HK1088495A1 - Double layer film, production method of double layer film, production method of printed circuit board - Google Patents

Double layer film, production method of double layer film, production method of printed circuit board

Info

Publication number
HK1088495A1
HK1088495A1 HK06108805.2A HK06108805A HK1088495A1 HK 1088495 A1 HK1088495 A1 HK 1088495A1 HK 06108805 A HK06108805 A HK 06108805A HK 1088495 A1 HK1088495 A1 HK 1088495A1
Authority
HK
Hong Kong
Prior art keywords
production method
layer film
double layer
circuit board
printed circuit
Prior art date
Application number
HK06108805.2A
Inventor
Masamichi Akatsu
Hiroyuki Kawaguchi
Kazumi Ohnishi
Tomohiro Baba
Kunihiko Saino
Norio Tamada
Original Assignee
Kakogawa Plastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kakogawa Plastics Co Ltd filed Critical Kakogawa Plastics Co Ltd
Publication of HK1088495A1 publication Critical patent/HK1088495A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
HK06108805.2A 2004-07-27 2006-08-08 Double layer film, production method of double layer film, production method of printed circuit board HK1088495A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004218789 2004-07-27
JP2005091291 2005-03-28
JP2005199778A JP2006306009A (en) 2004-07-27 2005-07-08 Two-layer film, method for producing two-layer film and method for manufacturing printed wiring board

Publications (1)

Publication Number Publication Date
HK1088495A1 true HK1088495A1 (en) 2006-11-03

Family

ID=37149454

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06108805.2A HK1088495A1 (en) 2004-07-27 2006-08-08 Double layer film, production method of double layer film, production method of printed circuit board

Country Status (4)

Country Link
JP (1) JP2006306009A (en)
KR (1) KR101203308B1 (en)
HK (1) HK1088495A1 (en)
TW (1) TWI389618B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100807796B1 (en) * 2005-05-19 2008-03-06 한덕수 Flexible Multi-Layer Printed Circuit Board for Fine Pattern.
JP2008168585A (en) * 2007-01-15 2008-07-24 Mitsubishi Shindoh Co Ltd Flexible laminated plate
KR20090093133A (en) * 2008-02-28 2009-09-02 엘에스엠트론 주식회사 Dimensionally stable flexible metal clad laminate and method for manufacturing the same
WO2010116976A1 (en) * 2009-04-09 2010-10-14 Jx日鉱日石金属株式会社 Two-layer-copper-clad laminate and process for producing same
JP5436995B2 (en) * 2009-09-14 2014-03-05 新光電気工業株式会社 Wiring board and manufacturing method thereof
KR102461189B1 (en) * 2015-12-07 2022-10-28 에스케이넥실리스 주식회사 Flexible copper clad laminate, printed circuit board using the same
KR102319385B1 (en) * 2019-12-20 2021-10-29 도레이첨단소재 주식회사 Flexible copper clad laminate, electronic device including the same, and method for manufacturing the flexible copper clad laminate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287500A (en) * 1992-04-07 1993-11-02 Nissin Electric Co Ltd Production of film carrier type substrate
JPH11214838A (en) 1998-01-27 1999-08-06 Matsushita Electric Works Ltd Production of circuit board
JP2002280684A (en) * 2001-03-16 2002-09-27 Sumitomo Electric Printed Circuit Inc Copper clad flexible circuit board and its manufacturing method
JP4494873B2 (en) * 2004-06-02 2010-06-30 株式会社アルバック Printed wiring board, printed wiring board manufacturing method and manufacturing apparatus therefor

Also Published As

Publication number Publication date
TW200614895A (en) 2006-05-01
KR101203308B1 (en) 2012-11-20
TWI389618B (en) 2013-03-11
KR20060046786A (en) 2006-05-17
JP2006306009A (en) 2006-11-09

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190727