JP3932930B2 - レーザ加工装置およびレーザ加工方法 - Google Patents

レーザ加工装置およびレーザ加工方法 Download PDF

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Publication number
JP3932930B2
JP3932930B2 JP2002047574A JP2002047574A JP3932930B2 JP 3932930 B2 JP3932930 B2 JP 3932930B2 JP 2002047574 A JP2002047574 A JP 2002047574A JP 2002047574 A JP2002047574 A JP 2002047574A JP 3932930 B2 JP3932930 B2 JP 3932930B2
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Japan
Prior art keywords
processing
liquid
laser
chamber
laser beam
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Expired - Fee Related
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JP2002047574A
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English (en)
Japanese (ja)
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JP2003245791A (ja
JP2003245791A5 (enExample
Inventor
幸成 阿蘇
良成 佐々木
清美 清井
和彦 吉田
英寿 村瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Priority to JP2002047574A priority Critical patent/JP3932930B2/ja
Publication of JP2003245791A publication Critical patent/JP2003245791A/ja
Publication of JP2003245791A5 publication Critical patent/JP2003245791A5/ja
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Publication of JP3932930B2 publication Critical patent/JP3932930B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2002047574A 2002-02-25 2002-02-25 レーザ加工装置およびレーザ加工方法 Expired - Fee Related JP3932930B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002047574A JP3932930B2 (ja) 2002-02-25 2002-02-25 レーザ加工装置およびレーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002047574A JP3932930B2 (ja) 2002-02-25 2002-02-25 レーザ加工装置およびレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2003245791A JP2003245791A (ja) 2003-09-02
JP2003245791A5 JP2003245791A5 (enExample) 2005-06-02
JP3932930B2 true JP3932930B2 (ja) 2007-06-20

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ID=28660594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002047574A Expired - Fee Related JP3932930B2 (ja) 2002-02-25 2002-02-25 レーザ加工装置およびレーザ加工方法

Country Status (1)

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JP (1) JP3932930B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2414954B (en) * 2004-06-11 2008-02-06 Exitech Ltd Process and apparatus for ablation
JP2007029973A (ja) * 2005-07-25 2007-02-08 Sony Corp レーザ加工装置とその加工方法及びデブリ回収装置とその回収方法
JP4575267B2 (ja) * 2005-10-14 2010-11-04 株式会社東芝 水中施工装置および水中施工方法
JP5389068B2 (ja) * 2011-01-26 2014-01-15 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
JP5814652B2 (ja) * 2011-06-22 2015-11-17 株式会社東芝 レーザ照射装置及びレーザ照射方法
JP6447140B2 (ja) * 2015-01-06 2019-01-09 日本電気硝子株式会社 マイクロホールアレイ及びその製造方法
JP6907093B2 (ja) * 2017-10-24 2021-07-21 株式会社ディスコ レーザー加工装置
JP6968659B2 (ja) * 2017-10-25 2021-11-17 株式会社ディスコ レーザー加工装置
JP6985102B2 (ja) * 2017-10-31 2021-12-22 株式会社ディスコ レーザー加工装置
US12041842B2 (en) 2018-07-02 2024-07-16 Jdi Design And Development G.K. Display panel patterning device
JP2020008741A (ja) * 2018-07-09 2020-01-16 株式会社Ｊｏｌｅｄ 表示パネル製造装置および表示パネル製造方法
JP2023045630A (ja) * 2021-09-22 2023-04-03 コマツ産機株式会社 レーザ加工装置およびレーザ加工方法

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Publication number Publication date
JP2003245791A (ja) 2003-09-02

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