DE602005001826D1 - RC Vorrichtungen, organische dielektrische Laminate und Leiterplatten dergleichen Vorrichtungen umfassend, und Verfahren um diese herzustellen - Google Patents

RC Vorrichtungen, organische dielektrische Laminate und Leiterplatten dergleichen Vorrichtungen umfassend, und Verfahren um diese herzustellen

Info

Publication number
DE602005001826D1
DE602005001826D1 DE602005001826T DE602005001826T DE602005001826D1 DE 602005001826 D1 DE602005001826 D1 DE 602005001826D1 DE 602005001826 T DE602005001826 T DE 602005001826T DE 602005001826 T DE602005001826 T DE 602005001826T DE 602005001826 D1 DE602005001826 D1 DE 602005001826D1
Authority
DE
Germany
Prior art keywords
devices
making
methods
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005001826T
Other languages
English (en)
Other versions
DE602005001826T2 (de
Inventor
William J Borland
Sidney G Cox
David Ross Mcgregor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE602005001826D1 publication Critical patent/DE602005001826D1/de
Application granted granted Critical
Publication of DE602005001826T2 publication Critical patent/DE602005001826T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE602005001826T 2004-10-18 2005-09-26 RC Vorrichtungen, organische dielektrische Laminate und Leiterplatten dergleichen Vorrichtungen umfassend, und Verfahren um diese herzustellen Active DE602005001826T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US967541 2004-10-18
US10/967,541 US7430128B2 (en) 2004-10-18 2004-10-18 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

Publications (2)

Publication Number Publication Date
DE602005001826D1 true DE602005001826D1 (de) 2007-09-13
DE602005001826T2 DE602005001826T2 (de) 2008-04-24

Family

ID=35677559

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005001826T Active DE602005001826T2 (de) 2004-10-18 2005-09-26 RC Vorrichtungen, organische dielektrische Laminate und Leiterplatten dergleichen Vorrichtungen umfassend, und Verfahren um diese herzustellen

Country Status (7)

Country Link
US (2) US7430128B2 (de)
EP (1) EP1651017B1 (de)
JP (1) JP2006121086A (de)
KR (1) KR100677787B1 (de)
CN (1) CN1783379A (de)
DE (1) DE602005001826T2 (de)
TW (1) TWI402008B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7345889B1 (en) * 2004-09-28 2008-03-18 Avaya Technology Corp. Method and system for reducing radiated energy emissions in computational devices
US7596842B2 (en) 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
JP2015233084A (ja) * 2014-06-10 2015-12-24 株式会社日立製作所 チップモジュールおよび情報処理機器
CN105047642B (zh) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 一种端口防护电路集成封装件
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
TWI694752B (zh) * 2018-10-26 2020-05-21 鼎展電子股份有限公司 內嵌式被動元件結構
EP3761492B1 (de) * 2019-07-05 2023-01-04 Infineon Technologies AG Schutzbeschaltung und leistungshalbleitermodul mit der beschaltung
US20240136123A1 (en) * 2022-10-21 2024-04-25 KYOCERA AVX Components Corporation Single Layer Capacitor

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3934119A (en) * 1974-09-17 1976-01-20 Texas Instruments Incorporated Electrical resistance heaters
US4377652A (en) * 1978-02-17 1983-03-22 Asahi Kasei Kogyo Kabushiki Kaisha Polyamide-imide compositions and articles for electrical use prepared therefrom
US4410867A (en) * 1978-12-28 1983-10-18 Western Electric Company, Inc. Alpha tantalum thin film circuit device
DE2903025C2 (de) * 1979-01-26 1983-05-05 Siemens AG, 1000 Berlin und 8000 München RC-Netzwerk
US4407883A (en) * 1982-03-03 1983-10-04 Uop Inc. Laminates for printed circuit boards
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
JPS59144162A (ja) 1983-02-08 1984-08-18 Nec Corp 薄膜回路の製造方法
JPS60113993A (ja) * 1983-11-25 1985-06-20 三菱電機株式会社 多層回路基板の製造方法
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
US5093036A (en) * 1988-09-20 1992-03-03 Raychem Corporation Conductive polymer composition
JP2764745B2 (ja) 1989-07-21 1998-06-11 オムロン株式会社 混成回路基板およびその製造方法
JP2802173B2 (ja) * 1990-02-06 1998-09-24 松下電工株式会社 複合誘電体
JPH04211191A (ja) * 1990-02-09 1992-08-03 Hitachi Ltd 実装構造体
JP3019541B2 (ja) 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
JPH0565456A (ja) * 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
EP0588136B1 (de) * 1992-09-15 1996-11-13 E.I. Du Pont De Nemours And Company Zusammensetzung für einen Polymer-Dickschichtwiderstand
US6111005A (en) * 1993-07-30 2000-08-29 Diemat, Inc. Polymeric adhesive paste
US6140402A (en) * 1993-07-30 2000-10-31 Diemat, Inc. Polymeric adhesive paste
JPH07161578A (ja) * 1993-12-06 1995-06-23 Rubikon Denshi Kk フィルムコンデンサの製造方法
JPH07226334A (ja) * 1994-02-09 1995-08-22 Matsushita Electric Ind Co Ltd 薄膜コンデンサ及びその製造方法
JP3117175B2 (ja) 1994-02-09 2000-12-11 アルプス電気株式会社 抵抗体
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
JP3684239B2 (ja) * 1995-01-10 2005-08-17 株式会社 日立製作所 低ｅｍｉ電子機器
TW367621B (en) * 1995-02-27 1999-08-21 Nxp Bv Electronic component comprising a thin-film structure with passive elements
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
US5993698A (en) 1997-11-06 1999-11-30 Acheson Industries, Inc. Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device
JP2000269079A (ja) * 1999-03-19 2000-09-29 Dainippon Printing Co Ltd 共振回路及びその製造方法
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6030553A (en) * 1999-04-01 2000-02-29 Industrial Technology Research Institute Polymer thick film resistor pastes
US6285542B1 (en) * 1999-04-16 2001-09-04 Avx Corporation Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
JP2001310911A (ja) * 2000-04-28 2001-11-06 Sumitomo Seika Chem Co Ltd 誘電体形成物質及び誘電体フィルム
US6278356B1 (en) * 2000-05-17 2001-08-21 Compeq Manufacturing Company Limited Flat, built-in resistors and capacitors for a printed circuit board
JP4224190B2 (ja) * 2000-06-20 2009-02-12 パナソニック電工株式会社 プリント配線板の製造方法及びプリント配線板
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
JP2002252297A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 多層回路基板を用いた電子回路装置
EP2315510A3 (de) * 2001-06-05 2012-05-02 Dai Nippon Printing Co., Ltd. Leiterplatte mit passiven Elementen
JP2003142590A (ja) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd 容量素子
JP3711343B2 (ja) * 2002-06-26 2005-11-02 株式会社トッパンＮｅｃサーキットソリューションズ 印刷配線板及びその製造方法並びに半導体装置
US6600645B1 (en) * 2002-09-27 2003-07-29 Ut-Battelle, Llc Dielectric composite materials and method for preparing
JP2004214586A (ja) * 2002-11-14 2004-07-29 Kyocera Corp 多層配線基板
JP2004193411A (ja) * 2002-12-12 2004-07-08 Fujikura Ltd 高誘電率電気・電子部品の製造方法と部品
US6910264B2 (en) * 2003-01-03 2005-06-28 Phoenix Precision Technology Corp. Method for making a multilayer circuit board having embedded passive components
JP2004214573A (ja) 2003-01-09 2004-07-29 Murata Mfg Co Ltd セラミック多層基板の製造方法

Also Published As

Publication number Publication date
US7813141B2 (en) 2010-10-12
EP1651017A3 (de) 2006-05-03
DE602005001826T2 (de) 2008-04-24
TW200635454A (en) 2006-10-01
US20080297274A1 (en) 2008-12-04
US20060082980A1 (en) 2006-04-20
TWI402008B (zh) 2013-07-11
US7430128B2 (en) 2008-09-30
CN1783379A (zh) 2006-06-07
KR100677787B1 (ko) 2007-02-02
KR20060054031A (ko) 2006-05-22
EP1651017A2 (de) 2006-04-26
EP1651017B1 (de) 2007-08-01
JP2006121086A (ja) 2006-05-11

Similar Documents

Publication Publication Date Title
EP2071907A4 (de) Flex-rigid-leiterplatte und verfahren zur herstellung der flex-rigid-leiterplatte
DE602005001826D1 (de) RC Vorrichtungen, organische dielektrische Laminate und Leiterplatten dergleichen Vorrichtungen umfassend, und Verfahren um diese herzustellen
TWI371997B (en) Printed wiring board and method for manufacturing the same
DE602005012569D1 (de) Kondensatorvorrichtungen, organische dielektrische Laminate und Leiterplatten enthaltend solche Vorrichtungen, sowie Verfahren zu deren Herstellung
EP1945013A4 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
GB2429847B (en) Printed circuit board and manuafacturing method thereof
TWI351013B (en) Light-emitting device, circuit for driving the same, and electronic apparatus
EP1713314A4 (de) Mehrschichtige leiterplatte
EP1814372A4 (de) Mehrschichtige leiterplatte
EP1713313A4 (de) Mehrschichtige leiterplatte
EP1858307A4 (de) Mehrschichtige leiterplatte
EP1848257A4 (de) Mehrschichtige leiterplatte
EP1845762A4 (de) Mehrschichtige leiterplatte
EP1858308A4 (de) Mehrschichtige leiterplatte
EP2224794A4 (de) Bestückte leiterplatte, verfahren zu ihrer herstellung und funkfrequenzvorrichtung dafür
EP1968113A4 (de) Mehrschichtige leiterplatte
GB2422491B (en) Printed Circuit Board
EP2068605A4 (de) Leiterplatte
DE602005015657D1 (de) Kapazitive/Resistive Einrichtungen und Leiterplatten mit solchen Einrichtungen sowie Herstellungsverfahren dafür
DE602005021305D1 (de) Leiterplatte
DE602006000514D1 (de) Leiterplatte und Herstellungsverfahren dafür
EP1954112A4 (de) Verfahren zur herstellung einer mehrschichtigen leiterplatte, schaltungsplatte und verfahren zur herstellung der schaltungsplatte
HK1135556A1 (en) Printed wiring board and method for manufacturing the same
EP1768474A4 (de) Leiterplatte und herstellungsverfahren dafür
EP1850647A4 (de) Mehrschichtige leiterplatte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition