AR002776A1 - Un conjunto de oblea de circuito integrado, metodos y disposicion para fabricarlo, una tarjeta de oblea portadora de circuito integrado y metodo parafabricar la tarjeta. - Google Patents

Un conjunto de oblea de circuito integrado, metodos y disposicion para fabricarlo, una tarjeta de oblea portadora de circuito integrado y metodo parafabricar la tarjeta.

Info

Publication number
AR002776A1
AR002776A1 ARP960103487A AR10348796A AR002776A1 AR 002776 A1 AR002776 A1 AR 002776A1 AR P960103487 A ARP960103487 A AR P960103487A AR 10348796 A AR10348796 A AR 10348796A AR 002776 A1 AR002776 A1 AR 002776A1
Authority
AR
Argentina
Prior art keywords
integrated circuit
card
membranes
manufacture
circuit carrier
Prior art date
Application number
ARP960103487A
Other languages
English (en)
Original Assignee
Rand Mcnally & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rand Mcnally & Co filed Critical Rand Mcnally & Co
Publication of AR002776A1 publication Critical patent/AR002776A1/es

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Un conjunto de oblea de circuito integrado, métodos y disposición para fabricarlo, una tarjeta de oblea portadora de circuito integrado y método parafabricar la tarjeta, donde la tarjeta de oblea portadora de circuito integrado es realizada pormedio de la unión de una pluralidad de membranas y formandouna cavidad de módulo de oblea portadora de circuito integrado que presenta las paredes laterales de conformación complementaria a los laterales del estrato decontacto de un módulo de obleaportadora de circuito integrado para lograr una relación de alojamiento. Un método y un sistema de fabricación de una tarjetade oblea portadora de circuito integrado en donde las membranas que forman la membrana podrían ser procesadas en forma paralela y en donde una de dichasmembranas presenta integrada a la misma y premontada, módulos de oblea de circuito integrado para la laminación subsecuente con otras membranas en dondeel registro o ajuste de las membranas y el alojamiento o asentamiento del módulo de oblea portadora de circuito integrado dentro de una cavidad ocurresustancialmente al mismo tiempo, y mientras los medios de soldadura químico los mismos permanecen fluidos y abiertos. Las tarjetas pueden ser cortadasapartir de un laminado mientras la soldadura química no ha sido aún curada.
ARP960103487A 1995-07-07 1996-08-07 Un conjunto de oblea de circuito integrado, metodos y disposicion para fabricarlo, una tarjeta de oblea portadora de circuito integrado y metodo parafabricar la tarjeta. AR002776A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96295P 1995-07-07 1995-07-07

Publications (1)

Publication Number Publication Date
AR002776A1 true AR002776A1 (es) 1998-04-29

Family

ID=21693739

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP960103487A AR002776A1 (es) 1995-07-07 1996-08-07 Un conjunto de oblea de circuito integrado, metodos y disposicion para fabricarlo, una tarjeta de oblea portadora de circuito integrado y metodo parafabricar la tarjeta.

Country Status (11)

Country Link
EP (1) EP0839388A1 (es)
JP (1) JPH11515119A (es)
AR (1) AR002776A1 (es)
AU (1) AU6591196A (es)
CA (1) CA2226225A1 (es)
CO (1) CO4480044A1 (es)
EG (1) EG21356A (es)
MX (1) MX9800075A (es)
TW (1) TW381236B (es)
WO (1) WO1997003466A1 (es)
ZA (1) ZA965751B (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP4739561B2 (ja) * 2001-03-30 2011-08-03 日本電産サーボ株式会社 ラミネータ装置
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
FR2895116B1 (fr) * 2005-12-16 2009-05-22 Oberthur Card Syst Sa Procede de fabrication de cartes a microcircuit
JP5487609B2 (ja) 2007-12-28 2014-05-07 株式会社リコー 可逆性感熱記録媒体
KR101655353B1 (ko) 2012-05-07 2016-09-07 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 독립적인 드라이브들을 갖는 반도체 다이 라미네이팅 디바이스
HUE051727T2 (hu) * 2015-10-29 2021-03-29 Smp Deutschland Gmbh Eljárás mûanyag felület elõállítására integrált dekorációval
US11878545B2 (en) * 2019-02-08 2024-01-23 Zuiko Corporation Card manufacturing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1204213A (en) * 1982-09-09 1986-05-06 Masahiro Takeda Memory card having static electricity protection
US4539472A (en) * 1984-01-06 1985-09-03 Horizon Technology, Inc. Data processing card system and method of forming same
KR940003375B1 (ko) * 1986-05-21 1994-04-21 가부시끼가이샤 히다찌세이사꾸쇼 반도체 장치 및 그 제조 방법
JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Icカ−ド
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Icカードの製造方法およびicカード
EP0618083B1 (en) * 1992-08-12 1997-10-08 Oki Electric Industry Company, Limited IC Card
US5422514A (en) * 1993-05-11 1995-06-06 Micromodule Systems, Inc. Packaging and interconnect system for integrated circuits
US5502892A (en) * 1994-07-01 1996-04-02 Maxconn Incorporated Method of forming a welded encasement for a computer card

Also Published As

Publication number Publication date
CO4480044A1 (es) 1997-07-09
CA2226225A1 (en) 1997-01-30
MX9800075A (es) 1998-04-30
ZA965751B (en) 1997-01-27
AU6591196A (en) 1997-02-10
EP0839388A1 (en) 1998-05-06
TW381236B (en) 2000-02-01
JPH11515119A (ja) 1999-12-21
EG21356A (en) 2001-09-30
WO1997003466A1 (en) 1997-01-30

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