MX9800075A - Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo. - Google Patents

Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo.

Info

Publication number
MX9800075A
MX9800075A MX9800075A MX9800075A MX9800075A MX 9800075 A MX9800075 A MX 9800075A MX 9800075 A MX9800075 A MX 9800075A MX 9800075 A MX9800075 A MX 9800075A MX 9800075 A MX9800075 A MX 9800075A
Authority
MX
Mexico
Prior art keywords
integrated circuit
circuit chip
webs
chip card
manufacture
Prior art date
Application number
MX9800075A
Other languages
English (en)
Inventor
Thomas J Breen
Charles W Taylor
Original Assignee
Docusystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Docusystems Inc filed Critical Docusystems Inc
Publication of MX9800075A publication Critical patent/MX9800075A/es

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Una tarjeta de oblea portadora de circuito integrado realizada por medio de la union de una pluralidad de membranas y formando una cavidad de modulo de oblea portadora de circuito integrado que presenta las paredes laterales de conformacion complementaria a los laterales del estrato de contacto de un modulo de oblea portadora de circuito integrado para lograr una relacion de alojamiento. Un método y un sistema de fabricacion de una tarjeta de oblea portadora de circuito integrado en donde las membranas que forman la membrana podrían ser procesadas en forma paralela y en donde una de dichas membranas presenta integrada a la misma y pre-montada, modulos de oblea de circuito integrado para la laminacion subsecuente con otras membranas en donde el registro o ajuste de las membranas y el alojamiento o asentamiento del modulo de oblea portadora de circuito integrado dentro de una cavidad ocurre sustancialmente al mismo tiempo, y mientras los medios de soldadura químico los mismos permanecen fluidos y abiertos. Las tarjetas pueden ser cortadas a partir de un laminado tras la soldadura química no ha sido aun curada.
MX9800075A 1995-07-07 1996-07-05 Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo. MX9800075A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96295P 1995-07-07 1995-07-07
PCT/US1996/012009 WO1997003466A1 (en) 1995-07-07 1996-07-05 Integrated circuit chip card and the method and system for the manufacture of same

Publications (1)

Publication Number Publication Date
MX9800075A true MX9800075A (es) 1998-04-30

Family

ID=21693739

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9800075A MX9800075A (es) 1995-07-07 1996-07-05 Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo.

Country Status (11)

Country Link
EP (1) EP0839388A1 (es)
JP (1) JPH11515119A (es)
AR (1) AR002776A1 (es)
AU (1) AU6591196A (es)
CA (1) CA2226225A1 (es)
CO (1) CO4480044A1 (es)
EG (1) EG21356A (es)
MX (1) MX9800075A (es)
TW (1) TW381236B (es)
WO (1) WO1997003466A1 (es)
ZA (1) ZA965751B (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP4739561B2 (ja) * 2001-03-30 2011-08-03 日本電産サーボ株式会社 ラミネータ装置
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
FR2895116B1 (fr) * 2005-12-16 2009-05-22 Oberthur Card Syst Sa Procede de fabrication de cartes a microcircuit
JP5487609B2 (ja) * 2007-12-28 2014-05-07 株式会社リコー 可逆性感熱記録媒体
WO2013166641A1 (en) 2012-05-07 2013-11-14 Sandisk Semiconductor (Shanghai) Co., Ltd. Semiconductor die laminating device with independent drives
EP3162534B1 (en) * 2015-10-29 2020-08-26 SMP Deutschland GmbH Method for producing a plastic surface with an integrated decoration
EP3923194A4 (en) * 2019-02-08 2022-03-30 Zuiko Corporation CARD MAKING PROCESS

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1204213A (en) * 1982-09-09 1986-05-06 Masahiro Takeda Memory card having static electricity protection
US4539472A (en) * 1984-01-06 1985-09-03 Horizon Technology, Inc. Data processing card system and method of forming same
EP0246893A3 (en) * 1986-05-21 1989-03-22 Hitachi, Ltd. Semiconductor device comprising an insulating wiring substrate and method of manufacturing it
JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Icカ−ド
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Icカードの製造方法およびicカード
WO1994004376A1 (en) * 1992-08-12 1994-03-03 Oki Electric Industry Co., Ltd. Ic card
US5422514A (en) * 1993-05-11 1995-06-06 Micromodule Systems, Inc. Packaging and interconnect system for integrated circuits
US5502892A (en) * 1994-07-01 1996-04-02 Maxconn Incorporated Method of forming a welded encasement for a computer card

Also Published As

Publication number Publication date
ZA965751B (en) 1997-01-27
CA2226225A1 (en) 1997-01-30
WO1997003466A1 (en) 1997-01-30
AU6591196A (en) 1997-02-10
EP0839388A1 (en) 1998-05-06
AR002776A1 (es) 1998-04-29
CO4480044A1 (es) 1997-07-09
JPH11515119A (ja) 1999-12-21
TW381236B (en) 2000-02-01
EG21356A (en) 2001-09-30

Similar Documents

Publication Publication Date Title
MX9603163A (es) Soporte de datos con un modulo electronico y un metodo para producir el mismo.
AU2617095A (en) Method for fabricating an electronic module and electronic module obtained thereby
WO1997021243A1 (en) Method for processing semiconductor wafer, method for manufacturing ic card, and carrier
AU2002342623A1 (en) Method for producing electronic components
IL161707A0 (en) Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
EP0769812A3 (en) Method of manufacturing chip-size package-type semiconductor device
MY123249A (en) A semiconductor device and a method of manufacturing the same and an electronic device
DE59508993D1 (de) Verfahren zur herstellung einer chipkarte sowie chipkarte
EP0199635A3 (en) Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
EP1148440A4 (en) SEMICONDUCTOR DEVICE AND THEIR PRODUCTION
DE60005671D1 (de) Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg
DE69214463D1 (de) Verfahren zur herstellung von plastiklaminaten mit metallschichten insbesondere für gedruckte schaltungen
MX9800075A (es) Tarjeta con oblea portadora de circuito integrado y metodo y sistema para fabricarlo.
AU1652700A (en) Method for embedding an ic component into a foamed layer of a chip card
MY122247A (en) Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame.
ATE224083T1 (de) Chipkarte und verfahren zur herstellung einer chipkarte
WO1999066445A8 (fr) Procede de fabrication d'une carte a circuit integre et carte obtenue
WO2008060816A3 (en) Stackable micropackages and stacked modules
EP1043767A4 (en) SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
US20040099745A1 (en) Method of producing a module
ATE254316T1 (de) Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger
ATE212752T1 (de) Verfahren zur herstellung eines trägerelements für halbleiterchips
IL162178A0 (en) Foil battery with integrated component for use in a chip card
EP1067567A4 (en) DISC TYPE STORAGE ADAPTER, MAGNETIC CORE FOR THE MAGNETIC SENSOR THEREFOR, METHOD FOR PRODUCING THE MAGNETIC CORE
JPS6459843A (en) Semiconductor device