WO2011025305A3 - 신규한 폴리아믹산, 폴리이미드, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름 - Google Patents

신규한 폴리아믹산, 폴리이미드, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름 Download PDF

Info

Publication number
WO2011025305A3
WO2011025305A3 PCT/KR2010/005793 KR2010005793W WO2011025305A3 WO 2011025305 A3 WO2011025305 A3 WO 2011025305A3 KR 2010005793 W KR2010005793 W KR 2010005793W WO 2011025305 A3 WO2011025305 A3 WO 2011025305A3
Authority
WO
WIPO (PCT)
Prior art keywords
composition
photosensitive resin
polyamic acid
dry film
film produced
Prior art date
Application number
PCT/KR2010/005793
Other languages
English (en)
French (fr)
Other versions
WO2011025305A2 (ko
Inventor
이광주
경유진
고주은
송헌식
심정진
김희정
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2011549083A priority Critical patent/JP2012516927A/ja
Priority to CN2010800133145A priority patent/CN102361913B/zh
Publication of WO2011025305A2 publication Critical patent/WO2011025305A2/ko
Publication of WO2011025305A3 publication Critical patent/WO2011025305A3/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

본 발명은 열중합성 또는 광중합성 관능기를 포함하는 신규한 폴리아믹산, 고해상도의 패턴 형성이 가능하고 알칼리계 수용액에 의한 현상성이 우수하며 가요성, 밀착성, 용접 내열성, PCT (Pressure cooker test) 내성이 우수한 경화 도막을 제공할 수 있는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름에 관한 것이다.
PCT/KR2010/005793 2009-08-28 2010-08-27 신규한 폴리아믹산, 폴리이미드, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름 WO2011025305A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011549083A JP2012516927A (ja) 2009-08-28 2010-08-27 新規なポリアミック酸、ポリイミド、これを含む感光性樹脂組成物およびこれから製造されたドライフィルム
CN2010800133145A CN102361913B (zh) 2009-08-28 2010-08-27 聚酰胺酸、聚酰亚胺、包含其的感光树脂组合物以及由其制备的干燥膜

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090080606 2009-08-28
KR10-2009-0080606 2009-08-28
KR10-2010-0046602 2010-05-18
KR1020100046602A KR101010036B1 (ko) 2009-08-28 2010-05-18 신규한 폴리아믹산, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름

Publications (2)

Publication Number Publication Date
WO2011025305A2 WO2011025305A2 (ko) 2011-03-03
WO2011025305A3 true WO2011025305A3 (ko) 2011-07-14

Family

ID=43616635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/005793 WO2011025305A2 (ko) 2009-08-28 2010-08-27 신규한 폴리아믹산, 폴리이미드, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름

Country Status (6)

Country Link
US (2) US20110200939A1 (ko)
JP (1) JP2012516927A (ko)
KR (1) KR101010036B1 (ko)
CN (1) CN102361913B (ko)
TW (1) TW201116554A (ko)
WO (1) WO2011025305A2 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5878621B2 (ja) 2011-03-18 2016-03-08 エルジー・ケム・リミテッド 新規なポリアミック酸、感光性樹脂組成物、ドライフィルムおよび回路基板
WO2013165211A1 (ko) * 2012-05-03 2013-11-07 주식회사 엘지화학 신규한 폴리아믹산, 감광성 수지 조성물, 드라이 필름 및 회로 기판
US9410017B2 (en) 2012-05-03 2016-08-09 Lg Chem, Ltd. Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
KR101545724B1 (ko) * 2012-08-01 2015-08-19 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
WO2014021590A1 (ko) * 2012-08-01 2014-02-06 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
JP2014218651A (ja) * 2013-04-08 2014-11-20 Jnc株式会社 熱硬化性組成物
CN105408417B (zh) * 2013-07-25 2017-08-25 捷恩智株式会社 热硬化性树脂组合物、硬化膜、带硬化膜的基板以及电子零件
JP6572770B2 (ja) * 2013-10-09 2019-09-11 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、及びそれを用いた硬化膜の製造方法
JP6462983B2 (ja) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
US10719016B2 (en) 2015-08-21 2020-07-21 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition, polyimide production method, and semiconductor device
KR102147108B1 (ko) * 2016-06-02 2020-08-25 후지필름 가부시키가이샤 적층체의 제조 방법, 반도체 소자의 제조 방법 및 적층체
WO2018097625A2 (ko) 2016-11-28 2018-05-31 주식회사 엘지화학 액정 배향막, 이의 제조방법 및 이를 이용한 액정표시소자
KR102066549B1 (ko) * 2016-12-01 2020-01-15 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
US10264586B2 (en) * 2016-12-09 2019-04-16 At&T Mobility Ii Llc Cloud-based packet controller and methods for use therewith
KR102087261B1 (ko) 2017-02-16 2020-03-10 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
US20180259850A1 (en) * 2017-03-10 2018-09-13 Tokyo Ohka Kogyo Co., Ltd. Method for forming patterned cured film, photosensitive composition, dry film, and method for producing plated shaped article
CN106990673B (zh) * 2017-04-20 2021-06-11 浙江福斯特新材料研究院有限公司 一种透明、感光性聚酰亚胺树脂组合物
TWI635359B (zh) * 2017-06-02 2018-09-11 律勝科技股份有限公司 感光性聚醯亞胺樹脂組合物及應用其之覆蓋膜的製造方法
KR102065718B1 (ko) 2017-10-17 2020-02-11 주식회사 엘지화학 액정 배향막 및 이를 이용한 액정표시소자
CN110515269B (zh) * 2018-05-22 2022-12-20 臻鼎科技股份有限公司 感光树脂组合物及其制备方法、高分子膜及覆铜板
WO2020184424A1 (ja) * 2019-03-08 2020-09-17 日産化学株式会社 液晶配向処理剤、液晶配向膜及び液晶表示素子
CN110804181B (zh) * 2019-11-06 2021-04-20 中山大学 一种透明光敏聚酰亚胺树脂、聚酰亚胺薄膜及其制备方法
JP7332076B1 (ja) 2022-03-18 2023-08-23 日産化学株式会社 絶縁膜形成用感光性樹脂組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000098604A (ja) * 1998-09-17 2000-04-07 Mitsui Chemicals Inc 感光性樹脂組成物
KR20040046229A (ko) * 2002-11-26 2004-06-05 한국화학연구원 감광성 투명 폴리아믹산 유도체와 폴리이미드계 수지
KR20040083610A (ko) * 2003-03-24 2004-10-06 주식회사 엘지화학 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물
KR20050038109A (ko) * 2003-10-21 2005-04-27 한국화학연구원 평탄화 특성이 우수한 감광성 투명 폴리아믹산 올리고머와이를 경화하여 제조된 폴리이미드 수지
KR100529577B1 (ko) * 2001-11-22 2005-11-17 미쓰이 가가쿠 가부시키가이샤 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품
KR20090019739A (ko) * 2007-08-20 2009-02-25 주식회사 엘지화학 알칼리 수용액으로 현상 가능한 감광성 수지 조성물 및 이에 의해 제조된 드라이 필름

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59220729A (ja) * 1983-05-30 1984-12-12 Ube Ind Ltd 有機溶媒可溶性の感光性ポリイミド
JPS6072925A (ja) * 1983-09-30 1985-04-25 Ube Ind Ltd 有機溶媒可溶性の感光性ポリイミド
JPH01118514A (ja) * 1987-11-02 1989-05-11 Hitachi Chem Co Ltd 感光性樹脂組成物
JP2862627B2 (ja) * 1990-03-26 1999-03-03 住友ベークライト株式会社 感光性樹脂組成物及びパターン形成方法
JPH1118514A (ja) * 1997-07-04 1999-01-26 Aguri Techno Yazaki Kk 乾田直播装置及び直播方法
JP2000147761A (ja) * 1998-11-11 2000-05-26 Hitachi Ltd 感光性ポリイミド組成物、およびそれを用いたパターン形成方法
JP2000347404A (ja) * 1999-06-02 2000-12-15 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物並びにこれを用いた電子部品及びその製造法
US6849385B2 (en) * 2001-07-03 2005-02-01 Hitachi Chemical Co., Ltd. Photosensitive resin composition, process of forming patterns with the same, and electronic components
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
JP2006193691A (ja) * 2005-01-17 2006-07-27 Nippon Kayaku Co Ltd 感光性ポリアミド酸及びこれを含有する感光性組成物
JP4776486B2 (ja) 2006-09-28 2011-09-21 旭化成イーマテリアルズ株式会社 感光性ポリアミド酸エステル組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000098604A (ja) * 1998-09-17 2000-04-07 Mitsui Chemicals Inc 感光性樹脂組成物
KR100529577B1 (ko) * 2001-11-22 2005-11-17 미쓰이 가가쿠 가부시키가이샤 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품
KR20040046229A (ko) * 2002-11-26 2004-06-05 한국화학연구원 감광성 투명 폴리아믹산 유도체와 폴리이미드계 수지
KR20040083610A (ko) * 2003-03-24 2004-10-06 주식회사 엘지화학 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물
KR20050038109A (ko) * 2003-10-21 2005-04-27 한국화학연구원 평탄화 특성이 우수한 감광성 투명 폴리아믹산 올리고머와이를 경화하여 제조된 폴리이미드 수지
KR20090019739A (ko) * 2007-08-20 2009-02-25 주식회사 엘지화학 알칼리 수용액으로 현상 가능한 감광성 수지 조성물 및 이에 의해 제조된 드라이 필름

Also Published As

Publication number Publication date
US20120012366A1 (en) 2012-01-19
CN102361913B (zh) 2013-11-13
TW201116554A (en) 2011-05-16
US20110200939A1 (en) 2011-08-18
CN102361913A (zh) 2012-02-22
JP2012516927A (ja) 2012-07-26
KR101010036B1 (ko) 2011-01-21
WO2011025305A2 (ko) 2011-03-03

Similar Documents

Publication Publication Date Title
WO2011025305A3 (ko) 신규한 폴리아믹산, 폴리이미드, 이를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름
WO2008084747A3 (en) Solventless cured release coating-forming organopolysiloxane composition and sheet-form substrate having cured release coating
NZ720549A (en) Adhesive formulation and creping methods using same
WO2011133000A3 (en) Super-hydrorepellent coating composition, super-hydrorepellent coating layer including cured product of the super-hydrorepellent coating composition, and heat exchanger including the super-hydrorepellent coating layer
WO2008143302A1 (ja) レジスト下層膜形成用組成物
EP2280041A3 (de) Kondensation vernetzende Siliconmassen
BRPI0911184A2 (pt) revestimentos rígidos, porém flexíveis e substratos revestidos com os mesmos
WO2012070796A3 (ko) 터치패널용 점착제 조성물, 점착필름 및 터치패널
WO2008078620A1 (ja) 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法
WO2010041909A3 (ko) 고분자 및 이의 제조방법
WO2009126592A3 (en) Fuel system components
ATE510873T1 (de) Verwendung hochfunktioneller, hochverzweigter polyetheraminpolyole zur beschichtung von oberflächen
WO2008102113A3 (en) Printed circuit boards
WO2008103776A3 (en) Thermally cured underlayer for lithographic application
WO2007103775A3 (en) Biomaterials having nanoscale layers and coatings
MY155358A (en) Resin compound for forming adhesive layer of multilayered flexible printed wiring board
WO2008126818A1 (ja) 感光性樹脂組成物
ATE511528T1 (de) Wässrige siliciumdioxid dispersionen für klebstoffformulierungen
WO2014055578A3 (en) Coating compositions and articles made therefrom
ATE524521T1 (de) Zwei- oder mehrkomponentige vergussmasse
TW200728916A (en) Photosensitive resin composition and cured object obtained thereof
EP2345681A4 (en) COPOLYURETHANE RESIN WITH A POLYMILIC ACID SEGMENT AS WELL AS AQUEOUS EMULSION AND COATING LIQUID COMPOSITION THEREWITH
IL217702A0 (en) Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the same
WO2012128526A3 (ko) 신규한 폴리아믹산, 감광성 수지 조성물, 드라이 필름 및 회로 기판
TW200745194A (en) Epoxy resin hardener and epoxy resin composition

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080013314.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10812318

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2011549083

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10812318

Country of ref document: EP

Kind code of ref document: A2