AR002776A1 - A SET OF INTEGRATED CIRCUIT WAVE, METHODS AND ARRANGEMENT TO MANUFACTURE IT, AN INTEGRATED CIRCUIT CARRIER WAVE CARD AND METHOD TO MANUFACTURE THE CARD. - Google Patents
A SET OF INTEGRATED CIRCUIT WAVE, METHODS AND ARRANGEMENT TO MANUFACTURE IT, AN INTEGRATED CIRCUIT CARRIER WAVE CARD AND METHOD TO MANUFACTURE THE CARD.Info
- Publication number
- AR002776A1 AR002776A1 ARP960103487A AR10348796A AR002776A1 AR 002776 A1 AR002776 A1 AR 002776A1 AR P960103487 A ARP960103487 A AR P960103487A AR 10348796 A AR10348796 A AR 10348796A AR 002776 A1 AR002776 A1 AR 002776A1
- Authority
- AR
- Argentina
- Prior art keywords
- integrated circuit
- card
- membranes
- manufacture
- circuit carrier
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Un conjunto de oblea de circuito integrado, métodos y disposición para fabricarlo, una tarjeta de oblea portadora de circuito integrado y método parafabricar la tarjeta, donde la tarjeta de oblea portadora de circuito integrado es realizada pormedio de la unión de una pluralidad de membranas y formandouna cavidad de módulo de oblea portadora de circuito integrado que presenta las paredes laterales de conformación complementaria a los laterales del estrato decontacto de un módulo de obleaportadora de circuito integrado para lograr una relación de alojamiento. Un método y un sistema de fabricación de una tarjetade oblea portadora de circuito integrado en donde las membranas que forman la membrana podrían ser procesadas en forma paralela y en donde una de dichasmembranas presenta integrada a la misma y premontada, módulos de oblea de circuito integrado para la laminación subsecuente con otras membranas en dondeel registro o ajuste de las membranas y el alojamiento o asentamiento del módulo de oblea portadora de circuito integrado dentro de una cavidad ocurresustancialmente al mismo tiempo, y mientras los medios de soldadura químico los mismos permanecen fluidos y abiertos. Las tarjetas pueden ser cortadasapartir de un laminado mientras la soldadura química no ha sido aún curada.An integrated circuit wafer assembly, methods and arrangement for manufacturing it, an integrated circuit carrier wafer card and method for manufacturing the card, wherein the integrated circuit carrier wafer card is made by joining a plurality of membranes and forming a IC wafer module cavity having the side walls of complementary conformation to the contact layer sides of an IC wafer module to achieve a housing relationship. A method and a system for manufacturing an integrated circuit carrier wafer card in which the membranes that form the membrane could be processed in parallel and in which one of said membranes has integrated circuit wafer modules for the subsequent lamination with other membranes wherein the registration or fitting of the membranes and the housing or seating of the integrated circuit carrier wafer module within a cavity occurs substantially at the same time, and while the chemical welding means themselves remain fluid and open. Cards can be cut from a laminate while the chemical solder has not yet cured.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US96295P | 1995-07-07 | 1995-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR002776A1 true AR002776A1 (en) | 1998-04-29 |
Family
ID=21693739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ARP960103487A AR002776A1 (en) | 1995-07-07 | 1996-08-07 | A SET OF INTEGRATED CIRCUIT WAVE, METHODS AND ARRANGEMENT TO MANUFACTURE IT, AN INTEGRATED CIRCUIT CARRIER WAVE CARD AND METHOD TO MANUFACTURE THE CARD. |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP0839388A1 (en) |
| JP (1) | JPH11515119A (en) |
| AR (1) | AR002776A1 (en) |
| AU (1) | AU6591196A (en) |
| CA (1) | CA2226225A1 (en) |
| CO (1) | CO4480044A1 (en) |
| EG (1) | EG21356A (en) |
| MX (1) | MX9800075A (en) |
| TW (1) | TW381236B (en) |
| WO (1) | WO1997003466A1 (en) |
| ZA (1) | ZA965751B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
| JP4739561B2 (en) * | 2001-03-30 | 2011-08-03 | 日本電産サーボ株式会社 | Laminator device |
| US6586078B2 (en) * | 2001-07-05 | 2003-07-01 | Soundcraft, Inc. | High pressure lamination of electronic cards |
| FR2895116B1 (en) * | 2005-12-16 | 2009-05-22 | Oberthur Card Syst Sa | PROCESS FOR PRODUCING MICROCIRCUIT CARDS |
| JP5487609B2 (en) * | 2007-12-28 | 2014-05-07 | 株式会社リコー | Reversible thermosensitive recording medium |
| WO2013166641A1 (en) | 2012-05-07 | 2013-11-14 | Sandisk Semiconductor (Shanghai) Co., Ltd. | Semiconductor die laminating device with independent drives |
| EP3162534B1 (en) * | 2015-10-29 | 2020-08-26 | SMP Deutschland GmbH | Method for producing a plastic surface with an integrated decoration |
| EP3923194A4 (en) * | 2019-02-08 | 2022-03-30 | Zuiko Corporation | Card manufacturing method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1204213A (en) * | 1982-09-09 | 1986-05-06 | Masahiro Takeda | Memory card having static electricity protection |
| US4539472A (en) * | 1984-01-06 | 1985-09-03 | Horizon Technology, Inc. | Data processing card system and method of forming same |
| EP0246893A3 (en) * | 1986-05-21 | 1989-03-22 | Hitachi, Ltd. | Semiconductor device comprising an insulating wiring substrate and method of manufacturing it |
| JPS63149191A (en) * | 1986-12-15 | 1988-06-21 | 日立マクセル株式会社 | Ic card |
| JP2560895B2 (en) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | IC card manufacturing method and IC card |
| WO1994004376A1 (en) * | 1992-08-12 | 1994-03-03 | Oki Electric Industry Co., Ltd. | Ic card |
| US5422514A (en) * | 1993-05-11 | 1995-06-06 | Micromodule Systems, Inc. | Packaging and interconnect system for integrated circuits |
| US5502892A (en) * | 1994-07-01 | 1996-04-02 | Maxconn Incorporated | Method of forming a welded encasement for a computer card |
-
1996
- 1996-07-03 TW TW085108037A patent/TW381236B/en not_active IP Right Cessation
- 1996-07-05 ZA ZA965751A patent/ZA965751B/en unknown
- 1996-07-05 MX MX9800075A patent/MX9800075A/en unknown
- 1996-07-05 AU AU65911/96A patent/AU6591196A/en not_active Abandoned
- 1996-07-05 CA CA002226225A patent/CA2226225A1/en not_active Abandoned
- 1996-07-05 CO CO96035361A patent/CO4480044A1/en unknown
- 1996-07-05 EP EP96925392A patent/EP0839388A1/en not_active Withdrawn
- 1996-07-05 WO PCT/US1996/012009 patent/WO1997003466A1/en not_active Application Discontinuation
- 1996-07-05 JP JP9506028A patent/JPH11515119A/en active Pending
- 1996-07-07 EG EG64696A patent/EG21356A/en active
- 1996-08-07 AR ARP960103487A patent/AR002776A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| MX9800075A (en) | 1998-04-30 |
| ZA965751B (en) | 1997-01-27 |
| CA2226225A1 (en) | 1997-01-30 |
| WO1997003466A1 (en) | 1997-01-30 |
| AU6591196A (en) | 1997-02-10 |
| EP0839388A1 (en) | 1998-05-06 |
| CO4480044A1 (en) | 1997-07-09 |
| JPH11515119A (en) | 1999-12-21 |
| TW381236B (en) | 2000-02-01 |
| EG21356A (en) | 2001-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA | Abandonment or withdrawal |