WO2015093903A8 - 방열성이 우수한 금속 봉지재, 그 제조방법 및 상기 금속 봉지재로 봉지된 유연전자소자 - Google Patents
방열성이 우수한 금속 봉지재, 그 제조방법 및 상기 금속 봉지재로 봉지된 유연전자소자 Download PDFInfo
- Publication number
- WO2015093903A8 WO2015093903A8 PCT/KR2014/012606 KR2014012606W WO2015093903A8 WO 2015093903 A8 WO2015093903 A8 WO 2015093903A8 KR 2014012606 W KR2014012606 W KR 2014012606W WO 2015093903 A8 WO2015093903 A8 WO 2015093903A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal encapsulant
- electronic device
- metal
- heat dissipation
- flexible electronic
- Prior art date
Links
- 239000008393 encapsulating agent Substances 0.000 title abstract 6
- 239000002184 metal Substances 0.000 title abstract 6
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 abstract 1
- 239000010439 graphite Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/102,847 US10044003B2 (en) | 2013-12-20 | 2014-12-19 | Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant |
CN201480069988.5A CN105848882B (zh) | 2013-12-20 | 2014-12-19 | 散热性优异的金属封装材料、其制备方法及用所述金属封装材料来封装的柔性电子器件 |
JP2016541231A JP6440715B2 (ja) | 2013-12-20 | 2014-12-19 | 放熱性に優れた金属封止材、その製造方法、及び上記金属封止材で封止された柔軟電子素子 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0160819 | 2013-12-20 | ||
KR1020130160819A KR101543888B1 (ko) | 2013-12-20 | 2013-12-20 | 방열성이 우수한 금속 봉지재, 그 제조방법 및 상기 금속 봉지재로 봉지된 유연전자소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2015093903A1 WO2015093903A1 (ko) | 2015-06-25 |
WO2015093903A8 true WO2015093903A8 (ko) | 2015-08-20 |
Family
ID=53403153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2014/012606 WO2015093903A1 (ko) | 2013-12-20 | 2014-12-19 | 방열성이 우수한 금속 봉지재, 그 제조방법 및 상기 금속 봉지재로 봉지된 유연전자소자 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10044003B2 (ko) |
JP (1) | JP6440715B2 (ko) |
KR (1) | KR101543888B1 (ko) |
CN (1) | CN105848882B (ko) |
WO (1) | WO2015093903A1 (ko) |
Families Citing this family (17)
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KR102359778B1 (ko) * | 2015-11-16 | 2022-02-08 | 주식회사 아모그린텍 | 방열성 및 전자파 차폐성을 갖는 플라스틱 사출성형체 |
US9799584B2 (en) | 2015-11-16 | 2017-10-24 | Intel Corporation | Heat spreaders with integrated preforms |
KR102383291B1 (ko) * | 2016-02-05 | 2022-04-07 | 주식회사 아모그린텍 | 플라스틱 사출성형체 |
KR101856528B1 (ko) * | 2016-04-12 | 2018-06-20 | 최훈석 | 유기발광표시모듈용 복합 시트 |
CN105895825A (zh) * | 2016-06-15 | 2016-08-24 | 上海天马有机发光显示技术有限公司 | 一种封装结构、封装方法及电子器件 |
KR102008227B1 (ko) * | 2017-08-03 | 2019-10-21 | 주식회사 알파머티리얼즈 | 멀티 히트 스프레더 |
KR102073270B1 (ko) * | 2017-08-24 | 2020-03-02 | 장연 | Oled 봉지재, 그 제조방법 및 oled 봉지방법 |
KR102398555B1 (ko) * | 2017-09-29 | 2022-05-17 | 엘지디스플레이 주식회사 | 열전도율이 높은 봉지 기판을 포함하는 유기 발광 표시 장치 |
FR3074965B1 (fr) | 2017-12-07 | 2019-12-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Fabrication d'un sous-module a concentration integrant un materiau dissipateur de chaleur |
KR102271843B1 (ko) * | 2017-12-18 | 2021-07-01 | 주식회사 엘지화학 | 봉지 필름 |
CN208078031U (zh) | 2017-12-29 | 2018-11-09 | 云谷(固安)科技有限公司 | 封装结构及包括封装结构的显示装置 |
TWI723416B (zh) * | 2018-06-05 | 2021-04-01 | 南韓商Lg化學股份有限公司 | 封裝膜 |
KR102119752B1 (ko) * | 2018-10-02 | 2020-06-05 | 주식회사 이엠따블유 | 연성회로기판 모듈 및 이의 제조방법 |
KR102566706B1 (ko) * | 2018-10-24 | 2023-08-16 | 에스케이온 주식회사 | 이차전지용 파우치 외장재 및 이를 포함하는 파우치형 이차전지 |
JP7014207B2 (ja) * | 2019-06-10 | 2022-02-01 | セイコーエプソン株式会社 | 波長変換素子、光源装置およびプロジェクター |
KR20230036332A (ko) | 2021-09-07 | 2023-03-14 | 와이엠티 주식회사 | 유기발광소자용 금속계 봉지재 및 이의 제조방법 |
CN114420865B (zh) * | 2022-01-10 | 2024-02-13 | 深圳市华星光电半导体显示技术有限公司 | Oled显示模组和oled显示装置 |
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US3440181A (en) * | 1965-03-22 | 1969-04-22 | Dow Chemical Co | Metal coated vermicular expanded graphite and polymer composition containing same |
US4545914A (en) * | 1984-08-31 | 1985-10-08 | Dow Corning Corporation | Conductive elastomers from electrically conductive fibers in silicone emulsion |
KR100307504B1 (ko) | 1998-11-10 | 2001-11-30 | 이상율 | 크로마이징(chromizing)과이온질화처리에의한금속표면처리방법 |
US7027304B2 (en) * | 2001-02-15 | 2006-04-11 | Integral Technologies, Inc. | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
JP3751280B2 (ja) | 2002-12-16 | 2006-03-01 | 北川工業株式会社 | 導電性熱伝導シート |
US20080023665A1 (en) | 2006-07-25 | 2008-01-31 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
KR20090094098A (ko) | 2006-12-22 | 2009-09-03 | 도요탄소 가부시키가이샤 | 흑연 재료 및 그의 제조 방법 |
US8299159B2 (en) | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
TWI589042B (zh) | 2010-01-20 | 2017-06-21 | 半導體能源研究所股份有限公司 | 發光裝置,撓性發光裝置,電子裝置,照明設備,以及發光裝置和撓性發光裝置的製造方法 |
JP2011222334A (ja) | 2010-04-09 | 2011-11-04 | Dainippon Printing Co Ltd | 熱伝導性封止部材および素子 |
KR101116390B1 (ko) | 2010-04-12 | 2012-03-09 | 한국생산기술연구원 | 다층구조를 갖는 열저항필름 및 그 제조방법 |
KR101099478B1 (ko) | 2010-05-25 | 2011-12-27 | 재단법인 철원플라즈마 산업기술연구원 | 플라즈마 토치 및 이를 포함하는 나노 분말 제조 장치 |
US20120009415A1 (en) | 2010-07-08 | 2012-01-12 | Shao Richard L | Carbon Foam Tooling With Durable Skin |
KR101147988B1 (ko) | 2010-07-13 | 2012-05-24 | 포항공과대학교 산학협력단 | 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판 |
KR101232569B1 (ko) * | 2010-12-28 | 2013-02-12 | 주식회사 포스코 | 열전도와 방열을 동시에 향상시킨 이종수지 코팅 강판 |
KR101419426B1 (ko) | 2012-03-16 | 2014-07-14 | 에스케이씨 주식회사 | 방열시트 |
KR101332362B1 (ko) | 2012-09-21 | 2013-12-02 | 재단법인 철원플라즈마 산업기술연구원 | 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법 |
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2013
- 2013-12-20 KR KR1020130160819A patent/KR101543888B1/ko active IP Right Grant
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2014
- 2014-12-19 JP JP2016541231A patent/JP6440715B2/ja active Active
- 2014-12-19 CN CN201480069988.5A patent/CN105848882B/zh active Active
- 2014-12-19 WO PCT/KR2014/012606 patent/WO2015093903A1/ko active Application Filing
- 2014-12-19 US US15/102,847 patent/US10044003B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160359134A1 (en) | 2016-12-08 |
KR20150073026A (ko) | 2015-06-30 |
US10044003B2 (en) | 2018-08-07 |
JP6440715B2 (ja) | 2018-12-19 |
CN105848882A (zh) | 2016-08-10 |
KR101543888B1 (ko) | 2015-08-11 |
JP2017504500A (ja) | 2017-02-09 |
WO2015093903A1 (ko) | 2015-06-25 |
CN105848882B (zh) | 2017-08-25 |
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