06-13 애블레이션을 위한 방법 및 장치

Country Status (6)

Country Link
US (2) US8344285B2 (enExample)
JP (2) JP2008501531A (enExample)
KR (1) KR100890295B1 (enExample)
CN (1) CN101018639B (enExample)
GB (1) GB2414954B (enExample)
WO (1) WO2005120763A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101256430B1 (ko) * 2011-03-15 2013-04-18 삼성에스디아이 주식회사 레이저 용접 장치
WO2017135552A1 (ko) * 2016-02-02 2017-08-10 학교법인 한동대학교 표면개질용 빔균질기

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050064137A1 (en) * 2003-01-29 2005-03-24 Hunt Alan J. Method for forming nanoscale features and structures produced thereby
EP1657020A1 (de) * 2004-11-10 2006-05-17 Synova S.A. Verfahren und Vorrichtung zur Optimierung der Kohärenz eines Flüssigkeitsstrahls für eine Materialbearbeitung und Flüssigkeitsdüse für eine solche Vorrichtung
CN100536046C (zh) * 2005-02-25 2009-09-02 京瓷株式会社 复合生片的加工方法
US7863542B2 (en) 2005-12-22 2011-01-04 Sony Corporation Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
JP5165203B2 (ja) 2006-03-07 2013-03-21 ソニー株式会社 レーザ加工装置及びレーザ加工方法
GB2438527B (en) * 2006-03-07 2008-04-23 Sony Corp Laser processing apparatus, laser processing head and laser processing method
SE530592C2 (sv) * 2007-01-16 2008-07-15 Tetra Laval Holdings & Finance Anordning för laserbearbetning av en förpackningsmaterialbana
CN101518854B (zh) * 2008-02-29 2011-08-31 深圳市大族激光科技股份有限公司 透镜的吸尘保护装置
JP5094535B2 (ja) * 2008-05-07 2012-12-12 富士フイルム株式会社 凹部形成方法、凹凸製品の製造方法、発光素子の製造方法および光学素子の製造方法
US8207472B2 (en) * 2008-06-18 2012-06-26 Electro Scientific Industries, Inc. Debris capture and removal for laser micromachining
FR2932899B1 (fr) * 2008-06-23 2010-07-30 Commissariat Energie Atomique Procede d'elimination de defaut de gravure d'une couche metallique deposee sur un support souple.
US8288678B2 (en) * 2008-12-18 2012-10-16 Ppg Industries Ohio, Inc. Device for and method of maintaining a constant distance between a cutting edge and a reference surface
FR2940154B1 (fr) * 2008-12-23 2011-02-25 Commissariat Energie Atomique Avaloir d'aspiration de particules fines et dispositif d'ablation laser d'une couche superficielle d'une paroi comprenant un tel avaloir
JP2011125871A (ja) * 2009-12-15 2011-06-30 Disco Abrasive Syst Ltd レーザ加工装置
KR101135499B1 (ko) * 2010-05-28 2012-04-13 삼성에스디아이 주식회사 전지용 전극 탭의 레이저 세정 장치 및 이를 이용한 레이저 세정 방법
JP5501099B2 (ja) * 2010-06-03 2014-05-21 株式会社ディスコ レーザ加工装置
GB2481190B (en) * 2010-06-04 2015-01-14 Plastic Logic Ltd Laser ablation
JP5610991B2 (ja) * 2010-11-08 2014-10-22 株式会社ディスコ レーザ加工装置
DE102011001322A1 (de) * 2011-03-16 2012-09-20 Ipg Laser Gmbh Maschine und Verfahren zur Materialbearbeitung von Werkstücken mit einem Laserstrahl
DE102011107982A1 (de) * 2011-07-20 2013-01-24 Rena Gmbh Werkzeugkopf (LCP-Kopf)
WO2013029038A2 (en) 2011-08-25 2013-02-28 Preco, Inc. Method and apparatus for making a clean cut with a laser
DE102012202330B4 (de) * 2012-02-16 2017-08-17 Trumpf Laser Gmbh Laserbearbeitungsvorrichtung mit einem relativ zu einer Spannpratze beweglichen Laserbearbeitungskopf
CN102642085A (zh) * 2012-04-01 2012-08-22 上海交通大学 激光焊接等离子体侧吸负压装置
JP5943720B2 (ja) * 2012-06-06 2016-07-05 株式会社ディスコ レーザー加工装置
CN102692447B (zh) * 2012-06-11 2014-04-02 燕山大学 小型化强脉冲单轨放电烧蚀装置
US9259802B2 (en) * 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
JP2015134364A (ja) * 2014-01-16 2015-07-27 株式会社デンソー レーザ加工装置およびレーザ加工方法
JP5663776B1 (ja) * 2014-03-27 2015-02-04 福井県 吸引方法及び吸引装置並びにレーザ加工方法及びレーザ加工装置
EP2944413A1 (de) * 2014-05-12 2015-11-18 Boegli-Gravures S.A. Vorrichtung zur Maskenprojektion von Femtosekunden- und Pikosekunden- Laserstrahlen mit einer Blende, einer Maske und Linsensystemen
US11311967B2 (en) * 2014-08-19 2022-04-26 Lumileds Llc Sapphire collector for reducing mechanical damage during die level laser lift-off
CN105458495B (zh) * 2014-09-11 2017-03-22 大族激光科技产业集团股份有限公司 一种用于激光精密加工的配套系统
GB2530982B (en) * 2014-09-30 2018-10-24 M Solv Ltd Bernoulli process head
US10335899B2 (en) * 2014-10-31 2019-07-02 Prima Power Laserdyne Cross jet laser welding nozzle
CN104625404B (zh) * 2014-12-12 2016-08-17 南通富士通微电子股份有限公司 一种用于激光打标工艺中的清理装置
CN105772942B (zh) * 2014-12-25 2018-07-03 大族激光科技产业集团股份有限公司 一种激光焊缝同轴吹气保护装置及应用方法
EP3295479B1 (en) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
US10328529B2 (en) 2015-08-26 2019-06-25 Electro Scientific Industries, Inc Laser scan sequencing and direction with respect to gas flow
EP3167998B1 (en) * 2015-11-16 2021-01-06 Preco, Inc. Galvo cooling air bypass to reduce contamination
CN105499804B (zh) * 2016-01-18 2018-01-02 华中科技大学 一种激光焊接过程中焊缝内部孔洞的控制方法及控制装置
JP6999264B2 (ja) * 2016-08-04 2022-01-18 株式会社日本製鋼所 レーザ剥離装置、レーザ剥離方法、及び有機elディスプレイの製造方法
CN108098155B (zh) * 2016-11-17 2020-10-09 宁德新能源科技有限公司 除尘装置
JP6450783B2 (ja) 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工ヘッド用ノズル
JP6450784B2 (ja) * 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工機
KR101876961B1 (ko) * 2017-03-14 2018-07-10 주식회사 에이치비테크놀러지 박막형성 장치
KR101876963B1 (ko) * 2017-03-14 2018-07-10 주식회사 에이치비테크놀러지 박막형성 장치
JP6508549B2 (ja) * 2017-05-12 2019-05-08 パナソニックIpマネジメント株式会社 レーザ加工装置
JP6985642B2 (ja) * 2017-10-20 2021-12-22 株式会社Ihi レーザ溶接装置及びレーザ溶接方法
KR102759919B1 (ko) * 2018-03-20 2025-01-23 오르보테크 엘티디. 광학 처리 시스템 내에서 기판으로부터 파편을 제거하기 위한 시스템
JP7114708B2 (ja) 2018-06-27 2022-08-08 ギガフォトン株式会社 レーザ加工装置、レーザ加工システム、及びレーザ加工方法
JP6852031B2 (ja) * 2018-09-26 2021-03-31 株式会社東芝 溶接装置及びノズル装置
KR102787822B1 (ko) 2018-12-10 2025-04-01 삼성디스플레이 주식회사 표시 장치의 제조 방법
CN109623140B (zh) * 2018-12-11 2021-07-27 中国科学院宁波材料技术与工程研究所 光纤与水导激光耦合加工装置及系统
KR102677888B1 (ko) * 2019-01-28 2024-06-26 삼성디스플레이 주식회사 석션 장치 및 그것을 포함하는 패널 가공 장치
US11273520B2 (en) * 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation
DE102019103659B4 (de) * 2019-02-13 2023-11-30 Bystronic Laser Ag Gasführung, Laserschneidkopf und Laserschneidmaschine
GB2581378A (en) * 2019-02-15 2020-08-19 Hanbury Robert Laser cutting sheet/material support system
JP7306860B2 (ja) * 2019-04-11 2023-07-11 Jswアクティナシステム株式会社 レーザ処理装置
US20200357869A1 (en) 2019-05-10 2020-11-12 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
US11267075B2 (en) * 2019-05-16 2022-03-08 Raytheon Technologies Corporation By-product removal device for laser welding
US12358078B2 (en) * 2019-06-28 2025-07-15 Mitsubishi Heavy Industries, Ltd. Laser machining device
BR102019025418B1 (pt) * 2019-11-29 2022-05-03 Petróleo Brasileiro S.A. – Petrobras Arranjo de uma radiação a laser para catálise em reações de complexação
WO2021237095A1 (en) * 2020-05-22 2021-11-25 Bold Laser Automation, Inc. High velocity vacuum system for laser ablation
CN112620255B (zh) * 2020-12-15 2022-05-03 哈尔滨工业大学(深圳) 一种水下激光水流复合清洗系统及方法
CN114378446B (zh) * 2022-03-22 2022-07-29 苏州密尔光子科技有限公司 激光加工辅助装置、方法和具有该装置的激光设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342687B1 (en) 2000-02-17 2002-01-29 Universal Laser Systems, Inc. Portable laser system with portable or stationary fume evacuation
JP2002062637A (ja) * 2000-08-22 2002-02-28 Nec Corp レーザ修正方法および装置
US20020179582A1 (en) * 2001-05-07 2002-12-05 Jenoptik Automatisierungstechnik Gmbh Tool head for laser machining of materials
JP2003245791A (ja) * 2002-02-25 2003-09-02 Sony Corp レーザ加工装置およびレーザ加工方法
JP2004098091A (ja) * 2002-09-05 2004-04-02 Semiconductor Energy Lab Co Ltd レーザーマーキング装置
JP2004160463A (ja) * 2002-11-11 2004-06-10 Hyogo Prefecture レーザ加工装置および該装置を用いた被加工物の加工方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2627409A1 (fr) * 1988-02-24 1989-08-25 Lectra Systemes Sa Appareil de coupe laser muni d'un dispositif d'evacuation des fumees
DE3923829A1 (de) * 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Absauganlage
US5359176A (en) * 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
NZ272635A (en) * 1994-08-02 1998-02-26 Mcneil Ppc Inc Laser cutting/drilling processing head that creates a vortex gas flow within the head to clean and prevent back spatting of particles onto the lens therein
JP3203294B2 (ja) * 1994-09-30 2001-08-27 三菱電機株式会社 レーザ加工装置用レンズカバー
GB9507719D0 (en) * 1995-04-13 1995-05-31 Boc Group Plc Machining of materials
JPH09141484A (ja) * 1995-11-22 1997-06-03 Nikon Corp レーザ加工装置
JP3292021B2 (ja) * 1996-01-30 2002-06-17 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
US5922225A (en) * 1996-03-06 1999-07-13 Blake; Ronald J. Apparatus for reducing vaporized material deposits during laser cutting
JP3722902B2 (ja) * 1996-04-18 2005-11-30 日清紡績株式会社 レーザ加工方法及び装置
US6064035A (en) * 1997-12-30 2000-05-16 Lsp Technologies, Inc. Process chamber for laser peening
US6262390B1 (en) * 1998-12-14 2001-07-17 International Business Machines Corporation Repair process for aluminum nitride substrates
US6359257B1 (en) * 1999-02-19 2002-03-19 Lsp Technologies, Inc. Beam path clearing for laser peening
EP1149660A1 (en) * 2000-04-03 2001-10-31 Rexam Beverage Packaging AB Method and device for dust protection in a laser processing apparatus
JP2001321979A (ja) * 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
US6580053B1 (en) * 2000-08-31 2003-06-17 Sharp Laboratories Of America, Inc. Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films
JP3933398B2 (ja) * 2001-01-19 2007-06-20 リコーマイクロエレクトロニクス株式会社 ビーム加工装置
US6635844B2 (en) * 2002-01-03 2003-10-21 United Microelectronics Corp. Apparatus for on-line cleaning a wafer chuck with laser
GB2400063B (en) * 2003-04-03 2006-02-15 Exitech Ltd Positioning method and apparatus and a product thereof
JP4205486B2 (ja) * 2003-05-16 2009-01-07 株式会社ディスコ レーザ加工装置
JP4404085B2 (ja) * 2006-11-02 2010-01-27 ソニー株式会社 レーザ加工装置、レーザ加工ヘッド及びレーザ加工方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342687B1 (en) 2000-02-17 2002-01-29 Universal Laser Systems, Inc. Portable laser system with portable or stationary fume evacuation
JP2002062637A (ja) * 2000-08-22 2002-02-28 Nec Corp レーザ修正方法および装置
US20020179582A1 (en) * 2001-05-07 2002-12-05 Jenoptik Automatisierungstechnik Gmbh Tool head for laser machining of materials
JP2003245791A (ja) * 2002-02-25 2003-09-02 Sony Corp レーザ加工装置およびレーザ加工方法
JP2004098091A (ja) * 2002-09-05 2004-04-02 Semiconductor Energy Lab Co Ltd レーザーマーキング装置
JP2004160463A (ja) * 2002-11-11 2004-06-10 Hyogo Prefecture レーザ加工装置および該装置を用いた被加工物の加工方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101256430B1 (ko) * 2011-03-15 2013-04-18 삼성에스디아이 주식회사 레이저 용접 장치
WO2017135552A1 (ko) * 2016-02-02 2017-08-10 학교법인 한동대학교 표면개질용 빔균질기
CN108778604A (zh) * 2016-02-02 2018-11-09 学校法人韩东大学校 表面改性用光束均化器
US10870170B2 (en) 2016-02-02 2020-12-22 Handong Global University Foundation Beam homogenizer for surface modification
CN108778604B (zh) * 2016-02-02 2021-06-11 学校法人韩东大学校 表面改性用光束均化器

Also Published As

Publication number Publication date
US20130140287A1 (en) 2013-06-06
US8809732B2 (en) 2014-08-19
GB2414954B (en) 2008-02-06
WO2005120763A3 (en) 2006-02-23
JP2012254482A (ja) 2012-12-27
WO2005120763A2 (en) 2005-12-22
JP5389236B2 (ja) 2014-01-15
KR20070039493A (ko) 2007-04-12
GB2414954A (en) 2005-12-14
CN101018639B (zh) 2010-04-21
JP2008501531A (ja) 2008-01-24
CN101018639A (zh) 2007-08-15
US20080041832A1 (en) 2008-02-21
GB0413029D0 (en) 2004-07-14
US8344285B2 (en) 2013-01-01

Similar Documents

Publication Publication Date Title
KR100890295B1 (ko) 애블레이션을 위한 방법 및 장치
US7692115B2 (en) Laser processing device, laser processing head and laser processing method
US7863542B2 (en) Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
US7622000B2 (en) Laser processing apparatus and laser processing method
US8581140B2 (en) Laser processing apparatus, laser processing head and laser processing method
TW201918315A (zh) 雷射加工裝置
JP3932930B2 (ja) レーザ加工装置およびレーザ加工方法
JP2011125871A (ja) レーザ加工装置
JP2003245791A5 (enExample)
JP4185016B2 (ja) レーザ加工副次物の集塵方法及びその装置、レーザ加工装置
CN113325669B (zh) 光刻系统与在光刻系统中产生层流的设备
TWI303591B (en) Process and apparatus for ablation
US12001143B2 (en) Lithography exposure system with debris removing mechanism
TWI899345B (zh) 雷射加工方法
GB2438527A (en) Laser processing apparatus,laser processing head and laser processing method

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20130221

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20140221

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20150226

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20160218

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20170318

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20170318

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301