WO2012070871A3 - 접착제 조성물 - Google Patents

접착제 조성물 Download PDF

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Publication number
WO2012070871A3
WO2012070871A3 PCT/KR2011/008992 KR2011008992W WO2012070871A3 WO 2012070871 A3 WO2012070871 A3 WO 2012070871A3 KR 2011008992 W KR2011008992 W KR 2011008992W WO 2012070871 A3 WO2012070871 A3 WO 2012070871A3
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WIPO (PCT)
Prior art keywords
adhesive composition
electronic device
organic electronic
adhesive film
adhesive
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PCT/KR2011/008992
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English (en)
French (fr)
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WO2012070871A2 (ko
Inventor
유현지
조윤경
장석기
심정섭
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to EP11842481.1A priority Critical patent/EP2644677B1/en
Priority to CN201180065776.6A priority patent/CN103502378B/zh
Publication of WO2012070871A2 publication Critical patent/WO2012070871A2/ko
Publication of WO2012070871A3 publication Critical patent/WO2012070871A3/ko
Priority to US13/899,386 priority patent/US10227514B2/en
Priority to US15/913,431 priority patent/US10626307B2/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/16—Halogen-containing compounds
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J121/00—Adhesives based on unspecified rubbers
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
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    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
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    • C08K2003/2241—Titanium dioxide
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    • C08K3/00—Use of inorganic substances as compounding ingredients
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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    • C09J2463/00—Presence of epoxy resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Dispersion Chemistry (AREA)

Abstract

본 발명은, 유기전자소자의 봉지에 사용될 수 있는 접착제 조성물, 접착 필름, 접착 필름의 제조 방법 및 유기전자장치에 관한 것이다. 상기 접착제 조성물은, 접착성, 내충격성, 방열성 및 수분 차단성이 우수한 봉지층을 형성할 수 있고, 이에 따라 상기 접착제 조성물로 봉지된 소자를 포함하는 유기전자장치는 우수한 수명 특성 및 내구성을 나타낼 수 있다.
PCT/KR2011/008992 2010-11-23 2011-11-23 접착제 조성물 WO2012070871A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11842481.1A EP2644677B1 (en) 2010-11-23 2011-11-23 Adhesive composition
CN201180065776.6A CN103502378B (zh) 2010-11-23 2011-11-23 胶膜
US13/899,386 US10227514B2 (en) 2010-11-23 2013-05-21 Adhesive film
US15/913,431 US10626307B2 (en) 2010-11-23 2018-03-06 Adhesive film

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20100116705 2010-11-23
KR10-2010-0116705 2010-11-23
KR10-2011-0123152 2011-11-23
KR1020110123152A KR101552749B1 (ko) 2010-11-23 2011-11-23 접착제 조성물

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/899,386 Continuation US10227514B2 (en) 2010-11-23 2013-05-21 Adhesive film

Publications (2)

Publication Number Publication Date
WO2012070871A2 WO2012070871A2 (ko) 2012-05-31
WO2012070871A3 true WO2012070871A3 (ko) 2012-10-04

Family

ID=46271021

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/008992 WO2012070871A2 (ko) 2010-11-23 2011-11-23 접착제 조성물

Country Status (6)

Country Link
US (2) US10227514B2 (ko)
EP (1) EP2644677B1 (ko)
KR (1) KR101552749B1 (ko)
CN (2) CN103502378B (ko)
TW (1) TWI443166B (ko)
WO (1) WO2012070871A2 (ko)

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CN103409041A (zh) * 2012-06-04 2013-11-27 华烁科技股份有限公司 一种挠性导热绝缘胶粘剂在led散热基材上的应用
DE102012211335A1 (de) * 2012-06-29 2014-01-02 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
WO2014021696A1 (ko) * 2012-08-03 2014-02-06 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 제품
WO2014021697A1 (ko) * 2012-08-03 2014-02-06 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 제품
JP6105063B2 (ja) 2012-08-03 2017-03-29 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止製品
TWI633164B (zh) * 2012-08-03 2018-08-21 Ｌｇ化學股份有限公司 黏合膜與使用彼之有機電子裝置的包封產物
WO2014021698A1 (ko) * 2012-08-03 2014-02-06 주식회사 엘지화학 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
KR101593743B1 (ko) * 2013-04-05 2016-02-12 제일모직주식회사 유기발광소자 충진제용 접착필름 및 이를 포함하는 유기발광장치
EP3001476B1 (en) 2013-05-21 2021-12-22 LG Chem, Ltd. Encapsulation film and method for encapsulating organic electronic device using same
US9548473B2 (en) * 2013-06-19 2017-01-17 Lg Chem, Ltd. Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film
CN104371641A (zh) * 2014-11-12 2015-02-25 北京化工大学常州先进材料研究院 一种双组分有机硅树脂胶粘剂及制备方法
ES2914973T3 (es) * 2015-03-05 2022-06-20 Henkel Ag & Co Kgaa Adhesivo termoconductor
US10351736B2 (en) 2015-03-24 2019-07-16 Lg Chem, Ltd. Adhesive composition
WO2016153294A1 (ko) * 2015-03-24 2016-09-29 주식회사 엘지화학 접착제 조성물
JP6557352B2 (ja) * 2015-03-24 2019-08-07 エルジー・ケム・リミテッド 接着剤組成物
KR20170025346A (ko) 2015-08-28 2017-03-08 주식회사 엘지화학 분산액
KR20170025347A (ko) 2015-08-28 2017-03-08 주식회사 엘지화학 분산액
WO2017179513A1 (ja) * 2016-04-11 2017-10-19 凸版印刷株式会社 バリアフィルム積層体及びその製造方法、波長変換シート、バックライトユニット、並びにエレクトロルミネッセンス発光ユニット
TWI620785B (zh) * 2016-08-10 2018-04-11 Taiwan Union Technology Corporation 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
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