WO2011008036A3 - 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물 - Google Patents

감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물 Download PDF

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Publication number
WO2011008036A3
WO2011008036A3 PCT/KR2010/004614 KR2010004614W WO2011008036A3 WO 2011008036 A3 WO2011008036 A3 WO 2011008036A3 KR 2010004614 W KR2010004614 W KR 2010004614W WO 2011008036 A3 WO2011008036 A3 WO 2011008036A3
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WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
polyimide
photosensitive
same
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PCT/KR2010/004614
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English (en)
French (fr)
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WO2011008036A2 (ko
Inventor
조정호
김경준
성혜란
정혜원
박찬효
김유나
김상우
신세진
안경호
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주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201080015504.0A priority Critical patent/CN102365314B/zh
Priority to JP2011547829A priority patent/JP5450658B2/ja
Priority to US12/861,761 priority patent/US8470914B2/en
Publication of WO2011008036A2 publication Critical patent/WO2011008036A2/ko
Publication of WO2011008036A3 publication Critical patent/WO2011008036A3/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)

Abstract

본 발명은 화학식 1 또는 2로 표시되는 폴리이미드 또는 그 전구체 및 이를 포함하는 감광성 수지 조성물에 관한 것이다. 상기 폴리이미드 또는 그 전구체는 폴리알킬렌옥사이드를 포함하는 디아민으로부터 제조되는 것을 특징으로 한다. 본 발명의 감광성 수지 조성물은 광투과도가 우수하여 해상력이 뛰어나고 광감도와 이미지 형성능이 우수할 뿐만 아니라, 실리콘 막 또는 실리콘 산화막 내지 금속 막과 같은 기판에 높은 밀착성을 나타낸다. 특히, 크랙 등의 불량이 없는 우수한 필름을 형성할 수 있다.
PCT/KR2010/004614 2009-07-15 2010-07-15 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물 WO2011008036A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201080015504.0A CN102365314B (zh) 2009-07-15 2010-07-15 光敏性聚酰亚胺以及含有该光敏性聚酰亚胺的光敏树脂组合物
JP2011547829A JP5450658B2 (ja) 2009-07-15 2010-07-15 感光性ポリイミドおよびそれを含む感光性樹脂組成物
US12/861,761 US8470914B2 (en) 2009-07-15 2010-08-23 Photosensitive polyimide and photosensitive resin composition comprising the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2009-0064604 2009-07-15
KR20090064604 2009-07-15
KR10-2009-0073017 2009-08-07
KR20090073017 2009-08-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/861,761 Continuation US8470914B2 (en) 2009-07-15 2010-08-23 Photosensitive polyimide and photosensitive resin composition comprising the same

Publications (2)

Publication Number Publication Date
WO2011008036A2 WO2011008036A2 (ko) 2011-01-20
WO2011008036A3 true WO2011008036A3 (ko) 2011-06-23

Family

ID=43449980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/004614 WO2011008036A2 (ko) 2009-07-15 2010-07-15 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물

Country Status (6)

Country Link
US (1) US8470914B2 (ko)
JP (1) JP5450658B2 (ko)
KR (1) KR101249685B1 (ko)
CN (1) CN102365314B (ko)
TW (1) TWI425027B (ko)
WO (1) WO2011008036A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101304590B1 (ko) * 2010-03-11 2013-09-05 주식회사 엘지화학 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
CN102336910B (zh) * 2010-07-14 2015-04-08 株式会社Lg化学 可低温固化的聚酰亚胺树脂及其制备方法
KR101882217B1 (ko) * 2011-10-18 2018-07-26 주식회사 동진쎄미켐 오엘이디용 폴리이미드 감광성 수지 조성물
PT2902847T (pt) 2012-09-25 2019-08-06 Toray Industries Composição positiva da resina fotosensível e método para produção de dispositivo semicondutor contendo uma película curada utilizando a referida composição
CN105762119A (zh) * 2014-12-18 2016-07-13 碁達科技股份有限公司 半导体封装用化合物、感光树脂组成物及半导体封装结构
KR20170125352A (ko) * 2015-03-06 2017-11-14 도레이 카부시키가이샤 감광성 수지 조성물 및 전자 부품
KR102433114B1 (ko) * 2016-05-02 2022-08-17 주식회사 이엔에프테크놀로지 신너 조성물
WO2021192802A1 (ja) * 2020-03-26 2021-09-30 富士フイルム株式会社 感放射線性樹脂組成物の製造方法、パターン形成方法

Citations (6)

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Publication number Priority date Publication date Assignee Title
US4778859A (en) * 1985-04-27 1988-10-18 Asahi Kasei Kogyo Kabushiki Kaisha Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom
US5288588A (en) * 1989-10-27 1994-02-22 Nissan Chemical Industries Ltd. Positive photosensitive polyimide resin composition comprising an o-quinone diazide as a photosensitive compound
US20040197699A1 (en) * 2001-09-26 2004-10-07 Tomonari Nakayama Positive photosensitive polyimide resin composition
WO2008078620A1 (ja) * 2006-12-26 2008-07-03 Kaneka Corporation 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法
WO2008132960A1 (ja) * 2007-04-19 2008-11-06 Kaneka Corporation 新規なポリイミド前駆体組成物及びその利用
WO2009145065A1 (ja) * 2008-05-20 2009-12-03 株式会社カネカ 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法

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JP3257325B2 (ja) * 1995-01-31 2002-02-18 ジェイエスアール株式会社 ポリイミド系共重合体の製造方法、薄膜形成剤、並びに液晶配向膜の製造方法
TW567198B (en) * 1999-12-28 2003-12-21 Kaneka Corp Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
TW200300772A (en) * 2001-12-11 2003-06-16 Kaneka Corp Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor
JP2006160958A (ja) * 2004-12-09 2006-06-22 Kaneka Corp ポリイミド前駆体およびそれを用いた感光性樹脂組成物
KR101115058B1 (ko) * 2008-07-09 2012-02-13 주식회사 엘지화학 폴리이미드-폴리아믹산 공중합체, 이의 제조방법, 이를포함하는 감광성 조성물 및 이에 의해 제공된 보호막

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778859A (en) * 1985-04-27 1988-10-18 Asahi Kasei Kogyo Kabushiki Kaisha Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom
US5288588A (en) * 1989-10-27 1994-02-22 Nissan Chemical Industries Ltd. Positive photosensitive polyimide resin composition comprising an o-quinone diazide as a photosensitive compound
US20040197699A1 (en) * 2001-09-26 2004-10-07 Tomonari Nakayama Positive photosensitive polyimide resin composition
WO2008078620A1 (ja) * 2006-12-26 2008-07-03 Kaneka Corporation 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法
WO2008132960A1 (ja) * 2007-04-19 2008-11-06 Kaneka Corporation 新規なポリイミド前駆体組成物及びその利用
WO2009145065A1 (ja) * 2008-05-20 2009-12-03 株式会社カネカ 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法

Also Published As

Publication number Publication date
TW201109366A (en) 2011-03-16
KR101249685B1 (ko) 2013-04-05
TWI425027B (zh) 2014-02-01
US20110046277A1 (en) 2011-02-24
KR20110007066A (ko) 2011-01-21
JP2012516374A (ja) 2012-07-19
US8470914B2 (en) 2013-06-25
JP5450658B2 (ja) 2014-03-26
WO2011008036A2 (ko) 2011-01-20
CN102365314B (zh) 2014-01-08
CN102365314A (zh) 2012-02-29

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