JP5389068B2 - レーザ加工方法およびレーザ加工装置 - Google Patents
レーザ加工方法およびレーザ加工装置 Download PDFInfo
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- JP5389068B2 JP5389068B2 JP2011014343A JP2011014343A JP5389068B2 JP 5389068 B2 JP5389068 B2 JP 5389068B2 JP 2011014343 A JP2011014343 A JP 2011014343A JP 2011014343 A JP2011014343 A JP 2011014343A JP 5389068 B2 JP5389068 B2 JP 5389068B2
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- laser
- nozzle
- thin film
- processing
- laser beam
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- 238000012545 processing Methods 0.000 title claims description 96
- 238000003672 processing method Methods 0.000 title claims description 16
- 239000007788 liquid Substances 0.000 claims description 78
- 239000010409 thin film Substances 0.000 claims description 69
- 238000004140 cleaning Methods 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 44
- 230000003287 optical effect Effects 0.000 claims description 40
- 238000003754 machining Methods 0.000 claims description 16
- 239000000428 dust Substances 0.000 description 31
- 238000010248 power generation Methods 0.000 description 30
- 238000000034 method Methods 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000002679 ablation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/21—Ink jet for multi-colour printing
- B41J2/2132—Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Laser Beam Processing (AREA)
Description
実施の形態1について図面を参照して説明する。図1は、本発明に係る実施の形態1のレーザ加工装置201の加工点近傍の要部を示す概略拡大断面図であり、(a)はレーザ加工装置201の正面から見た断面図であり、(b)は(a)のG方向側面から見た断面図である。
実施の形態1のレーザ加工装置201においては、ノズル113の噴出口115の開口中心軸116に対して、レーザ光101の光軸103を洗浄液112の流れの下流側に配置する構成を示したが、実施の形態2では、ノズル113の噴出口115の開口中心軸116に対して、レーザ光101の光軸103を加工進行方向Lに直交する方向に配置した場合について示す。
11 絶縁基板(加工対象物)
12 透明電極
13 発電層
14 裏面電極
15 光電変換領域
16 スクライブライン
17 スクライブ加工痕
18 未加工部分
21 第一のスクライブ部
22 第二のスクライブ部
23 第三のスクライブ部
101 レーザ光
102 レンズ
103 光軸
104 入射窓
111 配管
112 洗浄液
113 ノズル
114 パッキング
115 噴出口
116 開口中心軸
121 気泡
122 粉塵
131 液流制御部
141 レーザ光源
142 加工ヘッド
201、212 レーザ加工装置
Claims (1)
- レーザ光の光軸を絶縁基板上に形成された薄膜に対し概略垂直に配置し、前記レーザ光の照射点の領域より大きい液柱状の洗浄液をノズルから噴射して前記薄膜の分断加工を薄膜側より行うレーザ加工方法において、
前記レーザ光の光軸が、前記ノズルの開口中心に対して、加工進行方向と反対側の位置、あるいは進行方向に直交した方向の位置に偏心させることを特徴とするレーザ加工方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011014343A JP5389068B2 (ja) | 2011-01-26 | 2011-01-26 | レーザ加工方法およびレーザ加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011014343A JP5389068B2 (ja) | 2011-01-26 | 2011-01-26 | レーザ加工方法およびレーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012152788A JP2012152788A (ja) | 2012-08-16 |
JP5389068B2 true JP5389068B2 (ja) | 2014-01-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011014343A Active JP5389068B2 (ja) | 2011-01-26 | 2011-01-26 | レーザ加工方法およびレーザ加工装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5389068B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7201343B2 (ja) * | 2018-06-19 | 2023-01-10 | 株式会社ディスコ | レーザー加工装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0829429B2 (ja) * | 1993-06-28 | 1996-03-27 | 技術研究組合医療福祉機器研究所 | レーザ照射装置 |
JPH07204877A (ja) * | 1994-01-19 | 1995-08-08 | Amada Co Ltd | レーザ加工方法およびその装置 |
JP3287112B2 (ja) * | 1994-05-18 | 2002-05-27 | 松下電器産業株式会社 | レーザ加工機のレーザビームノズル装置 |
JP3932930B2 (ja) * | 2002-02-25 | 2007-06-20 | ソニー株式会社 | レーザ加工装置およびレーザ加工方法 |
JP4037152B2 (ja) * | 2002-04-11 | 2008-01-23 | 三菱電機株式会社 | レーザ加工装置のレーザ加工ヘッド |
JP4043923B2 (ja) * | 2002-11-22 | 2008-02-06 | 東京エレクトロン株式会社 | 加工装置 |
JP2007029973A (ja) * | 2005-07-25 | 2007-02-08 | Sony Corp | レーザ加工装置とその加工方法及びデブリ回収装置とその回収方法 |
JP5202876B2 (ja) * | 2007-06-06 | 2013-06-05 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
CN102470481B (zh) * | 2009-07-10 | 2015-04-29 | 三菱电机株式会社 | 激光加工方法及其装置 |
-
2011
- 2011-01-26 JP JP2011014343A patent/JP5389068B2/ja active Active
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JP2012152788A (ja) | 2012-08-16 |
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