JP2017531919A - 集積回路ダイが埋設された可撓性電子回路並びにその製造方法及び使用方法 - Google Patents
集積回路ダイが埋設された可撓性電子回路並びにその製造方法及び使用方法 Download PDFInfo
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- JP2017531919A JP2017531919A JP2017516697A JP2017516697A JP2017531919A JP 2017531919 A JP2017531919 A JP 2017531919A JP 2017516697 A JP2017516697 A JP 2017516697A JP 2017516697 A JP2017516697 A JP 2017516697A JP 2017531919 A JP2017531919 A JP 2017531919A
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Abstract
Description
本開示は、多くの異なる形態の実施形態が可能である。代表的な実施形態が図面に示され、本明細書において詳細に説明されるが、本開示は本開示の原理の具体化とみなされるべきであり、本開示の広範な態様を例示された実施形態に限定することを意図したものではないと理解されるものとする。その点で、例えば要約、概要、及び詳細な説明の欄に開示されているが、特許請求の範囲には明示的に記載されていない要素及び限定は、推測、推定その他によって、単独でも集合的にも、特許請求の範囲に包含されない。本詳細な説明の目的に関して、特に断らない限り、又は理論的に禁止されない限り:単数は複数を含み、その逆も同様である;「含む」又は「備える」又は「有する」という用語は、「限定せずに含む」を意味する。さらに、「約」、「ほぼ」、「実質的に」、「おおよそ」等の概算の用語は、本願において「丁度、付近、又は大体丁度」又は「3〜5%以内」又は「許容される製造公差内で」、又はそれらの任意の論理的組合せの意味で使用することができる。
Claims (22)
- 可撓性集積回路(IC)モジュールであって、
可撓性基板と、
可撓性基板に取り付けられた半導体ダイと、
可撓性基板に取り付けられているとともに、熱可塑性樹脂又はポリイミド接着剤、又はそれらの組合せを含む封止層と
を含み、封止層は半導体ダイを封入しているか、又は封止層に半導体ダイが挟まれている、可撓性集積回路モジュール。 - 封止層がポリイミド接着剤である、請求項1に記載の可撓性集積回路モジュール。
- ポリイミド接着剤は、アクリル系の熱伝導性かつ電気的に絶縁性のポリイミド接着剤を含む、請求項2に記載の可撓性集積回路モジュール。
- 封止層が熱可塑性樹脂である、請求項1に記載の可撓性集積回路モジュール。
- 熱可塑性樹脂は、BステージFR−4ガラス強化エポキシ熱可塑性ポリマー又はコポリマー又はブレンドである、請求項4に記載の可撓性集積回路モジュール。
- 半導体ダイは、集積回路が取り付けられた電子グレードのシリコンウェハを含む、請求項1に記載の可撓性集積回路モジュール。
- 可撓性基板は可撓性ポリマーの層及び導電性材料の2つの層を含み、導電性材料の層の各々が可撓性ポリマーの層のそれぞれの側に配置されている、請求項1に記載の可撓性集積回路モジュール。
- 可撓性ポリマーの層は熱硬化性ポリイミドポリマーのシートを含み、導電性材料の各層は銅コーティングを含む、請求項7に記載の可撓性集積回路モジュール。
- 銅コーティングの各層は、熱硬化性ポリイミドポリマーのシートのそれぞれの側においてパターニングされている、請求項8に記載の可撓性集積回路モジュール。
- 封止層の、前記可撓性基板とは反対側に取り付けられた第2の可撓性基板を更に含む、請求項7に記載の可撓性集積回路モジュール。
- 第2の可撓性基板は、可撓性ポリマーの第2の層及び導電性材料の2つの第2の層を含み、導電性材料の第2の層の各々が可撓性ポリマーの第2の層のそれぞれの側に配置されている、請求項10に記載の可撓性集積回路モジュール。
- 可撓性ポリマーの第2の層は熱硬化性ポリイミドポリマーのシートを含み、導電性材料の第2の層の各々は銅コーティングを含む、請求項11に記載の可撓性集積回路モジュール。
- 第2の可撓性基板は、それを貫通して半導体ダイまで延在する1つ以上のビアを更に含む、請求項10に記載の可撓性集積回路モジュール。
- 封止層がポリウレタンから製造されている、請求項1に記載の可撓性集積回路モジュール。
- 極めて可撓性の電子デバイスのための可撓性集積回路(IC)パッケージであって、
可撓性ポリマーの第1の層、及び、前記可撓性ポリマーの第1の層のそれぞれの側に各々配置されている導電性材料の第1の対の層を含む第1の可撓性基板と、
第1の可撓性基板に取り付けられ、集積回路が形成された電子グレードのシリコンウェハを含むシリコンダイと、
可撓性ポリマーの第2の層、及び、前記可撓性ポリマーの第2の層のそれぞれの側に各々配置されている導電性材料の第2の対の層を含む第2の可撓性基板と、
第1及び第2の可撓性基板の間に配置されるとともにそれらに積層され、かつ前記シリコンダイを封入している熱可塑性樹脂又はポリイミド接着剤、又はそれらの両方を含む封止層と
を含む、可撓性集積回路パッケージ。 - 可撓性回路(IC)モジュールを組み立てる方法であって、
第1の可撓性基板及び第2の可撓性基板を提供する工程であって、可撓性基板の各々は、可撓性ポリマーの層及び導電性材料の2つの層を含み、導電性材料の層の各々が可撓性ポリマーの層のそれぞれの側に配置されている、工程と、
半導体ダイを第2の可撓性基板に取り付ける工程と、
熱可塑性樹脂又はポリイミド接着剤、又はそれらの両方を含む封止層を、第1の可撓性基板に積層する工程と、
前記熱可塑性樹脂又は前記ポリイミド接着剤、又はそれらの両方が、半導体ダイの周りを流れて半導体ダイを封入するように、封止層及び第1の可撓性基板を第2の可撓性基板に積層する工程と
を含む、方法。 - 第1及び第2の可撓性基板の導電性材料の層の1つ又は複数に回路をパターニングする工程を更に含む、請求項16に記載の方法。
- 1つ以上のビアを、第1の可撓性基板を貫通させて半導体ダイまでレーザ穿孔する工程を更に含む、請求項16に記載の方法。
- 第1の可撓性基板を半導体ダイに接続するために前記1つ以上のビアを電気メッキする工程を更に含む、請求項18に記載の方法。
- 前記封止層がポリイミド接着剤であり、前記ポリイミド接着剤が、アクリル系の熱伝導性かつ電気的に絶縁性のポリイミド接着剤を含む、請求項16に記載の方法。
- 封止層が熱可塑性樹脂であり、前記熱可塑性樹脂がBステージFR−4ガラス強化エポキシ熱可塑性ポリマー又はコポリマー又はブレンドを含む、請求項16に記載の方法。
- 封止層がポリウレタン材料から製造されている、請求項16に記載の方法。
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PCT/US2015/053727 WO2016054512A1 (en) | 2014-10-03 | 2015-10-02 | Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same |
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CA2959699C (en) | 2023-12-19 |
CN106716627A (zh) | 2017-05-24 |
EP3201946A1 (en) | 2017-08-09 |
US20180308799A1 (en) | 2018-10-25 |
CA2959699A1 (en) | 2016-04-07 |
US9899330B2 (en) | 2018-02-20 |
US20160099214A1 (en) | 2016-04-07 |
KR20170063936A (ko) | 2017-06-08 |
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