WO2009063989A1 - 芳香族ポリイミドフィルムおよびその製造方法 - Google Patents

芳香族ポリイミドフィルムおよびその製造方法 Download PDF

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Publication number
WO2009063989A1
WO2009063989A1 PCT/JP2008/070802 JP2008070802W WO2009063989A1 WO 2009063989 A1 WO2009063989 A1 WO 2009063989A1 JP 2008070802 W JP2008070802 W JP 2008070802W WO 2009063989 A1 WO2009063989 A1 WO 2009063989A1
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WO
WIPO (PCT)
Prior art keywords
aromatic polyimide
polyimide film
biphenyltetracarboxylic acid
acid unit
range
Prior art date
Application number
PCT/JP2008/070802
Other languages
English (en)
French (fr)
Inventor
Hideki Iwai
Takao Miyamoto
Toshiyuki Nishino
Yasuhiro Nagoshi
Original Assignee
Ube Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries, Ltd. filed Critical Ube Industries, Ltd.
Priority to CN2008801249993A priority Critical patent/CN101910250A/zh
Priority to US12/743,031 priority patent/US20100266829A1/en
Publication of WO2009063989A1 publication Critical patent/WO2009063989A1/ja

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

【課題】耐熱性や物理的特性に優れることで知られている3,3’,4,4’-ビフェニルテトラカルボン酸成分とp-フェニレンジアミンとから製造される芳香族ポリイミドフィルムと同等の耐熱性と物理的特性を有する芳香族ポリイミドフィルムであって、その製造が工業的に有利な条件で実現する芳香族ポリイミドフィルムを提供する。 【解決手段】3,3’,4,4’-ビフェニルテトラカルボン酸単位と2,3,3’,4’-ビフェニルテトラカルボン酸単位を75:25乃至97:3の範囲のモル比にて含むビフェニルテトラカルボン酸単位とp-フェニレンジアミン単位とを100:102乃至100:98の範囲のモル比にて含む芳香族ポリイミドからなる厚さが5~250μmの範囲の芳香族ポリイミドフィルム。
PCT/JP2008/070802 2007-11-16 2008-11-14 芳香族ポリイミドフィルムおよびその製造方法 WO2009063989A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801249993A CN101910250A (zh) 2007-11-16 2008-11-14 芳族聚酰亚胺膜及其制造方法
US12/743,031 US20100266829A1 (en) 2007-11-16 2008-11-14 Aromatic polyimide film and method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007298678A JP2009120772A (ja) 2007-11-16 2007-11-16 芳香族ポリイミドフィルムおよびその製造方法
JP2007-298678 2007-11-16

Publications (1)

Publication Number Publication Date
WO2009063989A1 true WO2009063989A1 (ja) 2009-05-22

Family

ID=40638835

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070802 WO2009063989A1 (ja) 2007-11-16 2008-11-14 芳香族ポリイミドフィルムおよびその製造方法

Country Status (6)

Country Link
US (1) US20100266829A1 (ja)
JP (1) JP2009120772A (ja)
KR (1) KR20100099170A (ja)
CN (1) CN101910250A (ja)
TW (1) TW200940600A (ja)
WO (1) WO2009063989A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725114B (zh) * 2010-01-26 2014-10-08 宇部兴产株式会社 聚酰亚胺膜的制造方法及制造装置
CN103442870B (zh) * 2011-03-25 2015-11-25 宇部兴产株式会社 聚酰亚胺膜的制备方法、聚酰亚胺膜的制备装置及聚酰亚胺膜
WO2017069165A1 (ja) * 2015-10-19 2017-04-27 宇部興産株式会社 ポリイミド前駆体、架橋構造を有するポリイミドおよびその製造方法
TWI627203B (zh) * 2017-03-31 2018-06-21 長興材料工業股份有限公司 聚醯亞胺前驅物組合物、其用途及由其製備之聚醯亞胺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62236827A (ja) * 1986-04-09 1987-10-16 Nitto Electric Ind Co Ltd ポリイミドフイルムおよびその製法
JPH08134232A (ja) * 1994-11-11 1996-05-28 Ube Ind Ltd ポリイミドフィルム、積層体およびフレキシブル回路用基板
JPH1180352A (ja) * 1997-09-12 1999-03-26 Ube Ind Ltd 貯蔵安定性の改良された耐熱性コ−ティング組成物およびポリイミド膜
WO2007135982A1 (ja) * 2006-05-19 2007-11-29 Ube Industries, Ltd. ポリイミド膜の製造方法、及びポリアミック酸溶液組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4218716B2 (ja) * 1996-04-05 2009-02-04 宇部興産株式会社 芳香族ポリイミド粉末、及び該芳香族ポリイミド粉末からなる成形体
JP3531719B2 (ja) * 1998-10-21 2004-05-31 宇部興産株式会社 ポリイミド樹脂成形体の製造法
JP3755436B2 (ja) * 2000-07-24 2006-03-15 宇部興産株式会社 ポリイミド成形体の製造法およびポリイミド成形体
JP4304854B2 (ja) * 2000-09-21 2009-07-29 宇部興産株式会社 多層ポリイミドフィルムおよび積層体
JP4941093B2 (ja) * 2006-05-19 2012-05-30 宇部興産株式会社 ポリイミド膜の製造方法、及びポリアミック酸溶液組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62236827A (ja) * 1986-04-09 1987-10-16 Nitto Electric Ind Co Ltd ポリイミドフイルムおよびその製法
JPH08134232A (ja) * 1994-11-11 1996-05-28 Ube Ind Ltd ポリイミドフィルム、積層体およびフレキシブル回路用基板
JPH1180352A (ja) * 1997-09-12 1999-03-26 Ube Ind Ltd 貯蔵安定性の改良された耐熱性コ−ティング組成物およびポリイミド膜
WO2007135982A1 (ja) * 2006-05-19 2007-11-29 Ube Industries, Ltd. ポリイミド膜の製造方法、及びポリアミック酸溶液組成物

Also Published As

Publication number Publication date
JP2009120772A (ja) 2009-06-04
KR20100099170A (ko) 2010-09-10
CN101910250A (zh) 2010-12-08
TW200940600A (en) 2009-10-01
US20100266829A1 (en) 2010-10-21

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