WO2006077964A1 - ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 - Google Patents

ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体

Info

Publication number
WO2006077964A1
WO2006077964A1 PCT/JP2006/300844 JP2006300844W WO2006077964A1 WO 2006077964 A1 WO2006077964 A1 WO 2006077964A1 JP 2006300844 W JP2006300844 W JP 2006300844W WO 2006077964 A1 WO2006077964 A1 WO 2006077964A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide
formula
polyimide resin
repeating unit
unit represented
Prior art date
Application number
PCT/JP2006/300844
Other languages
English (en)
French (fr)
Other versions
WO2006077964A2 (ja
WO2006077964A3 (ja
Inventor
Tsuyoshi Bito
Shuta Kihara
Jitsuo Oishi
Original Assignee
Mitsubishi Gas Chemical Company, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Company, Inc. filed Critical Mitsubishi Gas Chemical Company, Inc.
Priority to JP2006553964A priority Critical patent/JP5470678B2/ja
Priority to KR1020077016561A priority patent/KR101252875B1/ko
Priority to US11/814,499 priority patent/US8293371B2/en
Publication of WO2006077964A2 publication Critical patent/WO2006077964A2/ja
Publication of WO2006077964A1 publication Critical patent/WO2006077964A1/ja
Publication of WO2006077964A3 publication Critical patent/WO2006077964A3/ja

Links

Abstract

　下記式（１）： で表される繰り返し単位、又は、前記式（１）で表される繰り返し単位と下記式（２）： （式中、Xは明細書で定義したとおり）で表される少なくとも１種の繰り返し単位からなるポリイミド樹脂は熱可塑性、溶剤可溶性、耐熱性が良好、低吸水率で接着性に優れる。該ポリイミド樹脂は絶縁基材、金属層、および絶縁基材と金属層との間に配置された接着層を含む金属張積層体の接着層の材料として有用である。                                                                                 
PCT/JP2006/300844 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 WO2006077964A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006553964A JP5470678B2 (ja) 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体
KR1020077016561A KR101252875B1 (ko) 2005-01-21 2006-01-20 폴리이미드 수지, 폴리이미드 필름 및 폴리이미드 적층체
US11/814,499 US8293371B2 (en) 2005-01-21 2006-01-20 Polyimide resin, polyimide film, and polyimide laminate

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005013720 2005-01-21
JP2005-013720 2005-01-21
JP2005020655 2005-01-28
JP2005-020655 2005-01-28
JP2005-028466 2005-02-04
JP2005028466 2005-02-04

Publications (3)

Publication Number Publication Date
WO2006077964A2 WO2006077964A2 (ja) 2006-07-27
WO2006077964A1 true WO2006077964A1 (ja) 2006-07-27
WO2006077964A3 WO2006077964A3 (ja) 2006-12-21

Family

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