JP2008262547A5 - - Google Patents
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- JP2008262547A5 JP2008262547A5 JP2008062133A JP2008062133A JP2008262547A5 JP 2008262547 A5 JP2008262547 A5 JP 2008262547A5 JP 2008062133 A JP2008062133 A JP 2008062133A JP 2008062133 A JP2008062133 A JP 2008062133A JP 2008262547 A5 JP2008262547 A5 JP 2008262547A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- fiber
- semiconductor device
- substrate
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 11
- 229920005989 resin Polymers 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 10
- 239000000835 fiber Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- -1 polyparaphenylene benzobisoxazole Polymers 0.000 claims 3
- 230000001681 protective effect Effects 0.000 claims 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000004760 aramid Substances 0.000 claims 1
- 229920006231 aramid fiber Polymers 0.000 claims 1
- 229920003235 aromatic polyamide Polymers 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920001225 polyester resin Polymers 0.000 claims 1
- 239000004645 polyester resin Substances 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920013716 polyethylene resin Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920006380 polyphenylene oxide Polymers 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008062133A JP2008262547A (ja) | 2007-03-13 | 2008-03-12 | 半導体装置及びその作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007064052 | 2007-03-13 | ||
| JP2008062133A JP2008262547A (ja) | 2007-03-13 | 2008-03-12 | 半導体装置及びその作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008262547A JP2008262547A (ja) | 2008-10-30 |
| JP2008262547A5 true JP2008262547A5 (https=) | 2011-03-17 |
Family
ID=39643902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008062133A Withdrawn JP2008262547A (ja) | 2007-03-13 | 2008-03-12 | 半導体装置及びその作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7808098B2 (https=) |
| EP (2) | EP2372756A1 (https=) |
| JP (1) | JP2008262547A (https=) |
| KR (1) | KR101493295B1 (https=) |
| CN (1) | CN101266954B (https=) |
| TW (1) | TWI475748B (https=) |
Families Citing this family (60)
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| EP1976000A3 (en) * | 2007-03-26 | 2009-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5268395B2 (ja) * | 2007-03-26 | 2013-08-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI423519B (zh) * | 2007-09-04 | 2014-01-11 | Mitsubishi Electric Corp | Radio frequency identification tag |
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| JP5376961B2 (ja) * | 2008-02-01 | 2013-12-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8049292B2 (en) * | 2008-03-27 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| WO2009139282A1 (en) | 2008-05-12 | 2009-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| WO2009142310A1 (en) * | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5473413B2 (ja) | 2008-06-20 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法 |
| JP2010041045A (ja) * | 2008-07-09 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JP5358324B2 (ja) * | 2008-07-10 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 電子ペーパー |
| JP2010041040A (ja) * | 2008-07-10 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 光電変換装置および光電変換装置の製造方法 |
| KR102026604B1 (ko) | 2008-07-10 | 2019-10-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 기기 |
| JP5216716B2 (ja) | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| WO2010032602A1 (en) | 2008-09-18 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010032611A1 (en) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2010035627A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101611643B1 (ko) | 2008-10-01 | 2016-04-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5583951B2 (ja) * | 2008-11-11 | 2014-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102017099A (zh) * | 2008-12-17 | 2011-04-13 | 松下电器产业株式会社 | 贯通电极的形成方法及半导体装置 |
| KR101075753B1 (ko) * | 2008-12-22 | 2011-10-24 | 삼성전자주식회사 | 안테나 장치 및 그 제조방법 |
| JP5470054B2 (ja) | 2009-01-22 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR101677076B1 (ko) * | 2009-06-05 | 2016-11-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 광전 변환 디바이스 및 그 제조 방법 |
| CN102460722B (zh) * | 2009-06-05 | 2015-04-01 | 株式会社半导体能源研究所 | 光电转换装置及其制造方法 |
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| TWI474447B (zh) * | 2009-06-29 | 2015-02-21 | 日月光半導體製造股份有限公司 | 半導體封裝結構及其封裝方法 |
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| TWI517268B (zh) * | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
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| JP5719560B2 (ja) * | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | 端子構造の作製方法 |
| US8561909B2 (en) * | 2010-03-09 | 2013-10-22 | Skyworks Solutions, Inc. | RFID device having low-loss barium-based ceramic oxide |
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| JP2014135422A (ja) * | 2013-01-11 | 2014-07-24 | Toyota Motor Corp | 半導体装置の製造方法 |
| US10170315B2 (en) | 2013-07-17 | 2019-01-01 | Globalfoundries Inc. | Semiconductor device having local buried oxide |
| SG2013055348A (en) * | 2013-07-19 | 2015-02-27 | Kok Ann Wong | A contactless smart chip for biometric tracking |
| US9252272B2 (en) | 2013-11-18 | 2016-02-02 | Globalfoundries Inc. | FinFET semiconductor device having local buried oxide |
| CN104716136B (zh) * | 2013-12-17 | 2018-02-06 | 中芯国际集成电路制造(上海)有限公司 | 一种集成电路及其制造方法 |
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| US10229353B2 (en) | 2014-07-31 | 2019-03-12 | 3M Innovative Properties Company | RFID tag on stretchable substrate |
| CN106575369B (zh) | 2014-07-31 | 2019-09-13 | 3M创新有限公司 | 柔性基底上的rfid标签 |
| US20160379943A1 (en) * | 2015-06-25 | 2016-12-29 | Skyworks Solutions, Inc. | Method and apparatus for high performance passive-active circuit integration |
| WO2017130836A1 (ja) * | 2016-01-25 | 2017-08-03 | 東レ株式会社 | ｎ型半導体素子と相補型半導体装置およびその製造方法ならびにそれを用いた無線通信装置 |
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| JP5057703B2 (ja) | 2005-05-31 | 2012-10-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4827618B2 (ja) * | 2005-05-31 | 2011-11-30 | 株式会社半導体エネルギー研究所 | アンテナの作製方法、半導体装置の作製方法 |
| CN101189625B (zh) | 2005-05-31 | 2011-09-28 | 株式会社半导体能源研究所 | 半导体器件及其制造方法以及天线的制造方法 |
| EP1886377A4 (en) | 2005-05-31 | 2014-10-29 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT |
| JP4704959B2 (ja) * | 2005-05-31 | 2011-06-22 | 株式会社半導体エネルギー研究所 | 商品の管理方法および危険物の管理方法 |
| JP2007036216A (ja) * | 2005-06-24 | 2007-02-08 | Semiconductor Energy Lab Co Ltd | 半導体装置及び無線通信システム |
| US20090255995A1 (en) | 2005-06-24 | 2009-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and wireless communication system |
| US7727859B2 (en) | 2005-06-30 | 2010-06-01 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
| US7685706B2 (en) * | 2005-07-08 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd | Method of manufacturing a semiconductor device |
| JP2007064052A (ja) | 2005-08-30 | 2007-03-15 | Sanden Corp | ハイブリッド圧縮機 |
| US7700463B2 (en) | 2005-09-02 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| TWI431726B (zh) | 2006-06-01 | 2014-03-21 | 半導體能源研究所股份有限公司 | 非揮發性半導體記憶體裝置 |
| CN101479747B (zh) | 2006-06-26 | 2011-05-18 | 株式会社半导体能源研究所 | 包括半导体器件的纸及其制造方法 |
| EP1970951A3 (en) | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP5268395B2 (ja) | 2007-03-26 | 2013-08-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP1976000A3 (en) | 2007-03-26 | 2009-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5248240B2 (ja) | 2007-08-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2009031482A1 (en) | 2007-09-07 | 2009-03-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
-
2008
- 2008-03-03 EP EP11005367A patent/EP2372756A1/en not_active Withdrawn
- 2008-03-03 EP EP20080003900 patent/EP1970952A3/en not_active Withdrawn
- 2008-03-07 US US12/073,613 patent/US7808098B2/en not_active Expired - Fee Related
- 2008-03-10 TW TW097108347A patent/TWI475748B/zh not_active IP Right Cessation
- 2008-03-12 CN CN2008100864215A patent/CN101266954B/zh not_active Expired - Fee Related
- 2008-03-12 JP JP2008062133A patent/JP2008262547A/ja not_active Withdrawn
- 2008-03-13 KR KR20080023223A patent/KR101493295B1/ko not_active Expired - Fee Related
-
2010
- 2010-09-29 US US12/892,961 patent/US8558370B2/en not_active Expired - Fee Related
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