JP2009135403A - 半導体パッケージ用基板およびこれを有する半導体パッケージ - Google Patents
半導体パッケージ用基板およびこれを有する半導体パッケージ Download PDFInfo
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- JP2009135403A JP2009135403A JP2008113180A JP2008113180A JP2009135403A JP 2009135403 A JP2009135403 A JP 2009135403A JP 2008113180 A JP2008113180 A JP 2008113180A JP 2008113180 A JP2008113180 A JP 2008113180A JP 2009135403 A JP2009135403 A JP 2009135403A
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- connection pad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
【解決手段】 半導体パッケージ用基板は、基板本体、前記基板本体の表面に指定された間隔で並列配置された複数個の接続パッドを含む接続パッドグループ、前記接続パッドグループの両側にそれぞれ配置されたダミー接続パッド、および、前記基板ボディーを覆って、前記ダミー接続パッドと前記接続パッドグループとを露出させる開口を有するソルダレジストパターンを含む。バンプを有する半導体チップを基板に形成された接続パッドに配置されたソルダにバンピングする時に、各ソルダの体積が互いに相違することによって発生するバンピング不良を、防止することが可能である。
【選択図】 図1
Description
本発明による半導体パッケージは、基板本体、前記基板本体の表面に指定された間隔で複数個が並列配置された接続パッドを含む接続パッドグループ、前記接続パッドと隣接するように配置されたダミー接続パッド、および前記ダミー接続パッドと前記接続パッドグループとを露出させる開口を有するソルダレジストパターンを含む基板、前記各接続パッドに配置されたソルダパターン、前記各ダミー接続パッドに配置されたダミーソルダパターン、ならびに、前記ソルダパターンと電気的に接続するバンプを有する半導体チップを含む。
前記接続パッドおよび前記ダミー接続パッドは、実質的に同一のサイズを有する。
図3を参照すれば、半導体パッケージ300は基板100および半導体チップ200を含む。
110 基板本体
112 基板本体第1面
114 基板本体第2面
120 接続パッドグループ
122 接続パッド
122a 最外郭接続パッド
125 ソルダパターン
130 ダミー接続パッド
135 ダミーソルダパターン
140 ソルダレジストパターン
142,142a,142b 開口
200 半導体チップ
210 半導体チップ本体
212 半導体チップ本体上面
214 半導体チップ本体下面
220 ボンディングパッド
230 バンプ
300 半導体パッケージ
Claims (11)
- 基板本体、
前記基板本体の表面に指定された間隔で並列配置された複数個の接続パッドを含む接続パッドグループ、
前記接続パッドグループの両側にそれぞれ配置されたダミー接続パッド、および
前記基板本体を覆って、前記ダミー接続パッドと前記接続パッドグループとを露出させる開口を有するソルダレジストパターンを含む半導体パッケージ用基板。 - 前記接続パッドにはソルダパターンが配置され、前記ダミー接続パッド上にはダミーソルダパターンが配置されることを特徴とする請求項1に記載の半導体パッケージ用基板。
- 前記ソルダパターンは均一な第1の体積を有し、前記ダミーソルダパターンは第1の体積とは異なる第2の体積を有することを特徴とする請求項2に記載の半導体パッケージ用基板。
- 隣接した前記接続パッドおよび前記接続パッドと隣接するように配置されたダミー接続パッドは、同一の間隔で離隔されることを特徴とする請求項1に記載の半導体パッケージ用基板。
- 前記ダミー接続パッドおよび前記接続パッドは、実質的に同一のサイズを有することを特徴とする請求項1に記載の半導体パッケージ用基板。
- 基板本体、前記基板本体の表面に指定された間隔で複数個が並列配置された接続パッドを含む接続パッドグループ、前記接続パッドと隣接するように配置されたダミー接続パッド、および前記ダミー接続パッドと前記接続パッドグループとを露出させる開口を有するソルダレジストパターンを含む基板、
前記各接続パッドに配置されたソルダパターン、
前記各ダミー接続パッドに配置されたダミーソルダパターン、ならびに
前記ソルダパターンと電気的に接続するバンプを有する半導体チップを含む半導体パッケージ。 - 隣接した前記接続パッドおよび前記接続パッドと隣接した前記ダミー接続パッドは、同一の間隔で配置されることを特徴とする請求項6に記載の半導体パッケージ。
- 前記隣接した前記接続パッドおよび前記接続パッドと隣接した前記ダミー接続パッドは、互いに異なる間隔で配置されることを特徴とする請求項6に記載の半導体パッケージ。
- 前記各ソルダパターンは第1の体積を有し、前記各ダミーソルダパターンは第2の体積を有することを特徴とする請求項6に記載の半導体パッケージ。
- 前記各ソルダパターンおよび前記各ダミーソルダパターンは、同一の体積を有することを特徴とする請求項6に記載の半導体パッケージ。
- 前記接続パッドおよび前記ダミー接続パッドは、実質的に同一のサイズを有することを特徴とする請求項6に記載の半導体パッケージ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070123766A KR100924552B1 (ko) | 2007-11-30 | 2007-11-30 | 반도체 패키지용 기판 및 이를 갖는 반도체 패키지 |
Publications (1)
Publication Number | Publication Date |
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JP2009135403A true JP2009135403A (ja) | 2009-06-18 |
Family
ID=40674908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008113180A Pending JP2009135403A (ja) | 2007-11-30 | 2008-04-23 | 半導体パッケージ用基板およびこれを有する半導体パッケージ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8581397B2 (ja) |
JP (1) | JP2009135403A (ja) |
KR (1) | KR100924552B1 (ja) |
CN (1) | CN101447471B (ja) |
TW (1) | TWI353049B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5264585B2 (ja) * | 2009-03-24 | 2013-08-14 | パナソニック株式会社 | 電子部品接合方法および電子部品 |
US8546925B2 (en) * | 2011-09-28 | 2013-10-01 | Texas Instruments Incorporated | Synchronous buck converter having coplanar array of contact bumps of equal volume |
CN103931063B (zh) * | 2011-11-10 | 2017-04-19 | 西铁城时计株式会社 | 光集成设备 |
JP6470320B2 (ja) * | 2015-02-04 | 2019-02-13 | オリンパス株式会社 | 半導体装置 |
CN105486333B (zh) * | 2015-11-19 | 2018-08-24 | 业成光电(深圳)有限公司 | 改善窄线距接合垫压合错位之感测器结构 |
US9640459B1 (en) * | 2016-01-04 | 2017-05-02 | Infineon Technologies Ag | Semiconductor device including a solder barrier |
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JPH10190203A (ja) * | 1996-12-24 | 1998-07-21 | Ibiden Co Ltd | プリント配線板 |
JP2000077562A (ja) * | 1998-08-31 | 2000-03-14 | Kyocera Corp | 半導体素子搭載用配線基板およびその実装構造 |
JP2002134559A (ja) * | 2000-10-26 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法及び電子部品実装体 |
JP2004221371A (ja) * | 2003-01-16 | 2004-08-05 | Seiko Epson Corp | 配線基板、半導体装置、半導体モジュール、電子機器、配線基板の設計方法、半導体装置の製造方法および半導体モジュールの製造方法 |
JP2006049477A (ja) * | 2004-08-03 | 2006-02-16 | Renesas Technology Corp | 半導体装置の製造方法 |
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US7004644B1 (en) | 1999-06-29 | 2006-02-28 | Finisar Corporation | Hermetic chip-scale package for photonic devices |
KR20020042033A (ko) * | 2000-11-29 | 2002-06-05 | 윤종용 | 솔더 범프를 포함하는 반도체 소자 및 그 형성방법 |
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US7070207B2 (en) | 2003-04-22 | 2006-07-04 | Ibiden Co., Ltd. | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication |
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2007
- 2007-11-30 KR KR1020070123766A patent/KR100924552B1/ko not_active IP Right Cessation
-
2008
- 2008-03-28 TW TW097111222A patent/TWI353049B/zh not_active IP Right Cessation
- 2008-03-31 US US12/059,141 patent/US8581397B2/en active Active
- 2008-04-23 JP JP2008113180A patent/JP2009135403A/ja active Pending
- 2008-09-17 CN CN200810212973.6A patent/CN101447471B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10190203A (ja) * | 1996-12-24 | 1998-07-21 | Ibiden Co Ltd | プリント配線板 |
JP2000077562A (ja) * | 1998-08-31 | 2000-03-14 | Kyocera Corp | 半導体素子搭載用配線基板およびその実装構造 |
JP2002134559A (ja) * | 2000-10-26 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法及び電子部品実装体 |
JP2004221371A (ja) * | 2003-01-16 | 2004-08-05 | Seiko Epson Corp | 配線基板、半導体装置、半導体モジュール、電子機器、配線基板の設計方法、半導体装置の製造方法および半導体モジュールの製造方法 |
JP2006049477A (ja) * | 2004-08-03 | 2006-02-16 | Renesas Technology Corp | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100924552B1 (ko) | 2009-11-02 |
TWI353049B (en) | 2011-11-21 |
CN101447471A (zh) | 2009-06-03 |
US20090140422A1 (en) | 2009-06-04 |
US8581397B2 (en) | 2013-11-12 |
CN101447471B (zh) | 2014-06-11 |
KR20090056560A (ko) | 2009-06-03 |
TW200924142A (en) | 2009-06-01 |
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