WO2006077964A3 - ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 - Google Patents

ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 Download PDF

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Publication number
WO2006077964A3
WO2006077964A3 PCT/JP2006/300844 JP2006300844W WO2006077964A3 WO 2006077964 A3 WO2006077964 A3 WO 2006077964A3 JP 2006300844 W JP2006300844 W JP 2006300844W WO 2006077964 A3 WO2006077964 A3 WO 2006077964A3
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WIPO (PCT)
Prior art keywords
polyimide
formula
polyimide resin
repeating unit
unit represented
Prior art date
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PCT/JP2006/300844
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English (en)
French (fr)
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WO2006077964A1 (ja
WO2006077964A2 (ja
Inventor
Tsuyoshi Bito
Shuta Kihara
Jitsuo Oishi
Original Assignee
Mitsubishi Gas Chemical Co
Tsuyoshi Bito
Shuta Kihara
Jitsuo Oishi
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Publication date
Application filed by Mitsubishi Gas Chemical Co, Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi filed Critical Mitsubishi Gas Chemical Co
Priority to JP2006553964A priority Critical patent/JP5470678B2/ja
Priority to US11/814,499 priority patent/US8293371B2/en
Priority to KR1020077016561A priority patent/KR101252875B1/ko
Publication of WO2006077964A1 publication Critical patent/WO2006077964A1/ja
Publication of WO2006077964A2 publication Critical patent/WO2006077964A2/ja
Publication of WO2006077964A3 publication Critical patent/WO2006077964A3/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/582—Tearability
    • B32B2307/5825—Tear resistant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

　下記式（１）： で表される繰り返し単位、又は、前記式（１）で表される繰り返し単位と下記式（２）： （式中、Xは明細書で定義したとおり）で表される少なくとも１種の繰り返し単位からなるポリイミド樹脂は熱可塑性、溶剤可溶性、耐熱性が良好、低吸水率で接着性に優れる。該ポリイミド樹脂は絶縁基材、金属層、および絶縁基材と金属層との間に配置された接着層を含む金属張積層体の接着層の材料として有用である。                                                                                 
PCT/JP2006/300844 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 WO2006077964A2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006553964A JP5470678B2 (ja) 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体
US11/814,499 US8293371B2 (en) 2005-01-21 2006-01-20 Polyimide resin, polyimide film, and polyimide laminate
KR1020077016561A KR101252875B1 (ko) 2005-01-21 2006-01-20 폴리이미드 수지, 폴리이미드 필름 및 폴리이미드 적층체

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005-013720 2005-01-21
JP2005013720 2005-01-21
JP2005020655 2005-01-28
JP2005-020655 2005-01-28
JP2005-028466 2005-02-04
JP2005028466 2005-02-04

Publications (3)

Publication Number Publication Date
WO2006077964A1 WO2006077964A1 (ja) 2006-07-27
WO2006077964A2 WO2006077964A2 (ja) 2006-07-27
WO2006077964A3 true WO2006077964A3 (ja) 2006-12-21

Family

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PCT/JP2006/300844 WO2006077964A2 (ja) 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体

Country Status (5)

Country Link
US (1) US8293371B2 (ja)
JP (1) JP5470678B2 (ja)
KR (1) KR101252875B1 (ja)
TW (1) TWI429684B (ja)
WO (1) WO2006077964A2 (ja)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN103492462A (zh) * 2011-03-07 2014-01-01 日产化学工业株式会社 组合物、液晶取向处理剂、液晶取向膜及液晶显示元件
CN103502312A (zh) * 2011-03-07 2014-01-08 日产化学工业株式会社 组合物、液晶取向处理剂、液晶取向膜及液晶显示元件

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KR101413889B1 (ko) * 2006-07-07 2014-06-30 미츠비시 가스 가가쿠 가부시키가이샤 폴리이미드 수지
EP2042540B1 (en) * 2006-07-18 2012-02-08 Mitsubishi Gas Chemical Company, Inc. Polyimide resin
US20090305046A1 (en) * 2006-07-20 2009-12-10 Tsuyoshi Bito Thermocurable Polyimide Resin Composition
JP5013105B2 (ja) * 2007-03-06 2012-08-29 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
JP2008297360A (ja) * 2007-05-29 2008-12-11 New Japan Chem Co Ltd 溶剤可溶性ポリイミド樹脂
JP2009084391A (ja) * 2007-09-28 2009-04-23 Sekisui Chem Co Ltd ジヒドロベンゾキサジン環構造を有する熱硬化性樹脂の製造方法
TWI362398B (en) 2009-12-31 2012-04-21 Ind Tech Res Inst Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same
KR101299651B1 (ko) * 2010-07-14 2013-08-23 주식회사 엘지화학 저온 경화가 가능한 폴리이미드 수지 및 이의 제조 방법
CN102336910B (zh) 2010-07-14 2015-04-08 株式会社Lg化学 可低温固化的聚酰亚胺树脂及其制备方法
CN103890859B (zh) * 2012-01-13 2017-02-22 株式会社Lg化学 用于电子器件的绝缘材料
JP5825651B2 (ja) * 2012-01-13 2015-12-02 エルジー・ケム・リミテッド 電子素子用絶縁材
JP6274109B2 (ja) * 2012-09-27 2018-02-07 三菱瓦斯化学株式会社 ポリイミド樹脂組成物
JP6485358B2 (ja) * 2013-11-27 2019-03-20 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6369141B2 (ja) * 2014-06-02 2018-08-08 東レ株式会社 樹脂膜、それを含む積層体、それを用いた有機ｅｌ素子基板、カラーフィルター基板およびそれらの製造方法ならびにフレキシブル有機ｅｌディスプレイ
JP6620428B2 (ja) * 2015-05-29 2019-12-18 三菱瓦斯化学株式会社 ポリイミド樹脂
KR20180124861A (ko) * 2016-03-14 2018-11-21 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 골격구조의 제어방법 및 폴리이미드의 제조방법
WO2018181496A1 (ja) * 2017-03-30 2018-10-04 日産化学株式会社 剥離層形成用組成物及び剥離層
JP6711467B2 (ja) * 2017-09-13 2020-06-17 三菱瓦斯化学株式会社 ポリイミド、ポリイミドワニス、及びポリイミドフィルム
CN112778524B (zh) * 2020-12-30 2023-11-10 江苏慧智新材料科技有限公司 一种聚酰胺酰亚胺树脂及其制备的透明耐酸碱电磁屏蔽复合薄膜

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JPH07152037A (ja) * 1993-11-26 1995-06-16 Chisso Corp 液晶配向膜及び液晶表示素子
JP2003155342A (ja) * 2001-11-19 2003-05-27 Nippon Steel Chem Co Ltd 脂環構造を有するポリイミド共重合体
JP2005015629A (ja) * 2003-06-26 2005-01-20 Mitsubishi Gas Chem Co Inc 溶媒可溶性ポリイミドの製造方法

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TW200631991A (en) 2006-09-16
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US8293371B2 (en) 2012-10-23
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