JP5611455B2 - レーザ加工装置及び方法 - Google Patents
レーザ加工装置及び方法 Download PDFInfo
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- JP5611455B2 JP5611455B2 JP2013511853A JP2013511853A JP5611455B2 JP 5611455 B2 JP5611455 B2 JP 5611455B2 JP 2013511853 A JP2013511853 A JP 2013511853A JP 2013511853 A JP2013511853 A JP 2013511853A JP 5611455 B2 JP5611455 B2 JP 5611455B2
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- 238000000034 method Methods 0.000 title description 25
- 238000006243 chemical reaction Methods 0.000 claims description 94
- 239000010409 thin film Substances 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 31
- 238000007493 shaping process Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims 2
- 238000010096 film blowing Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 50
- 229910052710 silicon Inorganic materials 0.000 description 50
- 239000010703 silicon Substances 0.000 description 50
- 238000004880 explosion Methods 0.000 description 17
- 239000010408 film Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 238000010248 power generation Methods 0.000 description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 10
- 238000009834 vaporization Methods 0.000 description 6
- 230000008016 vaporization Effects 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 230000031700 light absorption Effects 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Laser Beam Processing (AREA)
Description
まず、長方形ビームでスクライブを行った集積型タンデム型薄膜シリコン太陽電池の課題について図面に基づいて説明する。図8は、集積型薄膜シリコン太陽電池の模式的な断面図であり、ここでは透明絶縁基板11側を下側、裏面電極層14(141、142、143、・・・)側を上側とする。また、この例においては、太陽光は透明絶縁基板11側から照射される。スクライブ溝201(2011、2012、・・・)は、透明電極層12(121、122、123、・・・)を絶縁分離しており、紙面に直交する方向に直線状に延びている。スクライブ溝202(2021、2022、・・・)も、紙面に直交する方向に直線状に延びており、スクライブ溝201とは交差しない。スクライブ溝203(2031、2032、・・・)も紙面に直交する方向に直線状に延びており、スクライブ溝202と交差していない。
図7は、実施の形態2のレーザスクライブ法に用いるレーザビームのビーム形状の一例を示す図である。図7においてビーム形状はレーザスクライブの進行方向の前後に応力集中領域100(最大応力点)が発生する形状をしている。その他の構成及び動作については実施の形態1と同様であり、対応する部分には図1と同一の符号を付して説明を省略する。
12 透明電極層
13 光電変換ユニット層
14 裏面電極層
21 非晶質系光電変換ユニット層
22 結晶質系光電変換ユニット層
100 応力集中領域
201、202、203、610 スクライブ溝
301 幅の狭いテーパ
302 幅の広いテーパ
401 スクライブ溝底面
501、502、503、504 エリア
601 レーザ源及び制御系
602 レーザビーム
603 ビーム形状整形光学系
604 加工点
605 Xステージ
606 Yステージ
609 基板
Claims (8)
- レーザ源から発せられたレーザビームを、透明基板上に積層された光電変換ユニット層を含む薄膜に対して前記透明基板側から照射して前記光電変換ユニット層を吹き飛ばして前記薄膜の分断加工を行うレーザ加工装置であって、
前記レーザビームの断面形状を整形するビーム形状整形光学系を備え、
前記ビーム形状整形光学系は、前記レーザビームを、前記分断加工の進行方向前方に突出し、前記レーザビームの前記進行方向に垂直な方向の幅よりも狭い幅を有する第1の突起部を備え、前記進行方向に垂直な方向の幅が前記進行方向の幅よりも短い幅を有する形状に整形することを特徴とするレーザ加工装置。 - 前記薄膜に照射される前記レーザビームの断面形状は、前記第1の突起部を2以上備える形状であることを特徴とする請求項1記載のレーザ加工装置。
- 前記薄膜に照射される前記レーザビームの輪郭は、尖点の無い閉曲線であることを特徴とする請求項1記載のレーザ加工装置。
- 前記薄膜に照射される前記レーザビームの断面形状は、前記分断加工の進行方向後方に突出する第2の突起部を有することを特徴とする請求項1記載のレーザ加工装置。
- 前記薄膜に照射される前記レーザビームの断面形状は、前記分断加工の前後方向に対称であることを特徴とする請求項4記載のレーザ加工装置。
- 前記薄膜に照射される前記レーザビームの断面形状は、前記分断加工の幅方向に対称であることを特徴とする請求項1記載のレーザ加工装置。
- 前記薄膜に照射される前記レーザビームのビーム強度分布は、均一であることを特徴とする請求項1から6のいずれか1項記載のレーザ加工装置。
- レーザ源から発せられたレーザビームを、透明基板上に積層された光電変換ユニット層を含む薄膜へ照射して該薄膜を分断するレーザ加工方法であって、
前記薄膜に照射される前記レーザビームの断面形状を、前記分断の進行方向前方に突出し、前記レーザビームの前記進行方向に垂直な方向の幅よりも狭い幅を有する突起部を備え、前記進行方向に垂直な方向の幅が前記進行方向の幅よりも短い幅を有する形状に整形するビーム整形工程と、
前記ビーム整形工程において整形されたレーザビームを前記透明基板側から前記薄膜に照射し、前記突起部を前記進行方向前方として前記薄膜を走査して、前記光電変換ユニット層を吹き飛ばして前記薄膜を分断する工程とを有することを特徴とするレーザ加工方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2011/060432 WO2012147200A1 (ja) | 2011-04-28 | 2011-04-28 | レーザ加工装置及び方法 |
Publications (2)
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JPWO2012147200A1 JPWO2012147200A1 (ja) | 2014-07-28 |
JP5611455B2 true JP5611455B2 (ja) | 2014-10-22 |
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WO (1) | WO2012147200A1 (ja) |
Families Citing this family (2)
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DE102019006095A1 (de) * | 2019-08-29 | 2021-03-04 | Azur Space Solar Power Gmbh | Vereinzelungsverfahren zur Vereinzelung einer mehrere Solarzellenstapel umfasssenden Halbleiterscheibe |
DE102020206670A1 (de) * | 2020-05-28 | 2021-12-02 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserschneidverfahren und Laserschneidanlage |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033495A (ja) * | 2000-07-13 | 2002-01-31 | Mitsubishi Heavy Ind Ltd | 光起電力装置の製造方法 |
JP2002043605A (ja) * | 2000-07-28 | 2002-02-08 | Mitsubishi Heavy Ind Ltd | レーザーエッチング方法 |
JP2004306082A (ja) * | 2003-04-07 | 2004-11-04 | Tekunii:Kk | 金属膜用レーザートリミング装置及びその方法 |
JP2007184421A (ja) * | 2006-01-06 | 2007-07-19 | Mitsubishi Heavy Ind Ltd | 太陽電池モジュールの製造方法及び太陽電池モジュール |
WO2011027533A1 (ja) * | 2009-09-04 | 2011-03-10 | 株式会社アルバック | 薄膜太陽電池の製造方法及びその製造装置 |
-
2011
- 2011-04-28 WO PCT/JP2011/060432 patent/WO2012147200A1/ja active Application Filing
- 2011-04-28 JP JP2013511853A patent/JP5611455B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033495A (ja) * | 2000-07-13 | 2002-01-31 | Mitsubishi Heavy Ind Ltd | 光起電力装置の製造方法 |
JP2002043605A (ja) * | 2000-07-28 | 2002-02-08 | Mitsubishi Heavy Ind Ltd | レーザーエッチング方法 |
JP2004306082A (ja) * | 2003-04-07 | 2004-11-04 | Tekunii:Kk | 金属膜用レーザートリミング装置及びその方法 |
JP2007184421A (ja) * | 2006-01-06 | 2007-07-19 | Mitsubishi Heavy Ind Ltd | 太陽電池モジュールの製造方法及び太陽電池モジュール |
WO2011027533A1 (ja) * | 2009-09-04 | 2011-03-10 | 株式会社アルバック | 薄膜太陽電池の製造方法及びその製造装置 |
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JPWO2012147200A1 (ja) | 2014-07-28 |
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