DE69504336T2 - Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul - Google Patents

Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul

Info

Publication number
DE69504336T2
DE69504336T2 DE69504336T DE69504336T DE69504336T2 DE 69504336 T2 DE69504336 T2 DE 69504336T2 DE 69504336 T DE69504336 T DE 69504336T DE 69504336 T DE69504336 T DE 69504336T DE 69504336 T2 DE69504336 T2 DE 69504336T2
Authority
DE
Germany
Prior art keywords
module
pct
electronic circuit
sec
sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69504336T
Other languages
English (en)
Other versions
DE69504336D1 (de
Inventor
Ake Gustafson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Assa Abloy AB
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE69504336D1 publication Critical patent/DE69504336D1/de
Application granted granted Critical
Publication of DE69504336T2 publication Critical patent/DE69504336T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109Embedding of laminae within face of additional laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Textile Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Bipolar Transistors (AREA)
DE69504336T 1994-05-27 1995-05-29 Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul Expired - Lifetime DE69504336T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94810312 1994-05-27
PCT/EP1995/002038 WO1995033246A1 (fr) 1994-05-27 1995-05-29 Procede de realisation d'un module electronique et module electronique obtenu selon ce procede

Publications (2)

Publication Number Publication Date
DE69504336D1 DE69504336D1 (de) 1998-10-01
DE69504336T2 true DE69504336T2 (de) 1999-01-21

Family

ID=8218261

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69504336T Expired - Lifetime DE69504336T2 (de) 1994-05-27 1995-05-29 Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul

Country Status (11)

Country Link
US (1) US5879502A (de)
EP (1) EP0760986B1 (de)
JP (1) JP3866282B2 (de)
AT (1) ATE170307T1 (de)
AU (1) AU684174B2 (de)
BR (1) BR9507775A (de)
CA (1) CA2190294C (de)
DE (1) DE69504336T2 (de)
DK (1) DK0760986T3 (de)
ES (1) ES2122620T3 (de)
WO (1) WO1995033246A1 (de)

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EP1068589B1 (de) 1998-04-02 2001-11-14 Swisscom Mobile AG Verfahren zum laden von daten auf chipkarten und entsprechend angepasste vorrichtungen
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
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ATE464620T1 (de) * 1999-01-04 2010-04-15 Ident Technology Gmbh X Verbundmaterialeinheiten mit transponder
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
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US6304232B1 (en) 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
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US6357664B1 (en) 2001-05-24 2002-03-19 Identicard Systems Incorporated Identification card utilizing an integrated circuit
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
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US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
CA2652104C (en) * 2001-12-24 2012-02-14 Digimarc Id Systems, Llc Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same
EP1459239B1 (de) 2001-12-24 2012-04-04 L-1 Secure Credentialing, Inc. Verdeckte variableninformationen auf id-dokumenten und verfahren zu ihrer herstellung
US7793846B2 (en) 2001-12-24 2010-09-14 L-1 Secure Credentialing, Inc. Systems, compositions, and methods for full color laser engraving of ID documents
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
WO2003055638A1 (en) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Laser etched security features for identification documents and methods of making same
WO2003088144A2 (en) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
US6702185B1 (en) 2002-11-13 2004-03-09 Identicard Systems, Incorporated Identification device having an integrated circuit
US7135979B2 (en) * 2002-11-14 2006-11-14 Brady Worldwide, Inc. In-mold radio frequency identification device label
AU2003298731A1 (en) 2002-11-26 2004-06-18 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
US7712673B2 (en) 2002-12-18 2010-05-11 L-L Secure Credentialing, Inc. Identification document with three dimensional image of bearer
DE602004030434D1 (de) 2003-04-16 2011-01-20 L 1 Secure Credentialing Inc Dreidimensionale datenspeicherung
JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
JP2006298144A (ja) * 2005-04-20 2006-11-02 Nippon Sheet Glass Co Ltd パネルおよびパネルの製造方法
WO2007131383A1 (de) 2006-05-17 2007-11-22 Landqart Flexibler schichtaufbau mit integriertem schaltkreis
EP1970951A3 (de) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Herstellungsverfahren dafür
EP1970952A3 (de) 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Herstellungsverfahren dafür
EP1976000A3 (de) * 2007-03-26 2009-05-13 Semiconductor Energy Laboratory Co., Ltd. Herstellungsverfahren für Halbleitervorrichtung
JP5268395B2 (ja) * 2007-03-26 2013-08-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN101543152A (zh) * 2007-06-19 2009-09-23 株式会社村田制作所 元器件内置基板的制造方法及元器件内置基板
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WO2009142310A1 (en) * 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8563397B2 (en) * 2008-07-09 2013-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101925772B1 (ko) * 2008-07-10 2018-12-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
WO2010032611A1 (en) * 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
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KR101732397B1 (ko) * 2009-06-05 2017-05-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광전 변환 장치 및 그의 제작 방법
KR101677076B1 (ko) * 2009-06-05 2016-11-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광전 변환 디바이스 및 그 제조 방법
CN102460722B (zh) * 2009-06-05 2015-04-01 株式会社半导体能源研究所 光电转换装置及其制造方法
TWI517268B (zh) 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
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Also Published As

Publication number Publication date
DE69504336D1 (de) 1998-10-01
AU2617095A (en) 1995-12-21
ATE170307T1 (de) 1998-09-15
WO1995033246A1 (fr) 1995-12-07
CA2190294C (fr) 2005-07-12
ES2122620T3 (es) 1998-12-16
EP0760986A1 (de) 1997-03-12
DK0760986T3 (da) 1999-05-25
US5879502A (en) 1999-03-09
AU684174B2 (en) 1997-12-04
EP0760986B1 (de) 1998-08-26
JPH10501475A (ja) 1998-02-10
CA2190294A1 (fr) 1995-12-07
BR9507775A (pt) 1997-08-19
JP3866282B2 (ja) 2007-01-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ASSA ABLOY EAST EUROPE AG, STOCKHOLM, SE

8381 Inventor (new situation)

Inventor name: GUSTAFSON, AKE, CHATEL.ST-DENIS, CH

8327 Change in the person/name/address of the patent owner

Owner name: ASSA ABLOY IDENTIFICATION TECHNOLOGY GROUP AB, STO

8327 Change in the person/name/address of the patent owner

Owner name: ASSA ABLOY AB, STOCKHOLM, SE