DE602004018387D1 - Polyimidfolie - Google Patents

Polyimidfolie

Info

Publication number
DE602004018387D1
DE602004018387D1 DE602004018387T DE602004018387T DE602004018387D1 DE 602004018387 D1 DE602004018387 D1 DE 602004018387D1 DE 602004018387 T DE602004018387 T DE 602004018387T DE 602004018387 T DE602004018387 T DE 602004018387T DE 602004018387 D1 DE602004018387 D1 DE 602004018387D1
Authority
DE
Germany
Prior art keywords
polyimide film
planar orientation
imidation
curling
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004018387T
Other languages
English (en)
Inventor
Masayuki Tsutsumi
Satoshi Maeda
Keizo Kawahara
Takefumi Yoshida
Kazutake Okamoto
Morio Morino
Shoichi Uemura
Akinobu Nagara
Noriko Takahashi
Hiroko Oyama
Shunji Kurahara
Jun Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003434160A external-priority patent/JP3956940B2/ja
Priority claimed from JP2003435671A external-priority patent/JP3858892B2/ja
Priority claimed from JP2004155084A external-priority patent/JP4721657B2/ja
Priority claimed from JP2004254049A external-priority patent/JP3937235B2/ja
Priority claimed from JP2004263869A external-priority patent/JP2006077158A/ja
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Publication of DE602004018387D1 publication Critical patent/DE602004018387D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
DE602004018387T 2003-12-26 2004-12-27 Polyimidfolie Active DE602004018387D1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003434160A JP3956940B2 (ja) 2003-12-26 2003-12-26 ポリイミドベンゾオキサゾールフィルムの製造方法
JP2003435671A JP3858892B2 (ja) 2003-12-26 2003-12-26 ポリイミドフィルム
JP2004155084A JP4721657B2 (ja) 2004-05-25 2004-05-25 ポリイミドベンゾオキサゾールフィルム
JP2004254049A JP3937235B2 (ja) 2004-09-01 2004-09-01 ポリイミドベンゾオキサゾールフィルム
JP2004263869A JP2006077158A (ja) 2004-09-10 2004-09-10 ポリイミドベンゾオキサゾールフィルム
PCT/JP2004/019528 WO2005063860A1 (ja) 2003-12-26 2004-12-27 ポリイミドフィルム

Publications (1)

Publication Number Publication Date
DE602004018387D1 true DE602004018387D1 (de) 2009-01-22

Family

ID=34743918

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004018387T Active DE602004018387D1 (de) 2003-12-26 2004-12-27 Polyimidfolie

Country Status (7)

Country Link
US (1) US8314203B2 (de)
EP (1) EP1707590B1 (de)
KR (1) KR100798537B1 (de)
AT (1) ATE417073T1 (de)
CA (1) CA2550896C (de)
DE (1) DE602004018387D1 (de)
WO (1) WO2005063860A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845328B1 (ko) * 2006-01-20 2008-07-10 주식회사 코오롱 폴리이미드 필름
US7678701B2 (en) * 2006-07-31 2010-03-16 Eastman Kodak Company Flexible substrate with electronic devices formed thereon
JP2008093930A (ja) * 2006-10-11 2008-04-24 Toyobo Co Ltd 透明導電性ポリイミドフィルム
TWI441573B (zh) * 2007-07-27 2014-06-11 Ube Industries 配線基板之製造程序
JP5031639B2 (ja) * 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
EP3117993B1 (de) * 2008-12-19 2019-01-30 Toyobo Co., Ltd. Laminierter körper, herstellungsverfahren dafür und laminierte leiterplatte
KR101142723B1 (ko) * 2009-07-31 2012-05-04 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
KR101070022B1 (ko) * 2009-09-16 2011-10-04 삼성전기주식회사 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈
KR101229161B1 (ko) * 2011-06-30 2013-02-01 에스케이씨코오롱피아이 주식회사 폴리이미드 필름 제조방법
JP2013131423A (ja) * 2011-12-22 2013-07-04 Hitachi Cable Ltd 絶縁電線及びコイル
JP6302164B2 (ja) * 2012-03-29 2018-03-28 積水化学工業株式会社 積層構造体の製造方法
US8791227B1 (en) 2012-04-20 2014-07-29 The United States Of America As Represented By The Secretary Of The Air Force Crosslinked aromatic polyimides and methods of making the same
US8962890B1 (en) 2012-04-20 2015-02-24 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same
US9085661B1 (en) 2012-10-26 2015-07-21 The United States Of America As Represented By The Secretary Of The Air Force Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride
JP2015127117A (ja) * 2013-12-27 2015-07-09 新日鉄住金化学株式会社 金属張積層体及び回路基板
US9139696B1 (en) 2014-03-28 2015-09-22 The United States Of America, As Represented By The Secretary Of The Air Force Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same
US9644071B1 (en) 2014-09-05 2017-05-09 The United States Of America As Represented By The Secretary Of The Air Force Bis(azobenzene) diamines and photomechanical polymers made therefrom
US9899330B2 (en) * 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
JP6361550B2 (ja) * 2015-03-30 2018-07-25 住友金属鉱山株式会社 ポリイミドフィルムの良否判定方法、並びにそのポリイミドフィルムを用いた銅張積層板及びフレキシブル配線板の製造方法
US10294255B1 (en) 2015-08-07 2019-05-21 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinking agent, crosslinked polymer, and method of making same
US10239254B1 (en) 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
CN109153785B (zh) * 2016-05-20 2021-09-07 高新特殊工程塑料全球技术有限公司 高热共聚酰亚胺、由其制备的制品及制造共聚酰亚胺制品的方法
JP7311968B2 (ja) * 2016-08-12 2023-07-20 株式会社レゾナック 層間絶縁フィルム及びその製造方法
KR101883434B1 (ko) * 2018-01-30 2018-07-31 에스케이씨코오롱피아이 주식회사 그라파이트 시트용 폴리이미드 필름, 이를 이용하여 제조된 그라파이트 시트 및 그라파이트 시트의 제조방법
WO2019171990A1 (ja) * 2018-03-09 2019-09-12 株式会社有沢製作所 積層体及びその製造方法
CN109609802B (zh) * 2018-12-01 2021-05-04 温州亮彩眼镜科技有限公司 一种无铅无镍环保眼镜铜针
CN112876717A (zh) * 2021-01-25 2021-06-01 四川大学 一种高介电常数聚酰胺1材料及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5344957B2 (de) * 1973-12-28 1978-12-02
JP3515792B2 (ja) 1991-10-30 2004-04-05 東レ・デュポン株式会社 ポリイミドフィルムおよびその製造方法
DE4219479A1 (de) 1992-06-13 1993-12-16 Basf Ag Polymethacryl- und Polyacrylimide mit verbesserter Eigenfarbe
JPH0656992A (ja) * 1992-08-05 1994-03-01 Unitika Ltd ポリイミドフィルム
US5919892A (en) 1994-10-31 1999-07-06 The Dow Chemical Company Polyamic acids and methods to convert polyamic acids into polyimidebenzoxazole films
US5741585A (en) 1995-04-24 1998-04-21 The Dow Chemical Company Polyamic acid precursors and methods for preparing higher molecular weight polyamic acids and polyimidebenzoxazole
US5670262A (en) * 1995-05-09 1997-09-23 The Dow Chemical Company Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
TW354286B (en) 1996-05-22 1999-03-11 Toray Industries Thin-film made of aryl polyamide and/or aryl polyimide and magnetic recording media using the same
US6143399A (en) * 1997-03-03 2000-11-07 Ube Industries, Ltd. Aromatic polyimide film
JP4078625B2 (ja) 1998-09-10 2008-04-23 東レ・デュポン株式会社 二軸配向ポリイミドフィルムおよびその製造方法
JP2002154168A (ja) * 2000-11-17 2002-05-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムとその製造方法および等方性調整方法
JP2002355832A (ja) 2001-02-20 2002-12-10 Central Glass Co Ltd ポリイミド板状体の製造方法

Also Published As

Publication number Publication date
CA2550896A1 (en) 2005-07-14
CA2550896C (en) 2011-06-14
EP1707590A1 (de) 2006-10-04
US8314203B2 (en) 2012-11-20
US20070272124A1 (en) 2007-11-29
KR100798537B1 (ko) 2008-01-28
EP1707590B1 (de) 2008-12-10
KR20060126745A (ko) 2006-12-08
EP1707590A4 (de) 2007-03-21
WO2005063860A1 (ja) 2005-07-14
ATE417073T1 (de) 2008-12-15

Similar Documents

Publication Publication Date Title
ATE417073T1 (de) Polyimidfolie
TW200631991A (en) Polyimide resin, polyimide film and polyimide laminate
ATE493565T1 (de) Bauteil mit filmkühlloch
EP1872940A4 (de) Klebefolie, metalllaminierte folie und leiterplatte
TW200708241A (en) Heat radiation member and production method for the same
WO2008108255A1 (ja) 粘着剤層付き透明導電性フィルムおよびその製造方法
EP1550698A3 (de) Polyimidhaltige Klebstoffzusammensetzungen für flexible Schaltungs-anwendungen,und damit verbundene zusammensetzungen und verfahren
EP1872941A4 (de) Dünnfilmlaminierte polyimidfolie und flexible leiterplatte
WO2008149920A1 (ja) グラファイト複合フィルム
WO2006077964A1 (ja) ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体
WO2006001943A3 (en) Multi-layered thermally conductive sheet
DE602005010774D1 (de) Thermokopf mit zwischen Kühlkörperplatte und Kopfsubstrat aufgetragenem Klebstof und Herstellungsverfahren dafür
WO2011119007A3 (ko) 방열 테이프 및 그 제조 방법
TW200606015A (en) Adhesive film and production method therefor and flexible metal-clad laminate and production method therefor
TW200602186A (en) Novel polyimide film and use thereof
NO20070833L (no) Tynnfilmmateriale og fremstilling av dette
WO2010035999A3 (en) Transparent electrode
JP2009111003A (ja) 複合断熱体とそれを含む電子機器
TW200626696A (en) Adhesive sheet and copper-clad laminate
ATE363030T1 (de) Mikroaktuator
TW200702172A (en) Heat spreader for printed circuit boards
TW200604002A (en) Metallic foil polyimide laminated flexible plate and its manufacturing process
TW200642537A (en) Laminate for wiring board
ATE413965T1 (de) Laminatstruktur zur verwendung in dämmplatten
ATE460126T1 (de) Thermische kaustikvorrichtungen mit verbesserten heizprofilen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition