WO2008078620A1 - 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法 - Google Patents

新規なポリイミド前駆体組成物、その利用及びそれらの製造方法 Download PDF

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Publication number
WO2008078620A1
WO2008078620A1 PCT/JP2007/074392 JP2007074392W WO2008078620A1 WO 2008078620 A1 WO2008078620 A1 WO 2008078620A1 JP 2007074392 W JP2007074392 W JP 2007074392W WO 2008078620 A1 WO2008078620 A1 WO 2008078620A1
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Prior art keywords
polyimide precursor
precursor composition
production method
producing
polyimide
Prior art date
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PCT/JP2007/074392
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English (en)
French (fr)
Inventor
Kan Fujihara
Tetsuya Kogiso
Yoshihide Sekito
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Kaneka Corporation
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Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to US12/521,205 priority Critical patent/US8754186B2/en
Priority to KR1020097013220A priority patent/KR101451449B1/ko
Priority to JP2008551051A priority patent/JP5506017B2/ja
Priority to CN2007800484972A priority patent/CN101578320B/zh
Publication of WO2008078620A1 publication Critical patent/WO2008078620A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

　本発明の課題は、低温（２５０°C以下）で硬化可能であって高濃度にもかかわらず、低粘度であるポリイミド前駆体組成物及びその製造方法、それから得られる良好な物性を有するポリイミド塗膜及びその製造方法、さらに前記ポリイミド前駆体組成物を用いた感光性樹脂組成物及びその製造方法を提供することにある。特定構造のイミド化したテトラカルボン酸と、特定構造のジアミンとを含むことを特徴とする、ポリイミド前駆体組成物により、上記課題を解決する。                                                                     
PCT/JP2007/074392 2006-12-26 2007-12-19 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法 WO2008078620A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/521,205 US8754186B2 (en) 2006-12-26 2007-12-19 Polyimide precursor composition, use thereof and production method thereof
KR1020097013220A KR101451449B1 (ko) 2006-12-26 2007-12-19 신규 폴리이미드 전구체 조성물, 그 이용 및 그 제조 방법
JP2008551051A JP5506017B2 (ja) 2006-12-26 2007-12-19 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法
CN2007800484972A CN101578320B (zh) 2006-12-26 2007-12-19 新型聚酰亚胺前体组合物及其用途和制备方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006348775 2006-12-26
JP2006-348775 2006-12-26
JP2007-017864 2007-01-29
JP2007017864 2007-01-29
JP2007-028406 2007-02-07
JP2007028406 2007-02-07

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WO2008078620A1 true WO2008078620A1 (ja) 2008-07-03

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US (1) US8754186B2 (ja)
JP (1) JP5506017B2 (ja)
KR (1) KR101451449B1 (ja)
CN (1) CN101578320B (ja)
TW (1) TWI468434B (ja)
WO (1) WO2008078620A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009147938A1 (ja) * 2008-06-02 2009-12-10 株式会社カネカ 新規な樹脂組成物及びその利用
JP2010001352A (ja) * 2008-06-19 2010-01-07 Kaneka Corp 新規なポリイミド前駆体組成物及びその利用
WO2011008036A2 (ko) * 2009-07-15 2011-01-20 주식회사 엘지화학 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물
WO2011059089A1 (ja) * 2009-11-16 2011-05-19 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及び該ポリイミド前駆体を含む感光性樹脂組成物
WO2011089922A1 (ja) * 2010-01-25 2011-07-28 三井化学株式会社 ポリイミド樹脂組成物、それを含む接着剤、積層体およびデバイス
JP2013101741A (ja) * 2011-10-18 2013-05-23 Dainippon Printing Co Ltd 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
JP2015074660A (ja) * 2013-10-04 2015-04-20 旭化成イーマテリアルズ株式会社 樹脂組成物、積層体、プリント配線板、及びその製造方法

Families Citing this family (12)

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WO2008132960A1 (ja) * 2007-04-19 2008-11-06 Kaneka Corporation 新規なポリイミド前駆体組成物及びその利用
US9822088B2 (en) * 2011-03-30 2017-11-21 The United States Of America As Represented By The Administrator Of Nasa Anisotropic copoly(imide oxetane) coatings and articles of manufacture, copoly(imide oxetane)s containing pendant fluorocarbon moieties, oligomers and processes therefor
CN105602247B (zh) * 2012-01-20 2018-05-08 旭化成株式会社 树脂组合物、层积体、多层印刷线路板和多层柔性线路板及其制造方法
TWI488887B (zh) * 2013-02-08 2015-06-21 長興材料工業股份有限公司 聚醯亞胺，由此形成之塗料組合物及其用途
CN105273614B (zh) * 2015-10-12 2017-08-22 广东省宜华木业股份有限公司 室温反应制备用于木质材料表面uv超疏水聚酰亚胺涂料
JP6828242B2 (ja) * 2016-01-26 2021-02-10 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板
WO2018058342A1 (en) 2016-09-28 2018-04-05 Dow Global Technologies Llc Solvent systems for synthesis of poly(amic acid) and polyimide polymers
KR102187162B1 (ko) * 2017-12-14 2020-12-04 주식회사 엘지화학 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체
CN108997581A (zh) * 2018-09-12 2018-12-14 北京工商大学 一种含硅聚酰亚胺型高分子成炭剂及其制备方法
CN112142974B (zh) * 2019-06-28 2022-08-16 哈钦森技术股份有限公司 改进光敏聚酰亚胺的伸长率的扩链剂及其配制物
CN111393379B (zh) * 2020-04-22 2021-09-28 深圳先进电子材料国际创新研究院 二胺化合物及感光性树脂
KR102219722B1 (ko) 2020-05-04 2021-02-24 에스케이이노베이션 주식회사 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널

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JP2001089656A (ja) * 1999-09-22 2001-04-03 Ube Ind Ltd ポリイミド系絶縁膜用組成物、絶縁膜および絶縁膜の形成法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009147938A1 (ja) * 2008-06-02 2009-12-10 株式会社カネカ 新規な樹脂組成物及びその利用
US9458279B2 (en) 2008-06-02 2016-10-04 Kaneka Corporation Resin composition and use thereof
JP2010001352A (ja) * 2008-06-19 2010-01-07 Kaneka Corp 新規なポリイミド前駆体組成物及びその利用
KR101249685B1 (ko) * 2009-07-15 2013-04-05 주식회사 엘지화학 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물
WO2011008036A3 (ko) * 2009-07-15 2011-06-23 주식회사 엘지화학 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물
CN102365314A (zh) * 2009-07-15 2012-02-29 株式会社Lg化学 光敏性聚酰亚胺以及含有该光敏性聚酰亚胺的光敏树脂组合物
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WO2011059089A1 (ja) * 2009-11-16 2011-05-19 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及び該ポリイミド前駆体を含む感光性樹脂組成物
KR101392539B1 (ko) 2009-11-16 2014-05-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물
JP5758300B2 (ja) * 2009-11-16 2015-08-05 旭化成イーマテリアルズ株式会社 ポリイミド前駆体を含む感光性樹脂組成物、感光性フィルム、カバーレイ、及びフレキシブルプリント配線板並びにその積層体
WO2011089922A1 (ja) * 2010-01-25 2011-07-28 三井化学株式会社 ポリイミド樹脂組成物、それを含む接着剤、積層体およびデバイス
JP2013101741A (ja) * 2011-10-18 2013-05-23 Dainippon Printing Co Ltd 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
JP2015074660A (ja) * 2013-10-04 2015-04-20 旭化成イーマテリアルズ株式会社 樹脂組成物、積層体、プリント配線板、及びその製造方法

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US8754186B2 (en) 2014-06-17
US20100084171A1 (en) 2010-04-08
KR20090094828A (ko) 2009-09-08
TW200900432A (en) 2009-01-01
TWI468434B (zh) 2015-01-11
KR101451449B1 (ko) 2014-10-15
JPWO2008078620A1 (ja) 2010-05-20
CN101578320A (zh) 2009-11-11
JP5506017B2 (ja) 2014-05-28

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