JP2003245791A5 - - Google Patents
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- Publication number
- JP2003245791A5 JP2003245791A5 JP2002047574A JP2002047574A JP2003245791A5 JP 2003245791 A5 JP2003245791 A5 JP 2003245791A5 JP 2002047574 A JP2002047574 A JP 2002047574A JP 2002047574 A JP2002047574 A JP 2002047574A JP 2003245791 A5 JP2003245791 A5 JP 2003245791A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- liquid
- laser
- debris
- processing container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 description 110
- 238000002679 ablation Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 238000003672 processing method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 5
- 230000002265 prevention Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002047574A JP3932930B2 (ja) | 2002-02-25 | 2002-02-25 | レーザ加工装置およびレーザ加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002047574A JP3932930B2 (ja) | 2002-02-25 | 2002-02-25 | レーザ加工装置およびレーザ加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003245791A JP2003245791A (ja) | 2003-09-02 |
| JP2003245791A5 true JP2003245791A5 (enExample) | 2005-06-02 |
| JP3932930B2 JP3932930B2 (ja) | 2007-06-20 |
Family
ID=28660594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002047574A Expired - Fee Related JP3932930B2 (ja) | 2002-02-25 | 2002-02-25 | レーザ加工装置およびレーザ加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3932930B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2414954B (en) * | 2004-06-11 | 2008-02-06 | Exitech Ltd | Process and apparatus for ablation |
| JP2007029973A (ja) * | 2005-07-25 | 2007-02-08 | Sony Corp | レーザ加工装置とその加工方法及びデブリ回収装置とその回収方法 |
| JP4575267B2 (ja) * | 2005-10-14 | 2010-11-04 | 株式会社東芝 | 水中施工装置および水中施工方法 |
| JP5389068B2 (ja) * | 2011-01-26 | 2014-01-15 | 三菱電機株式会社 | レーザ加工方法およびレーザ加工装置 |
| JP5814652B2 (ja) * | 2011-06-22 | 2015-11-17 | 株式会社東芝 | レーザ照射装置及びレーザ照射方法 |
| JP6447140B2 (ja) * | 2015-01-06 | 2019-01-09 | 日本電気硝子株式会社 | マイクロホールアレイ及びその製造方法 |
| JP6907093B2 (ja) * | 2017-10-24 | 2021-07-21 | 株式会社ディスコ | レーザー加工装置 |
| JP6968659B2 (ja) * | 2017-10-25 | 2021-11-17 | 株式会社ディスコ | レーザー加工装置 |
| JP6985102B2 (ja) * | 2017-10-31 | 2021-12-22 | 株式会社ディスコ | レーザー加工装置 |
| US12041842B2 (en) | 2018-07-02 | 2024-07-16 | Jdi Design And Development G.K. | Display panel patterning device |
| JP2020008741A (ja) * | 2018-07-09 | 2020-01-16 | 株式会社Ｊｏｌｅｄ | 表示パネル製造装置および表示パネル製造方法 |
| JP2023045630A (ja) * | 2021-09-22 | 2023-04-03 | コマツ産機株式会社 | レーザ加工装置およびレーザ加工方法 |
-
2002
- 2002-02-25 JP JP2002047574A patent/JP3932930B2/ja not_active Expired - Fee Related
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