MX9800075A - Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo. - Google Patents
Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo.Info
- Publication number
- MX9800075A MX9800075A MX9800075A MX9800075A MX9800075A MX 9800075 A MX9800075 A MX 9800075A MX 9800075 A MX9800075 A MX 9800075A MX 9800075 A MX9800075 A MX 9800075A MX 9800075 A MX9800075 A MX 9800075A
- Authority
- MX
- Mexico
- Prior art keywords
- integrated circuit
- circuit chip
- webs
- chip card
- manufacture
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Una tarjeta de oblea portadora de circuito integrado realizada por medio de la union de una pluralidad de membranas y formando una cavidad de modulo de oblea portadora de circuito integrado que presenta las paredes laterales de conformacion complementaria a los laterales del estrato de contacto de un modulo de oblea portadora de circuito integrado para lograr una relacion de alojamiento. Un método y un sistema de fabricacion de una tarjeta de oblea portadora de circuito integrado en donde las membranas que forman la membrana podrían ser procesadas en forma paralela y en donde una de dichas membranas presenta integrada a la misma y pre-montada, modulos de oblea de circuito integrado para la laminacion subsecuente con otras membranas en donde el registro o ajuste de las membranas y el alojamiento o asentamiento del modulo de oblea portadora de circuito integrado dentro de una cavidad ocurre sustancialmente al mismo tiempo, y mientras los medios de soldadura químico los mismos permanecen fluidos y abiertos. Las tarjetas pueden ser cortadas a partir de un laminado tras la soldadura química no ha sido aun curada.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US96295P | 1995-07-07 | 1995-07-07 | |
PCT/US1996/012009 WO1997003466A1 (en) | 1995-07-07 | 1996-07-05 | Integrated circuit chip card and the method and system for the manufacture of same |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9800075A true MX9800075A (es) | 1998-04-30 |
Family
ID=21693739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9800075A MX9800075A (es) | 1995-07-07 | 1996-07-05 | Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo. |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP0839388A1 (es) |
JP (1) | JPH11515119A (es) |
AR (1) | AR002776A1 (es) |
AU (1) | AU6591196A (es) |
CA (1) | CA2226225A1 (es) |
CO (1) | CO4480044A1 (es) |
EG (1) | EG21356A (es) |
MX (1) | MX9800075A (es) |
TW (1) | TW381236B (es) |
WO (1) | WO1997003466A1 (es) |
ZA (1) | ZA965751B (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
JP4739561B2 (ja) * | 2001-03-30 | 2011-08-03 | 日本電産サーボ株式会社 | ラミネータ装置 |
US6586078B2 (en) * | 2001-07-05 | 2003-07-01 | Soundcraft, Inc. | High pressure lamination of electronic cards |
FR2895116B1 (fr) * | 2005-12-16 | 2009-05-22 | Oberthur Card Syst Sa | Procede de fabrication de cartes a microcircuit |
JP5487609B2 (ja) * | 2007-12-28 | 2014-05-07 | 株式会社リコー | 可逆性感熱記録媒体 |
WO2013166641A1 (en) | 2012-05-07 | 2013-11-14 | Sandisk Semiconductor (Shanghai) Co., Ltd. | Semiconductor die laminating device with independent drives |
EP3162534B1 (en) * | 2015-10-29 | 2020-08-26 | SMP Deutschland GmbH | Method for producing a plastic surface with an integrated decoration |
EP3923194A4 (en) * | 2019-02-08 | 2022-03-30 | Zuiko Corporation | CARD MAKING PROCESS |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1204213A (en) * | 1982-09-09 | 1986-05-06 | Masahiro Takeda | Memory card having static electricity protection |
US4539472A (en) * | 1984-01-06 | 1985-09-03 | Horizon Technology, Inc. | Data processing card system and method of forming same |
EP0246893A3 (en) * | 1986-05-21 | 1989-03-22 | Hitachi, Ltd. | Semiconductor device comprising an insulating wiring substrate and method of manufacturing it |
JPS63149191A (ja) * | 1986-12-15 | 1988-06-21 | 日立マクセル株式会社 | Icカ−ド |
JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Icカードの製造方法およびicカード |
WO1994004376A1 (en) * | 1992-08-12 | 1994-03-03 | Oki Electric Industry Co., Ltd. | Ic card |
US5422514A (en) * | 1993-05-11 | 1995-06-06 | Micromodule Systems, Inc. | Packaging and interconnect system for integrated circuits |
US5502892A (en) * | 1994-07-01 | 1996-04-02 | Maxconn Incorporated | Method of forming a welded encasement for a computer card |
-
1996
- 1996-07-03 TW TW085108037A patent/TW381236B/zh not_active IP Right Cessation
- 1996-07-05 ZA ZA965751A patent/ZA965751B/xx unknown
- 1996-07-05 MX MX9800075A patent/MX9800075A/es unknown
- 1996-07-05 AU AU65911/96A patent/AU6591196A/en not_active Abandoned
- 1996-07-05 CA CA002226225A patent/CA2226225A1/en not_active Abandoned
- 1996-07-05 CO CO96035361A patent/CO4480044A1/es unknown
- 1996-07-05 EP EP96925392A patent/EP0839388A1/en not_active Withdrawn
- 1996-07-05 WO PCT/US1996/012009 patent/WO1997003466A1/en not_active Application Discontinuation
- 1996-07-05 JP JP9506028A patent/JPH11515119A/ja active Pending
- 1996-07-07 EG EG64696A patent/EG21356A/xx active
- 1996-08-07 AR ARP960103487A patent/AR002776A1/es not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
ZA965751B (en) | 1997-01-27 |
CA2226225A1 (en) | 1997-01-30 |
WO1997003466A1 (en) | 1997-01-30 |
AU6591196A (en) | 1997-02-10 |
EP0839388A1 (en) | 1998-05-06 |
AR002776A1 (es) | 1998-04-29 |
CO4480044A1 (es) | 1997-07-09 |
JPH11515119A (ja) | 1999-12-21 |
TW381236B (en) | 2000-02-01 |
EG21356A (en) | 2001-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX9603163A (es) | Soporte de datos con un modulo electronico y un metodo para producir el mismo. | |
AU2617095A (en) | Method for fabricating an electronic module and electronic module obtained thereby | |
WO1997021243A1 (en) | Method for processing semiconductor wafer, method for manufacturing ic card, and carrier | |
AU2002342623A1 (en) | Method for producing electronic components | |
IL161707A0 (en) | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness | |
EP0769812A3 (en) | Method of manufacturing chip-size package-type semiconductor device | |
MY123249A (en) | A semiconductor device and a method of manufacturing the same and an electronic device | |
DE59508993D1 (de) | Verfahren zur herstellung einer chipkarte sowie chipkarte | |
EP0199635A3 (en) | Integrated circuit device having stacked conductive layers connecting circuit elements therethrough | |
EP1148440A4 (en) | SEMICONDUCTOR DEVICE AND THEIR PRODUCTION | |
DE60005671D1 (de) | Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg | |
DE69214463D1 (de) | Verfahren zur herstellung von plastiklaminaten mit metallschichten insbesondere für gedruckte schaltungen | |
MX9800075A (es) | Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo. | |
AU1652700A (en) | Method for embedding an ic component into a foamed layer of a chip card | |
MY122247A (en) | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame. | |
ATE224083T1 (de) | Chipkarte und verfahren zur herstellung einer chipkarte | |
WO1999066445A8 (fr) | Procede de fabrication d'une carte a circuit integre et carte obtenue | |
WO2008060816A3 (en) | Stackable micropackages and stacked modules | |
EP1043767A4 (en) | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE | |
US20040099745A1 (en) | Method of producing a module | |
ATE254316T1 (de) | Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger | |
ATE212752T1 (de) | Verfahren zur herstellung eines trägerelements für halbleiterchips | |
IL162178A0 (en) | Foil battery with integrated component for use in a chip card | |
EP1067567A4 (en) | DISC TYPE STORAGE ADAPTER, MAGNETIC CORE FOR THE MAGNETIC SENSOR THEREFOR, METHOD FOR PRODUCING THE MAGNETIC CORE | |
JPS6459843A (en) | Semiconductor device |