ATE170307T1 - Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul - Google Patents

Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul

Info

Publication number
ATE170307T1
ATE170307T1 AT95920907T AT95920907T ATE170307T1 AT E170307 T1 ATE170307 T1 AT E170307T1 AT 95920907 T AT95920907 T AT 95920907T AT 95920907 T AT95920907 T AT 95920907T AT E170307 T1 ATE170307 T1 AT E170307T1
Authority
AT
Austria
Prior art keywords
module
pct
electronic circuit
sec
sheets
Prior art date
Application number
AT95920907T
Other languages
English (en)
Inventor
Ake Gustafson
Original Assignee
Ake Gustafson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ake Gustafson filed Critical Ake Gustafson
Application granted granted Critical
Publication of ATE170307T1 publication Critical patent/ATE170307T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Textile Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Bipolar Transistors (AREA)
AT95920907T 1994-05-27 1995-05-29 Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul ATE170307T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP94810312 1994-05-27

Publications (1)

Publication Number Publication Date
ATE170307T1 true ATE170307T1 (de) 1998-09-15

Family

ID=8218261

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95920907T ATE170307T1 (de) 1994-05-27 1995-05-29 Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul

Country Status (11)

Country Link
US (1) US5879502A (de)
EP (1) EP0760986B1 (de)
JP (1) JP3866282B2 (de)
AT (1) ATE170307T1 (de)
AU (1) AU684174B2 (de)
BR (1) BR9507775A (de)
CA (1) CA2190294C (de)
DE (1) DE69504336T2 (de)
DK (1) DK0760986T3 (de)
ES (1) ES2122620T3 (de)
WO (1) WO1995033246A1 (de)

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Also Published As

Publication number Publication date
DE69504336T2 (de) 1999-01-21
JPH10501475A (ja) 1998-02-10
WO1995033246A1 (fr) 1995-12-07
DK0760986T3 (da) 1999-05-25
CA2190294A1 (fr) 1995-12-07
EP0760986B1 (de) 1998-08-26
AU684174B2 (en) 1997-12-04
BR9507775A (pt) 1997-08-19
AU2617095A (en) 1995-12-21
EP0760986A1 (de) 1997-03-12
CA2190294C (fr) 2005-07-12
ES2122620T3 (es) 1998-12-16
US5879502A (en) 1999-03-09
DE69504336D1 (de) 1998-10-01
JP3866282B2 (ja) 2007-01-10

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Legal Events

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UEP Publication of translation of european patent specification
EEIH Change in the person of patent owner
EEIH Change in the person of patent owner
EEIH Change in the person of patent owner
REN Ceased due to non-payment of the annual fee