JP6907093B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP6907093B2 JP6907093B2 JP2017205276A JP2017205276A JP6907093B2 JP 6907093 B2 JP6907093 B2 JP 6907093B2 JP 2017205276 A JP2017205276 A JP 2017205276A JP 2017205276 A JP2017205276 A JP 2017205276A JP 6907093 B2 JP6907093 B2 JP 6907093B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Description
レーザー光線の波長 :226nm、355nm、532nm、1064nm
平均出力 :10〜100W
繰り返し周波数 :0〜300MHz
パルス幅 :50fs〜1ns
加工送り速度 :10〜1000mm/s
6:レーザー光線照射手段
21:基台
22:枠体
30:保持手段
32:保持テーブル
32a:吸着チャック
40:液体供給機構
41:液体チャンバー
41a:フレーム基部
41b:フレーム
41c:液体供給口
41d:液体排出口
41e:空間
42:透明板
43:液体供給ノズル
44:液体排出ノズル
45:液体供給ポンプ
46:濾過フィルター
47:液体貯留タンク
82:発振器
86:集光器
88:アライメント手段
M:モータ
LB:レーザー光線
Claims (2)
- 板状の被加工物を保持する保持テーブルを備えた保持手段と、該保持テーブルに保持された被加工物にレーザー光線を照射して加工を施すレーザー光線照射手段と、を少なくとも含み構成されるレーザー加工装置であって、
該保持手段の上部には、該保持テーブルに保持された被加工物の上面との間に隙間を形成して位置付けられる円板状の透明板を備えた液体チャンバーと、該液体チャンバーの一方から該隙間に液体を供給する液体供給ノズルと、該液体チャンバーの他方から液体を排出する液体排出ノズルと、該円板状の透明板を回転させ該隙間に供給される液体に流速を生成する回転手段と、を備えた液体供給機構が配設され、
該レーザー光線照射手段は、レーザー光線を発振する発振器と、該発振器が発振したレーザー光線を集光し該透明板と該隙間に供給された液体とを透過して該保持テーブルに保持された被加工物に照射する集光器と、から少なくとも構成されるレーザー加工装置。 - 該レーザー光線照射手段には、該発振器から発振されたレーザー光線を分散させる分散手段が配設される、請求項1に記載のレーザー加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017205276A JP6907093B2 (ja) | 2017-10-24 | 2017-10-24 | レーザー加工装置 |
KR1020180121108A KR102515688B1 (ko) | 2017-10-24 | 2018-10-11 | 레이저 가공 장치 |
CN201811201520.3A CN109693036B (zh) | 2017-10-24 | 2018-10-16 | 激光加工装置 |
TW107136942A TWI768138B (zh) | 2017-10-24 | 2018-10-19 | 雷射加工裝置 |
US16/168,256 US11007605B2 (en) | 2017-10-24 | 2018-10-23 | Laser processing apparatus |
DE102018218100.4A DE102018218100A1 (de) | 2017-10-24 | 2018-10-23 | Laserbearbeitungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017205276A JP6907093B2 (ja) | 2017-10-24 | 2017-10-24 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019076926A JP2019076926A (ja) | 2019-05-23 |
JP6907093B2 true JP6907093B2 (ja) | 2021-07-21 |
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Family Applications (1)
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JP2017205276A Active JP6907093B2 (ja) | 2017-10-24 | 2017-10-24 | レーザー加工装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11007605B2 (ja) |
JP (1) | JP6907093B2 (ja) |
KR (1) | KR102515688B1 (ja) |
CN (1) | CN109693036B (ja) |
DE (1) | DE102018218100A1 (ja) |
TW (1) | TWI768138B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7123643B2 (ja) * | 2018-06-11 | 2022-08-23 | 株式会社ディスコ | レーザー加工装置 |
TWI796159B (zh) * | 2022-03-08 | 2023-03-11 | 優藶國際有限公司 | 旋轉式雷射打標系統及其製造方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0347692A (ja) * | 1989-07-15 | 1991-02-28 | Fujitsu Ltd | レーザ加工機 |
JPH09167747A (ja) * | 1995-12-14 | 1997-06-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH10305420A (ja) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法 |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP3660294B2 (ja) * | 2000-10-26 | 2005-06-15 | 株式会社東芝 | 半導体装置の製造方法 |
CN1286146C (zh) * | 2001-03-09 | 2006-11-22 | 株式会社东芝 | 电子装置的制造系统 |
JP3932930B2 (ja) * | 2002-02-25 | 2007-06-20 | ソニー株式会社 | レーザ加工装置およびレーザ加工方法 |
JP2004188475A (ja) | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
JP3842769B2 (ja) * | 2003-09-01 | 2006-11-08 | 株式会社東芝 | レーザ加工装置、レーザ加工方法、及び半導体装置の製造方法 |
JP2007136477A (ja) * | 2005-11-16 | 2007-06-07 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP5180661B2 (ja) * | 2008-04-18 | 2013-04-10 | 株式会社ディスコ | スピンナ洗浄装置および加工装置 |
JP5324180B2 (ja) * | 2008-10-07 | 2013-10-23 | 株式会社ディスコ | レーザ加工方法およびレーザ加工装置 |
EP2335859A1 (en) * | 2009-12-21 | 2011-06-22 | Honda Motor Co., Ltd. | Welding gun |
JP5534509B2 (ja) * | 2010-02-03 | 2014-07-02 | オークマ株式会社 | 切削加工方法 |
KR101261266B1 (ko) * | 2010-11-03 | 2013-05-09 | 유병소 | 레이저 가공 장치 및 이를 이용한 레이저 가공 방법 |
JP2012110942A (ja) * | 2010-11-25 | 2012-06-14 | Disco Corp | 加工方法 |
JP5220914B2 (ja) * | 2011-05-25 | 2013-06-26 | 株式会社スギノマシン | レーザー加工装置 |
JP2013248624A (ja) * | 2012-05-30 | 2013-12-12 | Disco Corp | レーザー加工装置 |
JP6137798B2 (ja) * | 2012-09-26 | 2017-05-31 | 株式会社ディスコ | レーザー加工装置及び保護膜被覆方法 |
JP6151557B2 (ja) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | レーザー加工方法 |
JP6189178B2 (ja) * | 2013-10-29 | 2017-08-30 | 株式会社ディスコ | レーザー加工装置 |
JP6494991B2 (ja) * | 2014-12-10 | 2019-04-03 | 株式会社ディスコ | ウエーハの加工方法 |
WO2016122821A2 (en) * | 2015-01-29 | 2016-08-04 | Imra America, Inc. | Laser-based modification of transparent materials |
CN204545717U (zh) * | 2015-03-26 | 2015-08-12 | 苏州创轩激光科技有限公司 | 一种强力抽风的激光切割机 |
CN204525018U (zh) * | 2015-04-13 | 2015-08-05 | 成都博智维讯信息技术有限公司 | 一种具有防尘功能的激光定位计算机数控机床 |
CN104842070B (zh) * | 2015-05-13 | 2017-10-17 | 北京万恒镭特机电设备有限公司 | 激光共晶焊接装置及其方法 |
CN104942442A (zh) * | 2015-06-11 | 2015-09-30 | 温州大学 | 激光微加工装置及其方法 |
CN206029356U (zh) * | 2016-08-29 | 2017-03-22 | 赵圣雅 | 一种自动调节的钢板钻孔机 |
-
2017
- 2017-10-24 JP JP2017205276A patent/JP6907093B2/ja active Active
-
2018
- 2018-10-11 KR KR1020180121108A patent/KR102515688B1/ko active IP Right Grant
- 2018-10-16 CN CN201811201520.3A patent/CN109693036B/zh active Active
- 2018-10-19 TW TW107136942A patent/TWI768138B/zh active
- 2018-10-23 DE DE102018218100.4A patent/DE102018218100A1/de active Pending
- 2018-10-23 US US16/168,256 patent/US11007605B2/en active Active
Also Published As
Publication number | Publication date |
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KR102515688B1 (ko) | 2023-03-29 |
JP2019076926A (ja) | 2019-05-23 |
CN109693036A (zh) | 2019-04-30 |
CN109693036B (zh) | 2022-03-04 |
TWI768138B (zh) | 2022-06-21 |
TW201916964A (zh) | 2019-05-01 |
US11007605B2 (en) | 2021-05-18 |
DE102018218100A1 (de) | 2019-04-25 |
US20190118303A1 (en) | 2019-04-25 |
KR20190045836A (ko) | 2019-05-03 |
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