JP6447140B2 - マイクロホールアレイ及びその製造方法 - Google Patents
マイクロホールアレイ及びその製造方法 Download PDFInfo
- Publication number
- JP6447140B2 JP6447140B2 JP2015000865A JP2015000865A JP6447140B2 JP 6447140 B2 JP6447140 B2 JP 6447140B2 JP 2015000865 A JP2015000865 A JP 2015000865A JP 2015000865 A JP2015000865 A JP 2015000865A JP 6447140 B2 JP6447140 B2 JP 6447140B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- main surface
- laser
- glass plate
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
Description
2……ガラス板
2a……第1の主面
2b……第2の主面
3……貫通孔
4……テーパー部
5……円筒部分
5a……最小外接円筒
5b……最大外接円筒
10……レーザー光
11……透明液体
d1……貫通孔の孔径
d2……テーパー部の最大径
t1……ガラス板の厚み
t2……テーパー部の厚み
T……円筒度
Claims (3)
- 第1の主面及び第2の主面を有するガラス板に、前記第1の主面と前記第2の主面間を貫通する貫通孔を、レーザー照射によって複数形成するマイクロホールアレイの製造方法であって、
前記第1の主面に、前記レーザーに対して透明である液体を接触させる工程と、
前記レーザーとして、10ピコ秒以下のパルスレーザーを用い、前記液体と接触する前記第1の主面側の部分に集光させて、前記レーザーを前記第2の主面側から照射し、前記貫通孔を形成する工程とを備え、
前記液体が、少なくとも一部の水素をフッ素で置換した石油系溶剤である、マイクロホールアレイの製造方法。 - 前記レーザーの波長が、1000nm以上である、請求項1に記載のマイクロホールアレイの製造方法。
- 前記レーザーが、フェムト秒レーザーである、請求項1または2に記載のマイクロホールアレイの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015000865A JP6447140B2 (ja) | 2015-01-06 | 2015-01-06 | マイクロホールアレイ及びその製造方法 |
US15/503,492 US20170291850A1 (en) | 2015-01-06 | 2015-10-29 | Micro-hole array and method for manufacturing same |
CN201580072643.XA CN107108321B (zh) | 2015-01-06 | 2015-10-29 | 微孔阵列及其制造方法 |
PCT/JP2015/080544 WO2016111076A1 (ja) | 2015-01-06 | 2015-10-29 | マイクロホールアレイ及びその製造方法 |
TW104137387A TWI673239B (zh) | 2015-01-06 | 2015-11-12 | 微孔陣列及其製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015000865A JP6447140B2 (ja) | 2015-01-06 | 2015-01-06 | マイクロホールアレイ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016124764A JP2016124764A (ja) | 2016-07-11 |
JP6447140B2 true JP6447140B2 (ja) | 2019-01-09 |
Family
ID=56355779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015000865A Active JP6447140B2 (ja) | 2015-01-06 | 2015-01-06 | マイクロホールアレイ及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20170291850A1 (ja) |
JP (1) | JP6447140B2 (ja) |
CN (1) | CN107108321B (ja) |
TW (1) | TWI673239B (ja) |
WO (1) | WO2016111076A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018155099A1 (ja) * | 2017-02-21 | 2018-08-30 | Agc株式会社 | ガラス板およびガラス板の製造方法 |
JP2019006625A (ja) * | 2017-06-23 | 2019-01-17 | 日本電気硝子株式会社 | マイクロホールアレイの製造方法 |
US20190233321A1 (en) * | 2018-01-26 | 2019-08-01 | Corning Incorporated | Liquid-assisted laser micromachining of transparent dielectrics |
US11630265B2 (en) * | 2020-04-15 | 2023-04-18 | Google Llc | Glass fiber hole plates for 2D fiber collimators and methods for alignment and fabrication for optical switching applications |
ES2912039B2 (es) * | 2022-03-11 | 2023-04-03 | Univ Santiago Compostela | Procedimiento para fabricar canales, pocillos y/o estructuras complejas en vidrio |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001113381A (ja) * | 1999-10-21 | 2001-04-24 | Masaaki Suzuki | 透明材料の加工方法 |
JP3660294B2 (ja) * | 2000-10-26 | 2005-06-15 | 株式会社東芝 | 半導体装置の製造方法 |
JP3991682B2 (ja) * | 2001-12-28 | 2007-10-17 | 松下電器産業株式会社 | ガラスの精密孔あけ方法、光ファイバーコネクタ用フェルールの製造方法および磁気ディスクガラス基板の製造方法 |
JP3932930B2 (ja) * | 2002-02-25 | 2007-06-20 | ソニー株式会社 | レーザ加工装置およびレーザ加工方法 |
JP3917034B2 (ja) * | 2002-07-23 | 2007-05-23 | 湖北工業株式会社 | 光コネクタおよびその製造方法 |
US6990285B2 (en) * | 2003-07-31 | 2006-01-24 | Corning Incorporated | Method of making at least one hole in a transparent body and devices made by this method |
JP2007307599A (ja) * | 2006-05-20 | 2007-11-29 | Sumitomo Electric Ind Ltd | スルーホール成形体およびレーザー加工方法 |
JP4609592B2 (ja) * | 2007-12-10 | 2011-01-12 | コニカミノルタホールディングス株式会社 | 透明材料加工法及び透明材料加工装置 |
JP2009155159A (ja) * | 2007-12-26 | 2009-07-16 | Tosoh Quartz Corp | 石英ガラス板の高精度微細径穴加工方法 |
-
2015
- 2015-01-06 JP JP2015000865A patent/JP6447140B2/ja active Active
- 2015-10-29 WO PCT/JP2015/080544 patent/WO2016111076A1/ja active Application Filing
- 2015-10-29 US US15/503,492 patent/US20170291850A1/en not_active Abandoned
- 2015-10-29 CN CN201580072643.XA patent/CN107108321B/zh active Active
- 2015-11-12 TW TW104137387A patent/TWI673239B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2016124764A (ja) | 2016-07-11 |
US20170291850A1 (en) | 2017-10-12 |
TWI673239B (zh) | 2019-10-01 |
CN107108321A (zh) | 2017-08-29 |
TW201625494A (zh) | 2016-07-16 |
CN107108321B (zh) | 2020-07-07 |
WO2016111076A1 (ja) | 2016-07-14 |
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