WO2011119007A3 - 방열 테이프 및 그 제조 방법 - Google Patents
방열 테이프 및 그 제조 방법 Download PDFInfo
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- WO2011119007A3 WO2011119007A3 PCT/KR2011/002079 KR2011002079W WO2011119007A3 WO 2011119007 A3 WO2011119007 A3 WO 2011119007A3 KR 2011002079 W KR2011002079 W KR 2011002079W WO 2011119007 A3 WO2011119007 A3 WO 2011119007A3
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- heat
- dissipating
- tape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B32B2307/732—Dimensional properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesive Tapes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
본 발명은 각종 전자제품에 방열을 목적으로 적용되는 방열 테이프 및 그 제조 방법에 관한 것이다. 본 발명은 금속 메쉬 기재; 및 방열 도료층을 포함하는 방열 테이프로서, 상기 방열 도료층은 금속 메쉬 기재의 한 면 또는 양 면에 형성되는 것을 특징으로 하는 방열 테이프 및 그 제조 방법을 제공한다. 또한, 본 발명은 금속 메쉬 기재; 방열 도료층; 및 점착층을 포함하는 방열 테이프로서, 상기 방열 도료층은 금속메쉬 기재의 한 면 또는 양 면에 형성되고, 상기 점착층은 열전도성 점착제로 이루어진 것을 특징으로 하는 방열 테이프 및 그 제조 방법을 제공한다. 본 발명의 방열 테이프는 두께가 얇으면서도 발열원으로부터 수직 방향으로 방열시켜서 방열 효과가 우수하고, 점착력도 우수한 특성을 가진다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180009301.5A CN102782068B (zh) | 2010-03-26 | 2011-03-25 | 散热胶带及其制作方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0027335 | 2010-03-26 | ||
KR1020100027335A KR101151599B1 (ko) | 2010-03-26 | 2010-03-26 | 방열 테이프 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011119007A2 WO2011119007A2 (ko) | 2011-09-29 |
WO2011119007A3 true WO2011119007A3 (ko) | 2012-03-15 |
Family
ID=44673777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/002079 WO2011119007A2 (ko) | 2010-03-26 | 2011-03-25 | 방열 테이프 및 그 제조 방법 |
Country Status (3)
Country | Link |
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KR (1) | KR101151599B1 (ko) |
CN (1) | CN102782068B (ko) |
WO (1) | WO2011119007A2 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103025127A (zh) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | 散热贴膜 |
CN104059556B (zh) * | 2012-12-18 | 2016-08-24 | 苏州斯迪克新材料科技股份有限公司 | 用于电子元器件的胶带 |
CN104073183B (zh) * | 2012-12-18 | 2016-06-15 | 苏州斯迪克新材料科技股份有限公司 | 用于电子元器件的胶带的制造工艺 |
CN104059555B (zh) * | 2012-12-18 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | 抗静电压敏胶带的制造工艺 |
CN104059557B (zh) * | 2012-12-18 | 2016-06-15 | 苏州斯迪克新材料科技股份有限公司 | 抗静电压敏胶带 |
CN103756584B (zh) * | 2012-12-18 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | 散热型丙烯酸酯胶带的制备方法 |
CN104152073B (zh) * | 2012-12-18 | 2016-01-13 | 苏州斯迪克新材料科技股份有限公司 | 用于电子产品贴膜的制备方法 |
KR20140093457A (ko) * | 2013-01-18 | 2014-07-28 | 엘지전자 주식회사 | 방열 시트 |
KR101417729B1 (ko) * | 2013-03-27 | 2014-08-29 | 노태욱 | 열전도성 방열 시트 및 열전도성 방열 시트를 포함하는 조명장치 |
KR101361105B1 (ko) * | 2013-04-10 | 2014-02-12 | (주)알킨스 | 열전도성이 우수한 방열테이프 |
KR101532243B1 (ko) * | 2013-12-09 | 2015-06-30 | 주식회사 세일하이텍 | 열전도 또는 전기전도 점착제 및 방열 도료가 도포된 방열시트의 제조 방법 |
CN104292795A (zh) * | 2014-10-29 | 2015-01-21 | 胡运冲 | 一种耐冲击的聚碳酸酯的制备方法 |
CN107011825A (zh) * | 2017-05-09 | 2017-08-04 | 东莞市普力达光学材料科技有限公司 | 胶带组合物及由其制备的汽车内饰双面胶带 |
CN107033790A (zh) * | 2017-05-09 | 2017-08-11 | 东莞市普力达光学材料科技有限公司 | 一种胶带组合物及由其制备的汽车内饰双面胶带 |
CN107033804A (zh) * | 2017-06-05 | 2017-08-11 | 苏州金禾新材料股份有限公司 | 高导热石墨胶带 |
CN107083204A (zh) * | 2017-06-05 | 2017-08-22 | 苏州金禾新材料股份有限公司 | 一种散热胶带 |
KR101974028B1 (ko) * | 2018-07-30 | 2019-04-30 | 변인섭 | 방열 및 방수 기능을 갖는 터치스크린패널용 양면테이프 |
CN112080220A (zh) * | 2020-10-13 | 2020-12-15 | 衡山县佳诚新材料有限公司 | 一种用于液晶显示屏的散热胶带 |
KR102579208B1 (ko) * | 2021-09-02 | 2023-09-15 | (주)동원인텍 | 방열 점착 시트 및 그 제조 방법 |
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JP2004311577A (ja) * | 2003-04-03 | 2004-11-04 | Shin Etsu Chem Co Ltd | 熱伝導性複合シートおよびその製造方法 |
KR100560201B1 (ko) | 2004-03-18 | 2006-03-13 | 자화전자 주식회사 | 피디피용 그래파이트 방열시트 |
CN1878456A (zh) * | 2006-07-14 | 2006-12-13 | 陈鸿文 | 复合结构导热填缝垫片 |
-
2010
- 2010-03-26 KR KR1020100027335A patent/KR101151599B1/ko active IP Right Grant
-
2011
- 2011-03-25 WO PCT/KR2011/002079 patent/WO2011119007A2/ko active Application Filing
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KR100574289B1 (ko) * | 2002-01-22 | 2006-04-26 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 방열부재, 그의 제조방법 및 그의 설치방법 |
KR20050103041A (ko) * | 2004-04-23 | 2005-10-27 | 자화전자 주식회사 | 피디피용 방열시트 |
KR100943520B1 (ko) * | 2007-06-29 | 2010-02-22 | 최훈석 | 고방열 방사 세라믹 무기물이 코팅된 히트싱크와 이의 제조방법 및 이를 구비한 메탈 pcb |
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Publication number | Publication date |
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WO2011119007A2 (ko) | 2011-09-29 |
KR101151599B1 (ko) | 2012-05-31 |
CN102782068B (zh) | 2014-02-19 |
CN102782068A (zh) | 2012-11-14 |
KR20110108055A (ko) | 2011-10-05 |
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