WO2009063989A1 - 芳香族ポリイミドフィルムおよびその製造方法 - Google Patents
芳香族ポリイミドフィルムおよびその製造方法 Download PDFInfo
- Publication number
- WO2009063989A1 WO2009063989A1 PCT/JP2008/070802 JP2008070802W WO2009063989A1 WO 2009063989 A1 WO2009063989 A1 WO 2009063989A1 JP 2008070802 W JP2008070802 W JP 2008070802W WO 2009063989 A1 WO2009063989 A1 WO 2009063989A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aromatic polyimide
- polyimide film
- biphenyltetracarboxylic acid
- acid unit
- range
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801249993A CN101910250A (zh) | 2007-11-16 | 2008-11-14 | 芳族聚酰亚胺膜及其制造方法 |
US12/743,031 US20100266829A1 (en) | 2007-11-16 | 2008-11-14 | Aromatic polyimide film and method for producing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007298678A JP2009120772A (ja) | 2007-11-16 | 2007-11-16 | 芳香族ポリイミドフィルムおよびその製造方法 |
JP2007-298678 | 2007-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009063989A1 true WO2009063989A1 (ja) | 2009-05-22 |
Family
ID=40638835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/070802 WO2009063989A1 (ja) | 2007-11-16 | 2008-11-14 | 芳香族ポリイミドフィルムおよびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100266829A1 (ja) |
JP (1) | JP2009120772A (ja) |
KR (1) | KR20100099170A (ja) |
CN (1) | CN101910250A (ja) |
TW (1) | TW200940600A (ja) |
WO (1) | WO2009063989A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102725114B (zh) * | 2010-01-26 | 2014-10-08 | 宇部兴产株式会社 | 聚酰亚胺膜的制造方法及制造装置 |
CN103442870B (zh) * | 2011-03-25 | 2015-11-25 | 宇部兴产株式会社 | 聚酰亚胺膜的制备方法、聚酰亚胺膜的制备装置及聚酰亚胺膜 |
WO2017069165A1 (ja) * | 2015-10-19 | 2017-04-27 | 宇部興産株式会社 | ポリイミド前駆体、架橋構造を有するポリイミドおよびその製造方法 |
TWI627203B (zh) * | 2017-03-31 | 2018-06-21 | 長興材料工業股份有限公司 | 聚醯亞胺前驅物組合物、其用途及由其製備之聚醯亞胺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62236827A (ja) * | 1986-04-09 | 1987-10-16 | Nitto Electric Ind Co Ltd | ポリイミドフイルムおよびその製法 |
JPH08134232A (ja) * | 1994-11-11 | 1996-05-28 | Ube Ind Ltd | ポリイミドフィルム、積層体およびフレキシブル回路用基板 |
JPH1180352A (ja) * | 1997-09-12 | 1999-03-26 | Ube Ind Ltd | 貯蔵安定性の改良された耐熱性コ−ティング組成物およびポリイミド膜 |
WO2007135982A1 (ja) * | 2006-05-19 | 2007-11-29 | Ube Industries, Ltd. | ポリイミド膜の製造方法、及びポリアミック酸溶液組成物 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4218716B2 (ja) * | 1996-04-05 | 2009-02-04 | 宇部興産株式会社 | 芳香族ポリイミド粉末、及び該芳香族ポリイミド粉末からなる成形体 |
JP3531719B2 (ja) * | 1998-10-21 | 2004-05-31 | 宇部興産株式会社 | ポリイミド樹脂成形体の製造法 |
JP3755436B2 (ja) * | 2000-07-24 | 2006-03-15 | 宇部興産株式会社 | ポリイミド成形体の製造法およびポリイミド成形体 |
JP4304854B2 (ja) * | 2000-09-21 | 2009-07-29 | 宇部興産株式会社 | 多層ポリイミドフィルムおよび積層体 |
JP4941093B2 (ja) * | 2006-05-19 | 2012-05-30 | 宇部興産株式会社 | ポリイミド膜の製造方法、及びポリアミック酸溶液組成物 |
-
2007
- 2007-11-16 JP JP2007298678A patent/JP2009120772A/ja active Pending
-
2008
- 2008-11-14 WO PCT/JP2008/070802 patent/WO2009063989A1/ja active Application Filing
- 2008-11-14 TW TW097144164A patent/TW200940600A/zh unknown
- 2008-11-14 KR KR1020107013044A patent/KR20100099170A/ko not_active Application Discontinuation
- 2008-11-14 CN CN2008801249993A patent/CN101910250A/zh active Pending
- 2008-11-14 US US12/743,031 patent/US20100266829A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62236827A (ja) * | 1986-04-09 | 1987-10-16 | Nitto Electric Ind Co Ltd | ポリイミドフイルムおよびその製法 |
JPH08134232A (ja) * | 1994-11-11 | 1996-05-28 | Ube Ind Ltd | ポリイミドフィルム、積層体およびフレキシブル回路用基板 |
JPH1180352A (ja) * | 1997-09-12 | 1999-03-26 | Ube Ind Ltd | 貯蔵安定性の改良された耐熱性コ−ティング組成物およびポリイミド膜 |
WO2007135982A1 (ja) * | 2006-05-19 | 2007-11-29 | Ube Industries, Ltd. | ポリイミド膜の製造方法、及びポリアミック酸溶液組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP2009120772A (ja) | 2009-06-04 |
KR20100099170A (ko) | 2010-09-10 |
CN101910250A (zh) | 2010-12-08 |
TW200940600A (en) | 2009-10-01 |
US20100266829A1 (en) | 2010-10-21 |
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