JP2006053266A - 光半導体モジュールとそれを用いた半導体装置 - Google Patents
光半導体モジュールとそれを用いた半導体装置 Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- Optical Couplings Of Light Guides (AREA)
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- Light Receiving Elements (AREA)
Abstract
【解決手段】ガイド2は、光伝送路の位置決め部4と、この位置決め部4に配置される光伝送路の一端面が露出する光半導体搭載面7と、光半導体搭載面7に形成された配線層8とを有する。光半導体素子9は、その発光面または受光面が光伝送路の一端面と対向するようにガイド2の光半導体搭載面7に搭載され、かつ配線層8と電気的に接続される。また、光半導体素子9を駆動する駆動用半導体素子11は、光半導体素子9と隣接配置されて光半導体モジュール1に内蔵される。
【選択図】図1
Description
Claims (5)
- 光伝送路の位置決め部と、前記位置決め部に配置される光伝送路の一端面が露出する光半導体搭載面と、前記光半導体搭載面のみに形成された配線層とを有するガイドと、
前記光伝送路の一端面と発光面または受光面が対向するように、前記ガイドの前記光半導体搭載面上に搭載され、かつ前記配線層と電気的に接続された光半導体素子と
を具備することを特徴とする光半導体モジュール。 - 光伝送路の位置決め部と、前記位置決め部に配置される光伝送路の一端面が露出する光半導体搭載面と、前記光半導体搭載面、前記光半導体搭載面と対向する面、およびこれら両面間を接続するスルーホールに形成された配線層とを有するガイドと、
前記光伝送路の一端面と発光面または受光面が対向するように、前記ガイドの前記光半導体搭載面上に搭載され、かつ前記配線層と電気的に接続された光半導体素子と
を具備することを特徴とする光半導体モジュール。 - 請求項1または請求項2記載の光半導体モジュールにおいて、
さらに、前記ガイドの前記光半導体搭載面上に搭載され、かつ前記配線層と電気的に接続された、前記光半導体素子を駆動する駆動用半導体素子を具備することを特徴とする光半導体モジュール。 - 光伝送路を位置決めする複数の貫通孔と、前記貫通孔内に挿入配置される光伝送路の一端面が露出する光半導体搭載面とを有するガイドと、
前記光伝送路の一端面と発光面または受光面が対向するように、前記ガイドの前記光半導体搭載面上に搭載された光半導体素子とを具備し、
前記複数の貫通孔は、隣接する貫通孔間が連通していることを特徴とする光半導体モジュール。 - 請求項1ないし請求項4のいずれか1項記載の光半導体モジュールと、
前記光半導体モジュールが搭載され、かつ前記光半導体モジュールと接続された信号配線を有する基板と、
前記基板上に搭載され、かつ前記基板の信号配線と接続された信号処理用半導体素子と
を具備することを特徴とする半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004233749A JP2006053266A (ja) | 2004-08-10 | 2004-08-10 | 光半導体モジュールとそれを用いた半導体装置 |
TW094126236A TWI281050B (en) | 2004-08-10 | 2005-08-02 | Optical semiconductor module and semiconductor apparatus using the same incident surface |
CNB2005100877813A CN100426540C (zh) | 2004-08-10 | 2005-08-08 | 光半导体模块及采用其的半导体器件 |
KR1020050072643A KR20060050316A (ko) | 2004-08-10 | 2005-08-09 | 광반도체 모듈과 그것을 이용한 반도체 장치 |
US11/200,045 US7438481B2 (en) | 2004-08-10 | 2005-08-10 | Optical semiconductor module and semiconductor device including the same |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004233749A JP2006053266A (ja) | 2004-08-10 | 2004-08-10 | 光半導体モジュールとそれを用いた半導体装置 |
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JP2006053266A true JP2006053266A (ja) | 2006-02-23 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004233749A Pending JP2006053266A (ja) | 2004-08-10 | 2004-08-10 | 光半導体モジュールとそれを用いた半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7438481B2 (ja) |
JP (1) | JP2006053266A (ja) |
KR (1) | KR20060050316A (ja) |
CN (1) | CN100426540C (ja) |
TW (1) | TWI281050B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7783141B2 (en) | 2007-04-04 | 2010-08-24 | Ibiden Co., Ltd. | Substrate for mounting IC chip and device for optical communication |
JP2013054213A (ja) * | 2011-09-05 | 2013-03-21 | Dainippon Printing Co Ltd | 貫通電極を備えた光伝送路固定部材の製造方法 |
JP2013171208A (ja) * | 2012-02-21 | 2013-09-02 | Fujitsu Ltd | 光コネクタ、光接続構造、及び光コネクタの製造方法 |
US8608388B2 (en) | 2009-04-27 | 2013-12-17 | Sharp Kabushiki Kaisha | Semiconductor device and connector |
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JP2007003906A (ja) * | 2005-06-24 | 2007-01-11 | Toshiba Corp | 光伝送路保持部材と光モジュール |
JP4768384B2 (ja) * | 2005-09-29 | 2011-09-07 | 株式会社東芝 | 光伝送路保持部材及び光モジュール |
KR100810665B1 (ko) * | 2007-03-30 | 2008-03-07 | 전자부품연구원 | 광전변환모듈 및 그 제조방법 |
KR100924552B1 (ko) | 2007-11-30 | 2009-11-02 | 주식회사 하이닉스반도체 | 반도체 패키지용 기판 및 이를 갖는 반도체 패키지 |
JP5610156B2 (ja) * | 2011-01-31 | 2014-10-22 | 日立金属株式会社 | 光電変換モジュール及び光電変換モジュールの製造方法 |
US9341791B2 (en) * | 2011-04-07 | 2016-05-17 | Sony Corporation | Optical module, manufacturing method of optical module and optical communication device |
US8888383B2 (en) | 2011-05-03 | 2014-11-18 | Avego Technologies General Ip (Singapore) Pte. Ltd. | Active optical cable (AOC) connector having a molded plastic leadframe, an AOC that incorporates the AOC connector, and a method of using an AOC |
US20130004127A1 (en) * | 2011-06-28 | 2013-01-03 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Active optical cable (aoc) having a plastic optical port that attaches to an end of an optical fiber cable of the aoc, and a method of assembling the aoc |
US8948197B2 (en) * | 2011-09-28 | 2015-02-03 | Cosemi Technologies, Inc. | System and method for communicating optical signals via communication cable medium |
US11177855B2 (en) | 2020-02-21 | 2021-11-16 | Mobix Labs, Inc. | Extendable wire-based data communication cable assembly |
US11165500B2 (en) | 2020-02-21 | 2021-11-02 | Mobix Labs, Inc. | Cascadable data communication cable assembly |
US11175463B2 (en) | 2020-02-21 | 2021-11-16 | Mobix Labs, Inc. | Extendable optical-based data communication cable assembly |
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-
2004
- 2004-08-10 JP JP2004233749A patent/JP2006053266A/ja active Pending
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2005
- 2005-08-02 TW TW094126236A patent/TWI281050B/zh not_active IP Right Cessation
- 2005-08-08 CN CNB2005100877813A patent/CN100426540C/zh not_active Expired - Fee Related
- 2005-08-09 KR KR1020050072643A patent/KR20060050316A/ko not_active Application Discontinuation
- 2005-08-10 US US11/200,045 patent/US7438481B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7783141B2 (en) | 2007-04-04 | 2010-08-24 | Ibiden Co., Ltd. | Substrate for mounting IC chip and device for optical communication |
US8608388B2 (en) | 2009-04-27 | 2013-12-17 | Sharp Kabushiki Kaisha | Semiconductor device and connector |
JP2013054213A (ja) * | 2011-09-05 | 2013-03-21 | Dainippon Printing Co Ltd | 貫通電極を備えた光伝送路固定部材の製造方法 |
JP2013171208A (ja) * | 2012-02-21 | 2013-09-02 | Fujitsu Ltd | 光コネクタ、光接続構造、及び光コネクタの製造方法 |
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US7438481B2 (en) | 2008-10-21 |
CN100426540C (zh) | 2008-10-15 |
TW200619711A (en) | 2006-06-16 |
TWI281050B (en) | 2007-05-11 |
KR20060050316A (ko) | 2006-05-19 |
CN1734801A (zh) | 2006-02-15 |
US20060045434A1 (en) | 2006-03-02 |
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