CN107033804A - 高导热石墨胶带 - Google Patents

高导热石墨胶带 Download PDF

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CN107033804A
CN107033804A CN201710413533.6A CN201710413533A CN107033804A CN 107033804 A CN107033804 A CN 107033804A CN 201710413533 A CN201710413533 A CN 201710413533A CN 107033804 A CN107033804 A CN 107033804A
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layer
graphite
heat conduction
high heat
glue band
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赵阳
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SUZHOU JINHE NEW MATERIAL CO Ltd
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SUZHOU JINHE NEW MATERIAL CO Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

一种高导热石墨胶带，包含石墨薄膜层以及涂布在所述石墨薄膜层的至少一面上的粘胶层，在所述粘胶层的另一面上还粘叠有PET薄膜层，在所述石墨薄膜层与所述粘胶层之间还铺设有至少一层金属丝网。根据本发明实施的高导热石墨胶带由于增加了金属丝网层，因此在提升导热系数的基础上还增强了各向同性，极大地拓宽了石墨胶带的应用范围。

Description

高导热石墨胶带
技术领域
本发明涉及电子元器件制造领域，尤其涉及一种高导热的石墨胶带。
背景技术
高导热石墨胶带是在具有高导热系数的石墨薄膜的一面或两面上粘贴聚对苯二甲酸乙二酯(PET)胶带，从而形成的复合胶带。其整体颜色呈现黑色，具有优良的导热功能和尺寸稳定性，且易于模切加工。
粘贴在高导热石墨胶带上的PET胶带可以为单面胶或双面胶。若为单面胶则这一面将不能再与其他部件相粘合；若为双面胶则可在撕去离型膜后与其他电子元件(如散热器)粘合为一体。通常所采用的PET胶带使用的是亚克力压敏胶。
然而，随着电子元件的体积越来越小、设备中的元件密度越来越大，功率也越来越高，散发的热量同步提升，但散热空间却反而变小。这就需要包括石墨胶带在内的散热元件亦随之提升散热能力。并且由于石墨容易形成各向异性的层状晶体结构，导致其在轴向上的导热系数远远低于面向，因此它的应用范围也受到了限制。
发明内容
本发明提供了一种导热系数高且各向同性的高导热石墨胶带。
为解决上述技术问题，本发明的技术方案是：
一种高导热石墨胶带，包含石墨薄膜层以及涂布在所述石墨薄膜层的至少一面上的粘胶层，在所述粘胶层的另一面上还粘叠有PET薄膜层，在所述石墨薄膜层与所述粘胶层之间还铺设有至少一层金属丝网。
进一步地，所述金属丝网为铜网或/和铝网。
更进一步地，所述金属丝网包括一层铜网和一层铝网，所述铜网夹在所述石墨薄膜层与所述铝网之间。
更进一步地，所述金属丝网中的金属丝直径为20～50μm，同向延伸的所述金属丝之间的间距为10～100μm。
根据本发明实施的高导热石墨胶带由于增加了金属丝网层，因此在提升导热系数的基础上还增强了各向同性，极大地拓宽了石墨胶带的应用范围。
具体实施方式
为了便于理解，下面结合实施例对本发明进行说明。应理解，这些实施例仅用于说明本发明而不用于限制本发明的范围。
实施例1：
结构：PET单面胶-石墨薄膜-金属丝网-PET双面胶，所述PET双面胶包括PET薄膜层、设置在所述PET薄膜层两侧的粘胶层以及设置在粘胶层另一侧的离型膜。在撕去PET双面胶上的离型膜之后便可贴于电子元器件表面。
其中的金属丝网为铜网+铝网的双层结构。铜网直径约为20μm，铝网直径约为30μm；丝间距均为30μm。
实施例2：
结构：PET双面胶-金属丝网-石墨薄膜-金属丝网-PET双面胶。本实施例的石墨薄膜两侧均设置有双面胶，因此所形成的复合胶带也能起到双面胶的作用。
其中的金属丝网均为铜网，直径约为20μm，丝间距为10μm。
对比例：
结构：PET单面胶-石墨薄膜-PET双面胶。
以上实施例和对比例中采用的PET双面胶均相同，由透明PET双面涂布丙烯酸胶制成。
根据各实施例制造的高导热石墨胶带的性能对比，结果见下表
表1
密度(g/cm3) 导热系数(w/m＊k) 抗拉强度(Mpa)
实施例1 3.2 300 95
实施例2 4.5 420 103
对比例 2.1 250 80
上述实施例与对比例的性能测试结果表明，根据本发明实施的高导热石墨胶导热系数高、理化性质好。并且铜网或铝网还弥补了石墨薄膜原本欠缺的各向同性，因此足以满足各种尖端电子产品的散热需求。

Claims (4)

1.一种高导热石墨胶带，包含石墨薄膜层以及涂布在所述石墨薄膜层的至少一面上的粘胶层，在所述粘胶层的另一面上还粘叠有PET薄膜层，其特征在于，在所述石墨薄膜层与所述粘胶层之间还铺设有至少一层金属丝网。
2.根据权利要求1所述的高导热石墨胶带，其特征在于：所述金属丝网为铜网或/和铝网。
3.根据权利要求2所述的高导热石墨胶带，其特征在于：所述金属丝网包括一层铜网和一层铝网，所述铜网夹在所述石墨薄膜层与所述铝网之间。
4.根据权利要求1～3中任一项所述的高导热石墨胶带，其特征在于：所述金属丝网中的金属丝直径为20～50μm，同向延伸的所述金属丝之间的间距为10～100μm。
CN201710413533.6A 2017-06-05 2017-06-05 高导热石墨胶带 Pending CN107033804A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782068A (zh) * 2010-03-26 2012-11-14 栗村化学株式会社 散热胶带及其制作方法
CN103059761A (zh) * 2012-12-28 2013-04-24 斯迪克新型材料（江苏）有限公司 高导热系数的石墨散热胶带
CN202941072U (zh) * 2012-10-15 2013-05-15 苏州斯迪克新材料科技股份有限公司 石墨导热胶带
CN206089545U (zh) * 2016-09-26 2017-04-12 东莞市青峰新材料科技有限公司 一种双基材胶粘带

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782068A (zh) * 2010-03-26 2012-11-14 栗村化学株式会社 散热胶带及其制作方法
CN202941072U (zh) * 2012-10-15 2013-05-15 苏州斯迪克新材料科技股份有限公司 石墨导热胶带
CN103059761A (zh) * 2012-12-28 2013-04-24 斯迪克新型材料（江苏）有限公司 高导热系数的石墨散热胶带
CN206089545U (zh) * 2016-09-26 2017-04-12 东莞市青峰新材料科技有限公司 一种双基材胶粘带

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
丁小卫: "《导热高分子材料》", 30 April 2014, 国防工业出版社 *
何志成: "《化工原理》", 31 August 2015, 中国医药科技出版社 *

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