ATE417073T1 - Polyimidfolie - Google Patents

Polyimidfolie

Info

Publication number
ATE417073T1
ATE417073T1 AT04807883T AT04807883T ATE417073T1 AT E417073 T1 ATE417073 T1 AT E417073T1 AT 04807883 T AT04807883 T AT 04807883T AT 04807883 T AT04807883 T AT 04807883T AT E417073 T1 ATE417073 T1 AT E417073T1
Authority
AT
Austria
Prior art keywords
polyimide film
planar orientation
imidation
curling
film
Prior art date
Application number
AT04807883T
Other languages
English (en)
Inventor
Masayuki Tsutsumi
Satoshi Maeda
Keizo Kawahara
Takefumi Yoshida
Kazutake Okamoto
Morio Morino
Shoichi Uemura
Akinobu Nagara
Noriko Takahashi
Hiroko Oyama
Shunji Kurahara
Jun Yasui
Original Assignee
Toyo Boseki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003435671A external-priority patent/JP3858892B2/ja
Priority claimed from JP2003434160A external-priority patent/JP3956940B2/ja
Priority claimed from JP2004155084A external-priority patent/JP4721657B2/ja
Priority claimed from JP2004254049A external-priority patent/JP3937235B2/ja
Priority claimed from JP2004263869A external-priority patent/JP2006077158A/ja
Application filed by Toyo Boseki filed Critical Toyo Boseki
Application granted granted Critical
Publication of ATE417073T1 publication Critical patent/ATE417073T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
AT04807883T 2003-12-26 2004-12-27 Polyimidfolie ATE417073T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003435671A JP3858892B2 (ja) 2003-12-26 2003-12-26 ポリイミドフィルム
JP2003434160A JP3956940B2 (ja) 2003-12-26 2003-12-26 ポリイミドベンゾオキサゾールフィルムの製造方法
JP2004155084A JP4721657B2 (ja) 2004-05-25 2004-05-25 ポリイミドベンゾオキサゾールフィルム
JP2004254049A JP3937235B2 (ja) 2004-09-01 2004-09-01 ポリイミドベンゾオキサゾールフィルム
JP2004263869A JP2006077158A (ja) 2004-09-10 2004-09-10 ポリイミドベンゾオキサゾールフィルム

Publications (1)

Publication Number Publication Date
ATE417073T1 true ATE417073T1 (de) 2008-12-15

Family

ID=34743918

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04807883T ATE417073T1 (de) 2003-12-26 2004-12-27 Polyimidfolie

Country Status (7)

Country Link
US (1) US8314203B2 (de)
EP (1) EP1707590B1 (de)
KR (1) KR100798537B1 (de)
AT (1) ATE417073T1 (de)
CA (1) CA2550896C (de)
DE (1) DE602004018387D1 (de)
WO (1) WO2005063860A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845328B1 (ko) * 2006-01-20 2008-07-10 주식회사 코오롱 폴리이미드 필름
US7678701B2 (en) * 2006-07-31 2010-03-16 Eastman Kodak Company Flexible substrate with electronic devices formed thereon
JP2008093930A (ja) * 2006-10-11 2008-04-24 Toyobo Co Ltd 透明導電性ポリイミドフィルム
JP5552811B2 (ja) * 2007-07-27 2014-07-16 宇部興産株式会社 ポリイミドフィルムおよび配線基板
JP5031639B2 (ja) * 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
EP2380732B1 (de) * 2008-12-19 2019-02-06 Toyobo Co., Ltd. Laminierter körper, herstellungsverfahren dafür und laminierte leiterplatte
KR101142723B1 (ko) * 2009-07-31 2012-05-04 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
KR101070022B1 (ko) * 2009-09-16 2011-10-04 삼성전기주식회사 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈
KR101229161B1 (ko) * 2011-06-30 2013-02-01 에스케이씨코오롱피아이 주식회사 폴리이미드 필름 제조방법
JP2013131423A (ja) * 2011-12-22 2013-07-04 Hitachi Cable Ltd 絶縁電線及びコイル
JP6302164B2 (ja) * 2012-03-29 2018-03-28 積水化学工業株式会社 積層構造体の製造方法
US8962890B1 (en) 2012-04-20 2015-02-24 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same
US8791227B1 (en) 2012-04-20 2014-07-29 The United States Of America As Represented By The Secretary Of The Air Force Crosslinked aromatic polyimides and methods of making the same
US9085661B1 (en) 2012-10-26 2015-07-21 The United States Of America As Represented By The Secretary Of The Air Force Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride
JP2015127117A (ja) * 2013-12-27 2015-07-09 新日鉄住金化学株式会社 金属張積層体及び回路基板
US9139696B1 (en) 2014-03-28 2015-09-22 The United States Of America, As Represented By The Secretary Of The Air Force Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same
US9644071B1 (en) 2014-09-05 2017-05-09 The United States Of America As Represented By The Secretary Of The Air Force Bis(azobenzene) diamines and photomechanical polymers made therefrom
US9899330B2 (en) * 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
JP6361550B2 (ja) * 2015-03-30 2018-07-25 住友金属鉱山株式会社 ポリイミドフィルムの良否判定方法、並びにそのポリイミドフィルムを用いた銅張積層板及びフレキシブル配線板の製造方法
US10239254B1 (en) 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
US10294255B1 (en) 2015-08-07 2019-05-21 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinking agent, crosslinked polymer, and method of making same
WO2017200799A1 (en) * 2016-05-20 2017-11-23 Sabic Global Technologies B.V. High heat copolyimides, articles prepared therefrom, and methods of manufacturing copolyimide articles
TWI808062B (zh) * 2016-08-12 2023-07-11 日商力森諾科股份有限公司 層間絕緣膜及其製造方法
KR101883434B1 (ko) * 2018-01-30 2018-07-31 에스케이씨코오롱피아이 주식회사 그라파이트 시트용 폴리이미드 필름, 이를 이용하여 제조된 그라파이트 시트 및 그라파이트 시트의 제조방법
KR102865315B1 (ko) * 2018-03-09 2025-09-29 가부시키가이샤 아리사와 세이사쿠쇼 적층체 및 그의 제조 방법
CN109609802B (zh) * 2018-12-01 2021-05-04 温州亮彩眼镜科技有限公司 一种无铅无镍环保眼镜铜针
US12552907B2 (en) 2020-07-10 2026-02-17 Kolon Industries, Inc. Polyimide-based film having excellent filler dispersibility and display device comprising same
KR102688950B1 (ko) * 2020-07-10 2024-07-26 코오롱인더스트리 주식회사 우수한 필러 분산성을 갖는 폴리이미드계 필름 및 이를 포함하는 표시장치
WO2022080314A1 (ja) * 2020-10-14 2022-04-21 株式会社カネカ 複層ポリイミドフィルム、金属張積層板、及び複層ポリイミドフィルムの製造方法
CN112876717A (zh) * 2021-01-25 2021-06-01 四川大学 一种高介电常数聚酰胺1材料及其制备方法
US20240317940A1 (en) * 2023-03-21 2024-09-26 Rohm And Haas Electronic Materials Llc Photoimagable dielectrics

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344957B2 (de) * 1973-12-28 1978-12-02
JP3515792B2 (ja) 1991-10-30 2004-04-05 東レ・デュポン株式会社 ポリイミドフィルムおよびその製造方法
DE4219479A1 (de) 1992-06-13 1993-12-16 Basf Ag Polymethacryl- und Polyacrylimide mit verbesserter Eigenfarbe
JPH0656992A (ja) * 1992-08-05 1994-03-01 Unitika Ltd ポリイミドフィルム
US5919892A (en) * 1994-10-31 1999-07-06 The Dow Chemical Company Polyamic acids and methods to convert polyamic acids into polyimidebenzoxazole films
US5741585A (en) * 1995-04-24 1998-04-21 The Dow Chemical Company Polyamic acid precursors and methods for preparing higher molecular weight polyamic acids and polyimidebenzoxazole
US5670262A (en) 1995-05-09 1997-09-23 The Dow Chemical Company Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
TW354286B (en) 1996-05-22 1999-03-11 Toray Industries Thin-film made of aryl polyamide and/or aryl polyimide and magnetic recording media using the same
US6143399A (en) * 1997-03-03 2000-11-07 Ube Industries, Ltd. Aromatic polyimide film
JP4078625B2 (ja) 1998-09-10 2008-04-23 東レ・デュポン株式会社 二軸配向ポリイミドフィルムおよびその製造方法
JP2002154168A (ja) 2000-11-17 2002-05-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムとその製造方法および等方性調整方法
JP2002355832A (ja) 2001-02-20 2002-12-10 Central Glass Co Ltd ポリイミド板状体の製造方法

Also Published As

Publication number Publication date
EP1707590A4 (de) 2007-03-21
CA2550896C (en) 2011-06-14
CA2550896A1 (en) 2005-07-14
US8314203B2 (en) 2012-11-20
DE602004018387D1 (de) 2009-01-22
EP1707590B1 (de) 2008-12-10
US20070272124A1 (en) 2007-11-29
KR20060126745A (ko) 2006-12-08
WO2005063860A1 (ja) 2005-07-14
EP1707590A1 (de) 2006-10-04
KR100798537B1 (ko) 2008-01-28

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Legal Events

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