AR037813A1 - Modulo electronico y procedimiento de fabricacion de dicho modulo - Google Patents
Modulo electronico y procedimiento de fabricacion de dicho moduloInfo
- Publication number
- AR037813A1 AR037813A1 ARP020104773A ARP020104773A AR037813A1 AR 037813 A1 AR037813 A1 AR 037813A1 AR P020104773 A ARP020104773 A AR P020104773A AR P020104773 A ARP020104773 A AR P020104773A AR 037813 A1 AR037813 A1 AR 037813A1
- Authority
- AR
- Argentina
- Prior art keywords
- insulating sheet
- electronic
- alveoli
- module
- electronic component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Un procedimiento de fabricación de módulos electrónicos con mayor rentabilidad. De una forma más particular, este procedimiento se distingue a través de fases que requieren un utillaje simplificado permitiendo una fabricación rápida de una gran cantidad de módulos. Un módulo electrónico fiable que tiene a la vez una coste final muy bajo. Este objetivo se alcanza mediante un procedimiento de fabricación de un módulo electrónico que consta de un ensamblaje de una primera hoja aislante (1) proporcionada bajo la forma de una placa que sirve para la manutención de componentes electrónicos y que incluye alvéolos, de por lo menos un componente electrónico (3) colocado en dichos alvéolos (2), y de una segunda hoja aislante, caracterizado por las siguientes fases: colocación de una primera hoja aislante constituida por la placa alveolar sobre una superficie de trabajo, dichos alvéolos conteniendo cada uno al menos un componente electrónico; superposición de la segunda hoja aislante sobre la primera para cerrar los alvéolos que contienen el componente electrónico; y recorte de los módulos según un contorno que engloba al menos un alvéolo de la primera hoja aislante.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH22582001 | 2001-12-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
AR037813A1 true AR037813A1 (es) | 2004-12-09 |
Family
ID=4568259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP020104773A AR037813A1 (es) | 2001-12-11 | 2002-12-10 | Modulo electronico y procedimiento de fabricacion de dicho modulo |
Country Status (15)
Country | Link |
---|---|
US (1) | US20050085005A1 (es) |
EP (1) | EP1485226B1 (es) |
JP (1) | JP2005530218A (es) |
KR (1) | KR20040073465A (es) |
CN (1) | CN1602235A (es) |
AR (1) | AR037813A1 (es) |
AT (1) | ATE303877T1 (es) |
AU (1) | AU2002366586A1 (es) |
BR (1) | BR0214636A (es) |
CA (1) | CA2468516A1 (es) |
DE (1) | DE60206082D1 (es) |
MX (1) | MXPA04005575A (es) |
RU (1) | RU2004116272A (es) |
TW (1) | TW200300990A (es) |
WO (1) | WO2003049894A1 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8316535B2 (en) * | 2002-10-11 | 2012-11-27 | Nagraid Sa | Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device |
PA8584401A1 (es) * | 2002-10-11 | 2005-02-04 | Nagraid Sa | Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo |
CA2703805A1 (en) * | 2006-10-31 | 2008-05-08 | Solicore, Inc. | Powered authenticating cards |
JP5684475B2 (ja) * | 2006-10-31 | 2015-03-11 | ソリコア インコーポレイテッドSOLICORE,Incorporated | 電池式デバイス |
WO2008082617A2 (en) * | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
US7967214B2 (en) * | 2006-12-29 | 2011-06-28 | Solicore, Inc. | Card configured to receive separate battery |
WO2010070964A1 (ja) * | 2008-12-16 | 2010-06-24 | 株式会社村田製作所 | 回路モジュール及びその管理方法 |
JP2012160216A (ja) * | 2012-05-30 | 2012-08-23 | Toshiba Corp | 非接触式リーダライタ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
DE19516250C1 (de) * | 1995-04-26 | 1996-07-04 | Mannesmann Ag | Verfahren zum Verbinden eines mikromechanischen Drucksensors mit einem Anschlußstück |
US5904992A (en) * | 1996-09-26 | 1999-05-18 | Mcdonnell Douglas Corporation | Floating superplastic forming/diffusion bonding die, product and process |
-
2002
- 2002-12-09 TW TW091135558A patent/TW200300990A/zh unknown
- 2002-12-10 KR KR10-2004-7008869A patent/KR20040073465A/ko not_active Application Discontinuation
- 2002-12-10 DE DE60206082T patent/DE60206082D1/de not_active Expired - Lifetime
- 2002-12-10 CA CA002468516A patent/CA2468516A1/en not_active Abandoned
- 2002-12-10 AT AT02804647T patent/ATE303877T1/de not_active IP Right Cessation
- 2002-12-10 US US10/497,822 patent/US20050085005A1/en not_active Abandoned
- 2002-12-10 MX MXPA04005575A patent/MXPA04005575A/es unknown
- 2002-12-10 BR BR0214636-3A patent/BR0214636A/pt not_active IP Right Cessation
- 2002-12-10 JP JP2003550936A patent/JP2005530218A/ja active Pending
- 2002-12-10 EP EP02804647A patent/EP1485226B1/fr not_active Expired - Lifetime
- 2002-12-10 AR ARP020104773A patent/AR037813A1/es unknown
- 2002-12-10 CN CNA028248066A patent/CN1602235A/zh active Pending
- 2002-12-10 RU RU2004116272/02A patent/RU2004116272A/ru not_active Application Discontinuation
- 2002-12-10 WO PCT/IB2002/005291 patent/WO2003049894A1/fr active IP Right Grant
- 2002-12-10 AU AU2002366586A patent/AU2002366586A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
BR0214636A (pt) | 2004-11-03 |
JP2005530218A (ja) | 2005-10-06 |
EP1485226B1 (fr) | 2005-09-07 |
MXPA04005575A (es) | 2004-12-06 |
CA2468516A1 (en) | 2003-06-19 |
US20050085005A1 (en) | 2005-04-21 |
DE60206082D1 (de) | 2005-10-13 |
CN1602235A (zh) | 2005-03-30 |
WO2003049894A1 (fr) | 2003-06-19 |
EP1485226A1 (fr) | 2004-12-15 |
TW200300990A (en) | 2003-06-16 |
AU2002366586A1 (en) | 2003-06-23 |
RU2004116272A (ru) | 2005-06-10 |
ATE303877T1 (de) | 2005-09-15 |
KR20040073465A (ko) | 2004-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FB | Suspension of granting procedure |