JP2008294014A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2008294014A JP2008294014A JP2007134927A JP2007134927A JP2008294014A JP 2008294014 A JP2008294014 A JP 2008294014A JP 2007134927 A JP2007134927 A JP 2007134927A JP 2007134927 A JP2007134927 A JP 2007134927A JP 2008294014 A JP2008294014 A JP 2008294014A
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Abstract
【解決手段】半導体パッケージ1aとプリント配線板100aがボール電極10aにより接続され、半導体パッケージ1bとプリント配線板100bがボール電極10bにより接続され、プリント配線板100a、100bがボール電極20bにより接続される。ボール電極10aは電極パッド30aを介してプリント配線板100aに接続され、電極パッド30aは、プリント配線板100aの面方向に凸部を有する。ボール電極10bは電極パッド30bを介して第2プリント配線板100bに接続され、電極パッド30bはプリント配線板100bの面方向に凸部を有する。2つの電極パッド30a、30bを透視したときの透視陰影像が、各電極パッド30a、30bの凸部において少なくとも一部が重ならないように配設する。
【選択図】図1
Description
1b 第2の半導体パッケージ
10a、10b、20a、20b ボール電極
30a、30b、40a、40b、50a、60a 電極パッド
100a 第1のプリント配線板
100b 第2のプリント配線板
100c 第3のプリント配線板
Claims (4)
- それぞれ半導体パッケージを実装した第1及び第2のプリント配線板を互に積層した積層構造を有し、前記第1のプリント配線板と前記半導体パッケージとが、前記第1のプリント配線板の電極パッドに接合されたボール電極によって接続され、前記第2のプリント配線板と前記半導体パッケージとが、前記第2のプリント配線板の電極パッドに接合されたボール電極によって接続された半導体装置において、
前記第1のプリント配線板の前記電極パッドは前記第1のプリント配線板の面方向に凸部を有し、
前記第2のプリント配線板の前記電極パッドは前記第2のプリント配線板の面方向に凸部を有し、
前記第1のプリント配線板の前記電極パッドの前記凸部の透視陰影像と、前記第2のプリント配線板の前記電極パッドの前記凸部の透視陰影像とが、少なくとも一部において重ならないように配置されていることを特徴とする半導体装置。 - 第1のプリント配線板と、半導体パッケージを実装した第2のプリント配線板とを積層した積層構造を有し、前記第1のプリント配線板と前記第2のプリント配線板とが、前記第1のプリント配線板の電極パッドに接合されたボール電極によって接続され、前記第2のプリント配線板と前記半導体パッケージとが、前記第2のプリント配線板の電極パッドに接合されたボール電極によって接続された半導体装置において、
前記第1のプリント配線板の前記電極パッドは前記第1のプリント配線板の面方向に凸部を有し、
前記第2のプリント配線板の前記電極パッドは前記第2のプリント配線板の面方向に凸部を有し、
前記第1のプリント配線板の前記電極パッドの前記凸部の透視陰影像と、前記第2のプリント配線板の前記電極パッドの前記凸部の透視陰影像とが、少なくとも一部において重ならないように配置されていることを特徴とする半導体装置。 - 第1及び第2のプリント配線板を互に積層した積層構造を有し、前記第1のプリント配線板と前記第2のプリント配線板とが、前記第1のプリント配線板の表面側の電極パッドに接続されるボール電極によって接続され、前記第1のプリント配線板の裏面側の電極パッドにボール電極が接続される半導体装置において、
前記第1のプリント配線板の表面側及び裏面側のそれぞれの前記電極パッドは前記第1のプリント配線板の面方向に凸部を有し、
前記第1のプリント配線板の表面側の前記電極パッドの前記凸部の透視陰影像と、前記第1のプリント配線板の裏面側の前記電極パッドの前記凸部の透視陰影像とが、少なくとも一部において重ならないように配置されていることを特徴とする半導体装置。 - 半導体パッケージをプリント配線板に実装した実装構造を有し、前記プリント配線板と前記半導体パッケージとが、前記プリント配線板の電極パッド及び前記半導体パッケージの電極パッドに接合されたボール電極によって接続された半導体装置において、
前記プリント配線板の前記電極パッドは前記プリント配線板の面方向に凸部を有し、
前記半導体パッケージの前記電極パッドは前記半導体パッケージの面方向に凸部を有し、
前記プリント配線板の前記電極パッドの前記凸部の透視陰影像と、前記半導体パッケージの前記電極パッドの前記凸部の透視陰影像とが、少なくとも一部において重ならないように配置されていることを特徴とする半導体装置。
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US12/530,708 US7906733B2 (en) | 2007-05-22 | 2008-05-21 | Electronic circuit device |
CN2008800131157A CN101663925B (zh) | 2007-05-22 | 2008-05-21 | 电子电路装置 |
EP08764770A EP2153706A4 (en) | 2007-05-22 | 2008-05-21 | ELECTRONIC SWITCHING DEVICE |
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CN101663925A (zh) | 2010-03-03 |
WO2008143359A1 (en) | 2008-11-27 |
KR101065877B1 (ko) | 2011-09-19 |
US20100084177A1 (en) | 2010-04-08 |
JP5207659B2 (ja) | 2013-06-12 |
CN101663925B (zh) | 2011-11-16 |
KR20100007998A (ko) | 2010-01-22 |
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EP2153706A4 (en) | 2013-01-23 |
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