WO2009050816A1 - 装置、実装構造及び実装方法 - Google Patents

装置、実装構造及び実装方法 Download PDF

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Publication number
WO2009050816A1
WO2009050816A1 PCT/JP2007/070383 JP2007070383W WO2009050816A1 WO 2009050816 A1 WO2009050816 A1 WO 2009050816A1 JP 2007070383 W JP2007070383 W JP 2007070383W WO 2009050816 A1 WO2009050816 A1 WO 2009050816A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
holding portion
board assemblies
mounting
Prior art date
Application number
PCT/JP2007/070383
Other languages
English (en)
French (fr)
Inventor
Masaki Yoshimaru
Naohiko Kajio
Takashi Imamoto
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/070383 priority Critical patent/WO2009050816A1/ja
Publication of WO2009050816A1 publication Critical patent/WO2009050816A1/ja
Priority to US12/759,782 priority patent/US8077456B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

　筐体（１０２）に複数のプリント板ユニット（１０４１、１０４２、１０４３、１０４４）を備える装置（サーバ装置１００）、実装構造及び実装方法であって、隣接するプリント板ユニットの隣接側の各レール（１３４、１３６）を共通のレール保持部（ガイドレール１３８）で保持することにより、隣接するプリント板ユニットの間隔を狭めるとともに、レール保持部の共用化により筐体内にレール保持部の占有面積を削減して冷却風の通流性能を高め、冷却効率を向上させている。
PCT/JP2007/070383 2007-10-18 2007-10-18 装置、実装構造及び実装方法 WO2009050816A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/070383 WO2009050816A1 (ja) 2007-10-18 2007-10-18 装置、実装構造及び実装方法
US12/759,782 US8077456B2 (en) 2007-10-18 2010-04-14 Apparatus, mounting structure, and mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070383 WO2009050816A1 (ja) 2007-10-18 2007-10-18 装置、実装構造及び実装方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/759,782 Continuation US8077456B2 (en) 2007-10-18 2010-04-14 Apparatus, mounting structure, and mounting method

Publications (1)

Publication Number Publication Date
WO2009050816A1 true WO2009050816A1 (ja) 2009-04-23

Family

ID=40567108

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070383 WO2009050816A1 (ja) 2007-10-18 2007-10-18 装置、実装構造及び実装方法

Country Status (2)

Country Link
US (1) US8077456B2 (ja)
WO (1) WO2009050816A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103562817A (zh) * 2011-05-25 2014-02-05 惠普发展公司，有限责任合伙企业 刀片计算机系统
US9345163B2 (en) * 2013-05-30 2016-05-17 Hewlett Packard Enterprise Development Lp Modules to contain interface cards
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
US9615480B2 (en) * 2015-07-30 2017-04-04 Seagate Technology Llc Storage device assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321889U (ja) * 1989-07-13 1991-03-05
JPH0936577A (ja) * 1995-07-19 1997-02-07 Fujitsu Ltd 電子装置空冷用の防塵フイルタ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364395A (en) * 1965-01-26 1968-01-16 Burroughs Corp Modular data processing apparatus including heat dissipating means
JPS577998A (en) 1980-06-18 1982-01-16 Fujitsu Ltd Heavy part carrying printed board structure
US4483178A (en) * 1983-01-18 1984-11-20 Miille Jerry L Pneumatic-digital converter system and method
WO1989010681A1 (en) * 1988-04-30 1989-11-02 Fujitsu Limited Printed board unit inserting and withdrawing mechanism for electronic circuit devices
JPH0321889A (ja) 1989-06-19 1991-01-30 Calsonic Corp センサー用オートチューニング機構
US5410448A (en) * 1992-03-02 1995-04-25 Digital Equipment Corporation Adaptive cooling system
US5467254A (en) * 1993-11-04 1995-11-14 Synoptics Communications, Inc. Supportive guide for circuit-card grounding including tracks having staggered protrusions at the proximal end of the tracks
JPH098480A (ja) 1995-06-16 1997-01-10 Oki Electric Ind Co Ltd プリント配線板の補強構造
CN2636593Y (zh) * 2003-06-21 2004-08-25 鸿富锦精密工业（深圳）有限公司 插件安装结构
US7656669B2 (en) * 2006-08-15 2010-02-02 Mitac International Corp. Scalable computer system and reconfigurable chassis module thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321889U (ja) * 1989-07-13 1991-03-05
JPH0936577A (ja) * 1995-07-19 1997-02-07 Fujitsu Ltd 電子装置空冷用の防塵フイルタ

Also Published As

Publication number Publication date
US20100195283A1 (en) 2010-08-05
US8077456B2 (en) 2011-12-13

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