CN101663925B - 电子电路装置 - Google Patents

电子电路装置 Download PDF

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Publication number
CN101663925B
CN101663925B CN2008800131157A CN200880013115A CN101663925B CN 101663925 B CN101663925 B CN 101663925B CN 2008800131157 A CN2008800131157 A CN 2008800131157A CN 200880013115 A CN200880013115 A CN 200880013115A CN 101663925 B CN101663925 B CN 101663925B
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electrode pad
sphere pole
sphere
pole
circuit device
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Expired - Fee Related
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CN2008800131157A
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CN101663925A (zh
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熊仓晋
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Canon Inc
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Canon Inc
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Abstract

提供一种电子电路装置，其中，能够以高精度容易地检测电极的接合状态。所述电子电路装置具有层叠结构，在所述层叠结构中，通过接合到电极焊盘(30a、30b、40b、50a、60a)的球状电极(10a、10b、20a、20b)，以三个或更多层来层叠多个电子电路板(1a、1b、100a、100b、100c)，其中，电极焊盘被布置成使得设置在邻近层之间的一对电极焊盘的透视阴影图像部分地彼此重叠并具有非重叠区域，在该非重叠区域中，所述一对电极焊盘的透视阴影图像不重叠，从而使得该非重叠区域的透视阴影图像至少部分地不与所有其它电极焊盘的透视阴影图像重叠。

Description

电子电路装置
技术领域
本发明涉及一种电子电路装置，其具有通过以球状电极为媒介而彼此连接的半导体封装和印刷布线板以及层叠结构，在该层叠结构中，多个印刷布线板通过以球状电极为媒介而层叠在一起，所述电子电路装置能够容易地以高精度检测球状电极的连接状态。
背景技术
近些年来，可以看出电子电路装置密度增加的发展趋势，以及电子电路装置受到关注，在所述电子电路装置中，按照外围配置或阵列配置来排列多个球状电极，以连接半导体封装和印刷布线板。
然而，难以从外部以视觉确认布置在半导体封装与印刷布线板之间的球状电极的连接状态。
为此，作为确认球状电极的连接状态的方法，已知一种方法，其将包括凹陷或凸起的特征应用于球状电极将被连接到的焊盘的形状，并基于通过x射线透视(或x射线荧光检查)获得的球状电极的阴影图像(透视阴影图像)的形状来确定连接状态(见第H09-219583号特许公开的日本专利申请以及第3601714号日本专利)。
此外，还已知一种技术，其使得设置在电子电路板的下表面上的电极焊盘与设置在板的上表面的管脚图案通过以球状电极为媒介而连接的形状互相不同，以便容易地通过一次x射线探测来确认上下部件之间的连接状态(见第H09-051017号特许公开的日本专利申请)。
然而，近些年来，为了进一步增加密度，以下电子电路装置受到关注，在所述电子电路装置中，由球状电极连接的半导体封装和印刷布线板没有如现有技术那样以平面配置而被布置，而是以三层或更多层被层叠。
在这种电子电路板中，因为通过对按照层叠模式布置的球状电极的透视而获得的阴影图像以叠加的方式被显示，所以仍旧存在未解决的问题，即，无法容易地通过上述过程来确认球状电极的连接状态。
此外，在具有层叠结构的电子电路装置中，与具有平面布置的传统电子电路装置相比，难以将在电子电路装置中产生的热辐射到外部。因此，电子电路装置需要具有能够有效地向外部辐射热的层叠结构。通常，球状电极与其它部件相比导热性较小，因此，被用作良好的辐射路径。
然而，为了通过x射线探测对球状电极的连接状态进行成像，当按照嵌套(nested)方式来布置设置在不同层中的电极焊盘和球状电极时，在半导体封装或印刷布线板中产生的热需要过多地经过所述板，结果在层叠结构内部产生的热难以辐射到外部。
发明内容
针对上述问题完成了本发明，因此，本发明的一个目的在于提供一种具有以下结构的电子电路装置，在所述结构中，在层叠结构中产生的热有效地辐射，并能够通过简单的方法来检测所述层叠结构中球状电极的连接故障，在所述层叠结构中，多个半导体封装和多个印刷布线板层叠在一起。
本发明提供一种具有层叠结构的电子电路装置，在所述层叠结构中，通过接合到电极焊盘的球状电极，以三个或更多层来层叠多个电子电路板，
其中，布置电极焊盘，以使得设置在邻近层之间的一对电极焊盘的透视阴影图像部分地彼此重叠并具有非重叠区域，在该非重叠区域中，所述一对电极焊盘的透视阴影图像不会重叠，从而该非重叠区域的透视阴影图像至少部分地不会与所有其它电极焊盘的透视阴影图像重叠。
在本发明中，优选的是，设置在不同的层中的电极焊盘均具有凸起，并且被布置成使得所述凸起部分地不会重叠。
此外，还优选的是，在各个层的层(或板)层叠方向，每个电极焊盘部分地与设置在相应位置的其它电极焊盘重叠，这有利于达到有效的热辐射。
通过采用所述配置，可缩短辐射路径，从而可实现有效的辐射，并可借助于透视阴影图像的形状容易地在视觉上确认球状电极在层叠结构中的连接状态。
本发明的其它特征将通过以下参照附图对示例性实施例的描述而变得清楚。
附图说明
图1是示出根据本发明实施例的电子电路装置的截面图；
图2是示出图1的电子电路装置的一部分的放大截面图；
图3A和图3B是示出图2的电极焊盘及其阴影图像的示图；
图4是示出图1的电子电路装置的一部分的放大截面图；
图5A和图5B是示出图4的电极焊盘及其阴影图像的示图；
图6是示出图1的电子电路装置的一部分的放大截面图；
图7A和图7B是示出图6的电极焊盘及其阴影图像的示图；
图8是示出图1的电子电路装置的一部分的放大截面图；
图9A和图9B是示出图8的电极焊盘及其阴影图像的示图；以及
图10是示出电极焊盘的改进形状的示例的示图。
具体实施方式
现将参照附图来描述本发明的优选实施例。
如图1所示，第一半导体封装1a和第一印刷布线板100a通过多个球状电极10a而彼此连接，第二半导体封装1b和第二印刷布线板100b通过多个球状电极10b而彼此连接。第三印刷布线板100c和第一印刷布线板100a通过以球状电极20a为媒介而层叠在一起。此外，第一印刷布线板100a和第二印刷布线板100b通过以球状电极20b为媒介而层叠在一起。也就是说，诸如半导体封装或印刷布线板的电子电路板按照多层结构被层叠在一起，各个层通过以球状电极为媒介而彼此连接。
在具有上述层叠结构的电子电路装置中，球状电极10a通过以电极焊盘30a为媒介而连接到印刷布线板100a，其中，所述电极焊盘30a布置在印刷布线板100a上，每个电极焊盘30a均具有在印刷布线板100a的表面方向的凸起。顺便一提的是，这里采用的术语“印刷布线板的表面方向”是指与印刷布线板的表面平行的方向。也就是说，意图表示电极焊盘30a沿着与印刷布线板100a的表面平行的平面所取的截面形状并不是圆的，而在圆的至少一部分中具有凸起部分。球状电极10b通过以电极焊盘30b为媒介而连接到印刷布线板100b，其中，所述电极焊盘30b布置在印刷布线板100b上，每个电极焊盘30b均具有沿着印刷布线板100b的表面方向的凸起。然后，将电极焊盘30a和电极焊盘30b布置为使得通过电极焊盘30a和电极焊盘30b的透视获得的透视阴影图像在各个电极焊盘30a和30b的凸起部分至少部分地不彼此重叠。
此外，球状电极20b通过以电极焊盘50a为媒介而连接到印刷布线板100a，其中，所述电极焊盘50a布置在印刷布线板100a上，每个电极焊盘50a均具有沿着印刷布线板100a的表面方向凸起的部分。然后，将电极焊盘30b和电极焊盘50a布置为使得通过电极焊盘30b和电极焊盘50a的透视获得的透视阴影图像在各个电极焊盘30b和50a的凸起部分至少部分地不彼此重叠。
此外，球状电极10b通过以电极焊盘40b为媒介而连接到半导体封装1b，其中，所述电极焊盘40b布置在半导体封装1b上，每个电极焊盘40b均具有沿着半导体封装1b的表面方向凸起的部分。然后，将电极焊盘30b和电极焊盘40b布置为使得通过电极焊盘30b和电极焊盘40b的透视获得的透视阴影图像在各个电极焊盘30b和40b的凸起部分至少部分地不彼此重叠。
位于印刷布线板100a的后表面上的球状电极20a通过以电极焊盘60a为媒介而连接到印刷布线板100a，所述后表面位于与布置球状电极20b的前表面侧相对的一侧，其中，所述电极焊盘60a布置在印刷布线板100a上。每个电极焊盘60a均具有沿着印刷布线板100a的表面方向凸起的部分。然后，将电极焊盘50a和电极焊盘60a布置为使得通过电极焊盘50a和电极焊盘60a的透视获得的透视阴影图像在各个电极焊盘50a和60a的凸起部分至少部分地不彼此重叠。
电极焊盘30a、30b、40a和40b具有相同的直径和相同的轴。此外，电极焊盘50a和60a具有相同的直径并共轴。
如上所述，半导体封装1a通过以球状电极10a为媒介而被安装在印刷布线板100a上，而半导体封装1b通过以球状电极10b为媒介而被安装在印刷布线板100b上。此外，印刷布线板100a和100b通过球状电极20b而彼此连接，印刷布线板100a和100c通过球状电极20a而彼此连接。
此外，球状电极10b和直接位于球状电极10b下方的球状电极10a具有相同的外径(相同的直径)和相同的中心轴(共轴)。球状电极20b和直接位于球状电极20b下方的球状电极20a具有相同的外径(相同的直径)和相同的中心轴(共轴)。利用球状电极的上述布置，容易通过球状电极来传热，这有利于热辐射，其中，在构成电子电路装置的部件中，所述球状电极的热阻较小。然而，只要不脱离本发明的精神，对球状电极的布置并没有限制。也就是说，仅需要布置在不同层的球状电极一部分彼此重叠，而其它部分彼此不重叠。
图2是示出作为图1所示的电子电路装置的一部分的区域的放大截面图，所述区域包括球状电极10b和直接位于球状电极10b下方的球状电极10a。
图3A示出沿着图2中球状电极10a连接到的电极焊盘30a的印刷布线板100a表面方向的平面形状，以及图2中球状电极10b连接到的电极焊盘30b的印刷布线板100b表面方向的平面形状。此外，图3B示出通过图2所示的球状电极10b和球状电极10a的透视获得的通过透视的阴影图像(透视阴影图像)。
在球状电极10b在电极焊盘30b的凸起部分上充分延伸的状态下，在图2的左侧的球状电极10b被接合到电极焊盘30b。另一方面，在球状电极10a没有在电极焊盘30a的凸起部分上延伸的状态下，球状电极10a被接合到电极焊盘30a。在这一状态下，通过球状电极10a和10b的透视获得阴影图像E1。在球状电极10b没有在电极焊盘30b的凸起部分上延伸的状态下，在图2的右侧的球状电极10b被接合到电极焊盘30b。另一方面，在球状电极10a没有在电极焊盘30a的凸起部分上延伸的状态下，球状电极10a被接合到电极焊盘30a。在这一状态下，通过球状电极10a和10b的透视获得阴影图像E2。
如图3A所示，球状电极10a连接到的电极焊盘30a和球状电极10b连接到的电极焊盘30b均被允许具有沿着与印刷布线板平行的平面截取泪滴形状的截面，其中凸起部分被添加到圆。为此，通过利用x射线探测设备来确定阴影图像E1和E2的形状差异，可容易地检测球状电极10a到电极焊盘30a的接合状态以及球状电极10b到电极焊盘30b的接合状态。
例如，可确定对接合状态的质量的确定，以使得当阴影图像(E1、E2)的圆形度等于或大于球状电极(10a、10b)在接合到电极焊盘(30a、30b)之前的外径的30％时，确定接合状态良好，而当阴影图像(E1、E2)的圆形度小于球状电极(10a、10b)在接合到电极焊盘(30a、30b)之前的外径的30％时，确定接合状态有缺陷。然而，可根据将使用的球状电极的材料或电子电路装置的预期用途来设置用于确定质量的准则。
图4是示出包括球状电极10b以及直接位于球状电极10b下方的球状电极20b的区域的放大截面图。
图5A示出沿着图4中球状电极20b连接到的电极焊盘50a的印刷布线板100a表面方向的平面形状，以及图4中球状电极10b连接到的电极焊盘30b的印刷布线板100b表面方向的平面形状。此外，图5B示出通过图4所示的球状电极10b和球状电极20b的透视获得的通过透视的阴影图像(透视阴影图像)。
在球状电极10b在电极焊盘30b的凸起部分上充分延伸的状态下，在图4的左侧的球状电极10b被接合到电极焊盘30b。此外，在球状电极20b在包括其凸起部分的电极焊盘50a上充分延伸的状态下，球状电极20b被接合到电极焊盘50a。在这一状态下，通过球状电极10b和20b的透视获得阴影图像E3。在球状电极10b没有在电极焊盘30b的凸起部分上延伸的状态下，在图4的右侧的球状电极10b被接合到电极焊盘30b。此外，在球状电极20b在电极焊盘50a的凸起部分上充分延伸的状态下，球状电极20b被接合到电极焊盘50a。在这一状态下，通过球状电极10b和20b的透视获得阴影图像E4。
如图5A所示，球状电极10b连接到的电极焊盘30b和球状电极20b连接到的电极焊盘50a均被允许具有泪滴形状的截面，其中，凸起部分被添加到圆。为此，通过利用x射线探测设备来确定阴影图像E3和E4的形状差异，可容易地检测球状电极10b到电极焊盘30a的接合状态以及球状电极20b到电极焊盘50a的接合状态。
图6是示出包括球状电极20b以及直接位于球状电极20b下方的球状电极20a的区域的放大截面图。
图7A示出沿着图6中球状电极20b连接到的电极焊盘50a的印刷布线板100a表面方向的平面形状，以及图6中球状电极20a连接到的电极焊盘60a的印刷布线板100a表面方向的平面形状。此外，图7B示出通过图4所示的球状电极20b和球状电极20a的透视获得的通过透视的阴影图像(透视阴影图像)。
在球状电极10b在电极焊盘50a的凸起部分上充分延伸的状态下，在图6的左侧的球状电极20b被接合到电极焊盘50a。此外，在球状电极20a没有在电极焊盘60a的凸起部分上延伸的状态下，球状电极20a被接合到电极焊盘60a。在这一状态下，通过球状电极20b和20a的透视获得阴影图像E5。在球状电极20b没有在电极焊盘50a的凸起部分上延伸的状态下，在图6的右侧的球状电极20b被接合到电极焊盘50a。此外，在球状电极20a没有在电极焊盘60a的凸起部分上延伸的状态下，球状电极20a被接合到电极焊盘60a。在这一状态下，通过球状电极20b和20a的透视获得阴影图像E6。
如图7A所示，球状电极20b连接到的电极焊盘50a和球状电极20a连接到的电极焊盘60a均被允许具有泪滴形状的截面(其中，凸起部分被添加到圆)。为此，通过利用x射线探测设备来确定阴影图像E5和E6的形状差异，可容易地检测球状电极20b到电极焊盘50a的接合状态以及球状电极20a到电极焊盘60a的接合状态。
图8是示出在半导体封装1b被安装到印刷布线板100b的结构中包括球状电极10b的区域的放大截面图。
图9A示出沿着图8中球状电极10b的上部连接到的电极焊盘40b的印刷布线板100b表面方向的平面形状，以及图8中球状电极10b的下部连接到的电极焊盘30b的印刷布线板100b表面方向的平面形状。此外，图9B示出通过球状电极10b的透视获得的通过透视的阴影图像(透视阴影图像)。
在球状电极10b没有在电极焊盘40b的凸起部分上延伸的状态下，在图8的左侧的球状电极10b被接合到电极焊盘40b。此外，在球状电极10b在电极焊盘30b的凸起部分上充分延伸的状态下，球状电极10b被接合到电极焊盘30b。在这一状态下，通过球状电极10b的透视获得阴影图像E7。在球状电极10b没有在电极焊盘40b的凸起部分上延伸的状态下，在图8的右侧的球状电极10b被接合到电极焊盘40b。此外，在球状电极10b没有在电极焊盘30b的凸起部分上延伸的状态下，球状电极10b被接合到电极焊盘30b。在这一状态下，通过球状电极10b的透视获得阴影图像E8。
如图9A所示，球状电极10b连接到的电极焊盘40b和电极焊盘30b均被允许具有泪滴形状的截面(其中，凸起部分被添加到圆)。为此，通过利用x射线探测设备来确定阴影图像E7和E8的形状差异，可容易地检测球状电极10b到电极焊盘30b和电极焊盘40b的接合状态。
电极焊盘的截面形状并不限于泪滴形状。例如，如图10所示，电极焊盘可具有截面形状71或72(其中，十字形状的凸起被添加到圆)、平行四边形截面形状73或74、截面形状75或76(其中，五角形凸起被添加到圆)或截面形状77或78(其中，三角形凸起被添加到圆)。此外，可使用具有矩形截面形状(如79或80所示)的电极焊盘，也不会有任何问题。
尽管参照示例性实施例描述了本发明，但是应理解：本发明并不限于所公开的示例性实施例。所附权利要求书的范围将与最宽泛的解释一致，从而包括所有的改进以及等同的结构和功能。
本申请要求2007年5月22日提交的第2007-134927号日本专利申请的优先权，所述申请在此全部引入作为参考。

Claims (3)

1.一种具有层叠结构的电子电路装置，在所述层叠结构中，通过接合到电极焊盘的球状电极，以三个或更多层来层叠多个电子电路板，
其中，电极焊盘被布置成使得设置在邻近层之间的一对电极焊盘的透视阴影图像部分地彼此重叠并具有非重叠区域，在该非重叠区域中，所述一对电极焊盘的透视阴影图像不重叠，从而使得该非重叠区域的透视阴影图像至少部分地不与所有其它电极焊盘的透视阴影图像重叠，以及被布置在不同层的球状电极一部分彼此重叠，而其它部分彼此不重叠。
2.如权利要求1所述的电子电路装置，其中，设置在不同的层中的电极焊盘均具有在电子电路板的表面方向的凸起，并且所述电极焊盘被布置成使得所述凸起部分地不重叠。
3.如权利要求1所述的电子电路装置，其中，每个电极焊盘与在各个层的相应位置设置的所有其它电极焊盘部分地重叠。
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