JP6137798B2 - レーザー加工装置及び保護膜被覆方法 - Google Patents
レーザー加工装置及び保護膜被覆方法 Download PDFInfo
- Publication number
- JP6137798B2 JP6137798B2 JP2012211685A JP2012211685A JP6137798B2 JP 6137798 B2 JP6137798 B2 JP 6137798B2 JP 2012211685 A JP2012211685 A JP 2012211685A JP 2012211685 A JP2012211685 A JP 2012211685A JP 6137798 B2 JP6137798 B2 JP 6137798B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- film liquid
- holding
- discharge head
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims description 97
- 238000000034 method Methods 0.000 title claims description 16
- 239000007888 film coating Substances 0.000 title claims description 14
- 238000009501 film coating Methods 0.000 title claims description 14
- 239000007788 liquid Substances 0.000 claims description 66
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 76
- 230000032258 transport Effects 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
10 仮置き領域
12 保護膜被覆領域
14 加工領域
16 搬出入ユニット
17 クランプ
30 センタリングガイド
32 加工テーブル
38 アッパーアーム
44 保持テーブル
46 保護膜液吐出ヘッド
68 ロアアーム
90 レーザービーム照射ユニット
94 集光器(レーザーヘッド)
106 スリット状吐出口
108 吸引口
Claims (3)
- 被加工物を保持する加工テーブルと、該加工テーブルに保持された被加工物にレーザー加工を施すレーザー加工手段と、複数の被加工物を収容可能なカセットが載置されるカセット載置台と、該カセット載置台に載置されたカセットから被加工物を少なくとも該加工テーブルまで搬送する搬送手段と、を備えたレーザー加工装置であって、
被加工物を保持する保持面を有する保持テーブルと、
該保持テーブルに保持された被加工物の表面に保護膜を形成する水溶性樹脂からなる保護膜液を吐出するスリット状の吐出口を有する保護膜液吐出ヘッドと、
該保護膜液吐出ヘッドを該保持テーブルの該保持面に対して接近離反可能に移動させる第1移動手段と、
該保護膜液吐出ヘッドを該保持テーブルの該保持面と平行な方向に直線移動させる第2移動手段と、
該保持面の中心を通り該保持面に直交する回転軸で前記保持テーブルを回転させる駆動手段と、を具備し、
前記保護膜液吐出ヘッドは前記搬送手段に付設され、
前記第1移動手段と前記第2移動手段とは該搬送手段で兼用されることを特徴とするレーザー加工装置。 - 前記保護膜液吐出ヘッドは、保護膜液塗付方向の先頭側で前記スリット状吐出口に隣接して形成された吸引口を有する請求項1記載のレーザー加工装置。
- 請求項1又は請求項2に記載のレーザー加工装置を用いた保護膜の被覆方法であって、
前記保持テーブルで被加工物を保持する保持ステップと、
該保持テーブルに保持された被加工物の上面から所定の高さに該保護膜液吐出ヘッドを位置付ける位置付けステップと、
該位置付けステップを実施した後、該保持テーブルを第1の速度で回転させつつ該保護膜液吐出ヘッドを該保持テーブル上で直線移動させながら該保護膜液吐出ヘッドから保護膜液を被加工物上に吐出して、被加工物の上面を所定厚みの保護膜液で渦巻状に被覆する被覆ステップと、
該被覆ステップを実施した後、該保持テーブルを該第1の速度より速い第2の速度で回転させて該保護膜液を平坦化するとともに乾燥させて保護膜を形成する保護膜形成ステップと、
を含むことを特徴とする保護膜被覆方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012211685A JP6137798B2 (ja) | 2012-09-26 | 2012-09-26 | レーザー加工装置及び保護膜被覆方法 |
KR1020130113277A KR102084269B1 (ko) | 2012-09-26 | 2013-09-24 | 레이저 가공 장치 및 보호막 피복 방법 |
CN201310443370.8A CN103658986B (zh) | 2012-09-26 | 2013-09-25 | 激光加工装置以及保护膜覆盖方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012211685A JP6137798B2 (ja) | 2012-09-26 | 2012-09-26 | レーザー加工装置及び保護膜被覆方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014067843A JP2014067843A (ja) | 2014-04-17 |
JP6137798B2 true JP6137798B2 (ja) | 2017-05-31 |
Family
ID=50298425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012211685A Active JP6137798B2 (ja) | 2012-09-26 | 2012-09-26 | レーザー加工装置及び保護膜被覆方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6137798B2 (ja) |
KR (1) | KR102084269B1 (ja) |
CN (1) | CN103658986B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI729017B (zh) * | 2016-10-25 | 2021-06-01 | 日商迪思科股份有限公司 | 保護膜形成用樹脂劑及雷射加工方法 |
KR102541722B1 (ko) * | 2016-11-18 | 2023-06-08 | 가부시기가이샤 디스코 | 보호막 형성용 수지제 및 레이저 가공 방법 |
JP6907093B2 (ja) * | 2017-10-24 | 2021-07-21 | 株式会社ディスコ | レーザー加工装置 |
JP7005281B2 (ja) * | 2017-10-31 | 2022-01-21 | 株式会社ディスコ | 被加工物の加工方法 |
CN113916414B (zh) * | 2021-09-30 | 2024-04-26 | 中国科学院重庆绿色智能技术研究院 | 一种皮革基力学传感器及其制备方法 |
CN116079251B (zh) * | 2023-01-28 | 2023-06-16 | 邢台职业技术学院 | 一种计算机硬件辅助生产装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3362887B2 (ja) * | 1992-12-10 | 2003-01-07 | 日産自動車株式会社 | ロボットおよびこれを用いた液物供給方法 |
US5885661A (en) * | 1993-11-24 | 1999-03-23 | Semiconductor Systems, Inc. | Droplet jet method for coating flat substrates with resist or similar materials |
JPH10305420A (ja) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法 |
JPH11219880A (ja) * | 1998-01-30 | 1999-08-10 | Dainippon Screen Mfg Co Ltd | 吐出ノズル及び塗布液塗布装置 |
JP2001307984A (ja) * | 2000-04-21 | 2001-11-02 | Tokyo Electron Ltd | レジスト塗布方法およびレジスト塗布装置 |
JP2004188475A (ja) * | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
KR20050032180A (ko) * | 2003-10-01 | 2005-04-07 | 동부아남반도체 주식회사 | 웨이퍼 보호용 보호필림 부착방법 및 장치 |
JP2005131540A (ja) * | 2003-10-30 | 2005-05-26 | Seiko Epson Corp | 液滴吐出装置の検査装置、液滴吐出装置の検査方法、及び液滴吐出装置 |
JP4486476B2 (ja) * | 2004-10-29 | 2010-06-23 | 東京エレクトロン株式会社 | レーザー処理装置及びレーザー処理方法 |
JP4571850B2 (ja) * | 2004-11-12 | 2010-10-27 | 東京応化工業株式会社 | レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法 |
JP4777783B2 (ja) | 2006-01-26 | 2011-09-21 | 株式会社ディスコ | レーザー加工装置 |
JP2010012508A (ja) * | 2008-07-07 | 2010-01-21 | Disco Abrasive Syst Ltd | 保護膜被覆装置及びレーザー加工装置 |
JP5324180B2 (ja) * | 2008-10-07 | 2013-10-23 | 株式会社ディスコ | レーザ加工方法およびレーザ加工装置 |
-
2012
- 2012-09-26 JP JP2012211685A patent/JP6137798B2/ja active Active
-
2013
- 2013-09-24 KR KR1020130113277A patent/KR102084269B1/ko active IP Right Grant
- 2013-09-25 CN CN201310443370.8A patent/CN103658986B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014067843A (ja) | 2014-04-17 |
CN103658986A (zh) | 2014-03-26 |
KR20140045878A (ko) | 2014-04-17 |
KR102084269B1 (ko) | 2020-03-03 |
CN103658986B (zh) | 2016-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102336955B1 (ko) | 웨이퍼의 가공 방법 | |
US9472442B2 (en) | Wafer processing method | |
KR102210945B1 (ko) | 웨이퍼의 가공 방법 | |
JP6587911B2 (ja) | ウエーハの分割方法 | |
JP6137798B2 (ja) | レーザー加工装置及び保護膜被覆方法 | |
JP5881464B2 (ja) | ウェーハのレーザー加工方法 | |
JP2007235069A (ja) | ウェーハ加工方法 | |
JP2007214457A (ja) | ウェーハ加工装置及び方法 | |
JP5604186B2 (ja) | 加工装置 | |
JP2013207170A (ja) | デバイスウェーハの分割方法 | |
JP2007235068A (ja) | ウェーハ加工方法 | |
JP2010267638A (ja) | 保護膜の被覆方法及びウエーハのレーザ加工方法 | |
JP2011224642A (ja) | 保護材およびアブレーション加工方法 | |
JP2014135348A (ja) | ウエーハの加工方法 | |
JP5637769B2 (ja) | レーザー加工装置 | |
JP6043595B2 (ja) | 切削装置 | |
JP2013118325A (ja) | ウエーハの洗浄方法 | |
JP6713214B2 (ja) | デバイスウェーハの加工方法 | |
CN111415863B (zh) | 晶片的加工方法 | |
JP2016207820A (ja) | ウエーハの加工方法 | |
JP2013021211A (ja) | ウエーハの加工方法 | |
JP6635864B2 (ja) | 加工装置 | |
JP2020009917A (ja) | 被加工物の乾燥方法及び切削装置 | |
JP7460275B2 (ja) | ウェーハの加工方法 | |
JP7450426B2 (ja) | 被加工物の加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150824 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150902 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160826 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161102 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170425 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170425 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6137798 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |