JP5583951B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
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- JP5583951B2 JP5583951B2 JP2009241235A JP2009241235A JP5583951B2 JP 5583951 B2 JP5583951 B2 JP 5583951B2 JP 2009241235 A JP2009241235 A JP 2009241235A JP 2009241235 A JP2009241235 A JP 2009241235A JP 5583951 B2 JP5583951 B2 JP 5583951B2
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Landscapes
- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
本実施の形態を、図1(A)〜図1(F)、図2(A)〜図2(D)、図3(A)〜図3(E)、図4(A)〜図4(D)、図5(A)〜図5(D)、図6(A)〜図6(C)、図7(A)〜図7(C)図8(A)〜図8(B)、図9、図10、図11(A)〜図11(B)を用いて説明する。
102 分離層
103 レーザビーム
104 開口部
105 配線
106 保護材
107 電極
109 半導体素子層
111 半導体回路素子
113 シート状繊維体
113a 経糸
113b 緯糸
113c バスケットホール
114 有機樹脂
115 積層構造体
120 構造体
122 レーザビーム
123 溝
125 積層構造体
129 半導体素子層
131 レーザビーム
132 レーザビーム
133 レーザビーム
134 レーザビーム
135 開口部
136 開口部
137 開口部
138 開口部
141 配線
142 配線
145 導電性樹脂
146 導電性樹脂
152a TFT
152b TFT
153a 不純物領域
153b 不純物領域
154 ゲート絶縁膜
155a ゲート電極
155b ゲート電極
156 絶縁膜
157a 配線
157b 配線
158a 配線
158b 配線
159a 不純物領域
159b 不純物領域
161 島状半導体膜
162 島状半導体膜
163a チャネル形成領域
163b チャネル形成領域
165 絶縁膜
166 絶縁膜
167 絶縁膜
171 半導体回路素子
Claims (3)
- 第1の基板上に第1の分離層を形成し、
前記第1の分離層上に第1の半導体素子層を形成し、
前記第1の半導体素子層及び前記第1の分離層に第1のレーザビームを照射することにより、前記第1の半導体素子層及び前記第1の分離層の一部を除去して開口部を形成し、
前記開口部に、前記第1の半導体素子層と電気的に接続する第1の配線を形成し、
前記第1の半導体素子層上に第1の保護材を形成し、
前記第1の保護材上に金属元素を含む第1の導電ペーストを形成し、
前記第1の導電ペーストを前記第1の保護材中に含浸させ、
前記第1の保護材中に、前記第1の配線に電気的に接続する第1の電極を形成し、
前記第1の分離層に沿って、前記第1の基板と、前記第1の保護材が形成された前記第1の半導体素子層と、を分離し、
第2の基板上に第2の分離層を形成し、
前記第2の分離層上に第2の半導体素子層を形成し、
前記第2の半導体素子層及び前記第2の分離層に第2のレーザビームを照射することにより、前記第2の半導体素子層及び前記第2の分離層の一部を除去して開口部を形成し、
前記開口部に、前記第2の半導体素子層と電気的に接続する第2の配線を形成し、
前記第2の半導体素子層上に第2の保護材を形成し、
前記第2の保護材上に金属元素を含む第2の導電ペーストを形成し、
前記第2の導電ペーストを前記第2の保護材中に含浸させ、
前記第2の保護材中に、前記第2の配線に電気的に接続する第2の電極を形成し、
前記第2の保護材上に、前記第2の電極と前記第1の配線が電気的に接続されるように、前記第1の半導体素子層を貼り合わせ、
前記第2の分離層に沿って、前記第2の基板と、前記第2の保護材が形成された前記第2の半導体素子層及び前記第1の保護材が形成された前記第1の半導体素子層と、を分離することを特徴とする半導体装置の作製方法。 - 請求項1において、
前記第1及び第2の保護材は、それぞれシート状繊維体に有機樹脂が含浸された構造体であることを特徴とする半導体装置の作製方法。 - 請求項1または請求項2において、
前記第1及び第2の導電ペーストに含まれる金属元素は、それぞれ銅、銀、ニッケル、金、白金、パラジウム、タンタル、モリブデン、チタンのいずれかを含むことを特徴とする半導体装置の作製方法。
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JP2015135839A (ja) * | 2014-01-16 | 2015-07-27 | オリンパス株式会社 | 半導体装置、固体撮像装置、および撮像装置 |
JP6603486B2 (ja) | 2014-06-27 | 2019-11-06 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
US10410892B2 (en) * | 2016-11-18 | 2019-09-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of semiconductor wafer bonding and system thereof |
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