BRPI0713873A8 - Módulo eletrônico configurado para circulação de ar através do mesmo e sistema incluindo o mesmo - Google Patents

Módulo eletrônico configurado para circulação de ar através do mesmo e sistema incluindo o mesmo

Info

Publication number
BRPI0713873A8
BRPI0713873A8 BRPI0713873A BRPI0713873A BRPI0713873A8 BR PI0713873 A8 BRPI0713873 A8 BR PI0713873A8 BR PI0713873 A BRPI0713873 A BR PI0713873A BR PI0713873 A BRPI0713873 A BR PI0713873A BR PI0713873 A8 BRPI0713873 A8 BR PI0713873A8
Authority
BR
Brazil
Prior art keywords
same
capacitors
electronic module
chassis
bus bars
Prior art date
Application number
BRPI0713873A
Other languages
English (en)
Inventor
Kunkle Jonathan
Original Assignee
Siemens Industry Inc
Siemens Ag
Siemens Energy & Automation Inc
Siemens Building Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Industry Inc, Siemens Ag, Siemens Energy & Automation Inc, Siemens Building Tech Inc filed Critical Siemens Industry Inc
Publication of BRPI0713873A2 publication Critical patent/BRPI0713873A2/pt
Publication of BRPI0713873A8 publication Critical patent/BRPI0713873A8/pt
Publication of BRPI0713873B1 publication Critical patent/BRPI0713873B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

MÓDULO ELETRÔNICO CONFIGURADO PARA CIRCULAÇÃO DE AR ATRAVÉS DO MESMO E SISTEMA INCLUINDO O MESMO. A presente invenção refere-se a um módulo eletrônico. O módulo eletrônico inclui um chassi, uma pluralidade de capacitores, uma pluralidade de barramentos e um dissipador de calor. O chassi inclui uma primeira extremidade e uma segunda extremidade. A primeira extremidade é oposta à segunda extremidade. Os capacitores são posicionados dentro do chassi, e pelo menos um dos capacitores está próximo da primeira extremidade. Os barramentos são posicionados dentro do chassi próximos à segunda extremidade. O dissipador de calor está posicionado entre os capacitores e os barramentos. Os capacitores, o dissipador de calor e os barramentos são de tal maneira posicionados que quando um fluxo de ar ingressa no chassi pela primeira extremidade, uma parte do fluxo de ar sucessivamente entra em contato com os capacitores, o dissipador de calor, e os barramentos antes de egressar pela segunda extremidade.
BRPI0713873A 2006-06-30 2007-07-02 módulo eletrônico configurado para circulação de ar através do mesmo e sistema incluindo o mesmo BRPI0713873B1 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81806406P 2006-06-30 2006-06-30
US60/818,064 2006-06-30
US11/769,846 2007-06-28
US11/769,846 US7554804B2 (en) 2006-06-30 2007-06-28 Electronic module configured for air flow therethrough and system including same
PCT/US2007/015462 WO2008005486A2 (en) 2006-06-30 2007-07-02 Electronic module configured for air flow therethrough and system including same

Publications (3)

Publication Number Publication Date
BRPI0713873A2 BRPI0713873A2 (pt) 2012-12-18
BRPI0713873A8 true BRPI0713873A8 (pt) 2017-03-07
BRPI0713873B1 BRPI0713873B1 (pt) 2018-11-13

Family

ID=38779674

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0713873A BRPI0713873B1 (pt) 2006-06-30 2007-07-02 módulo eletrônico configurado para circulação de ar através do mesmo e sistema incluindo o mesmo

Country Status (10)

Country Link
US (1) US7554804B2 (pt)
EP (1) EP2036417B1 (pt)
JP (1) JP5135340B2 (pt)
CN (1) CN101491169B (pt)
AT (1) ATE494766T1 (pt)
BR (1) BRPI0713873B1 (pt)
CA (1) CA2656316C (pt)
DE (1) DE602007011759D1 (pt)
MX (1) MX2009000038A (pt)
WO (1) WO2008005486A2 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7869211B2 (en) * 2006-06-30 2011-01-11 Siemens Industry, Inc. Electronic module configured for failure containment and system including same
US9192079B2 (en) * 2008-09-26 2015-11-17 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
US20100157527A1 (en) * 2008-12-23 2010-06-24 Ise Corporation High-Power Ultracapacitor Energy Storage Pack and Method of Use
US7837496B1 (en) 2009-11-17 2010-11-23 Hamilton Sundstrand Corporation Contactor mounting assembly with improved thermal characteristics
KR101189451B1 (ko) * 2010-12-24 2012-10-09 엘지전자 주식회사 인버터 스택
EP2557676B1 (de) * 2011-08-09 2014-02-26 Siemens Aktiengesellschaft Umrichteranordnung mit einem Luftkühlsystem
CN203278615U (zh) 2013-05-22 2013-11-06 Abb技术有限公司 一种用于中高压变频器的功率模块及包含其的变频器
US9578786B1 (en) * 2014-06-10 2017-02-21 Amazon Technologies, Inc. Computer system with bypass air plenum
US9839156B2 (en) * 2016-04-06 2017-12-05 Hamilton Sundstrand Corporation Circuit board assemblies

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027206A (en) * 1975-01-27 1977-05-31 L. H. Research Electronic cooling chassis
US5625545A (en) 1994-03-01 1997-04-29 Halmar Robicon Group Medium voltage PWM drive and method
US5680294A (en) * 1995-03-28 1997-10-21 The Whitaker Corporation Pluggable power supply for card cage
US6046921A (en) * 1996-08-27 2000-04-04 Tracewell; Larry L. Modular power supply
US5831847A (en) * 1997-02-05 1998-11-03 Jerome Industries Corp. Power supply with separated airflows
US5945746A (en) * 1997-08-21 1999-08-31 Tracewell Power, Inc. Power supply and power supply/backplane assembly and system
US5940288A (en) * 1998-06-08 1999-08-17 Tracewell Power, Inc. Card cage mounted power supply with heat dissipating architecture
US6295201B1 (en) * 1998-08-04 2001-09-25 Stratos Lightwave, Inc. Bus bar having embedded switching device
US6081423A (en) * 1998-12-22 2000-06-27 The Esab Group, Inc. Power supply with obliquely impinging airflow
CN2384366Y (zh) * 1999-07-09 2000-06-21 深圳奥特迅电力设备有限公司 具有良好散热和屏蔽功能的大功率高频开关电源
JP4388174B2 (ja) * 1999-09-06 2009-12-24 株式会社ソニー・コンピュータエンタテインメント 電子機器
US6198642B1 (en) * 1999-10-19 2001-03-06 Tracewell Power, Inc. Compact multiple output power supply
TWI260484B (en) * 2003-08-12 2006-08-21 Asustek Comp Inc Heat sink for power device on computer motherboard
US7019996B2 (en) * 2003-10-16 2006-03-28 Ballard Power Systems Corporation Power converter employing a planar transformer
CN2671220Y (zh) * 2003-11-06 2005-01-12 袁忠杰 风冷大功率高频开关电源
JP4207755B2 (ja) * 2003-11-07 2009-01-14 株式会社豊田自動織機 電子機器装置
US7113405B2 (en) * 2004-05-27 2006-09-26 Eaton Power Quality Corporation Integrated power modules with a cooling passageway and methods for forming the same
JP2006210516A (ja) * 2005-01-26 2006-08-10 Densei Lambda Kk 電子機器の冷却構造

Also Published As

Publication number Publication date
MX2009000038A (es) 2009-01-23
US20080304235A1 (en) 2008-12-11
ATE494766T1 (de) 2011-01-15
CN101491169B (zh) 2016-02-03
EP2036417B1 (en) 2011-01-05
DE602007011759D1 (de) 2011-02-17
JP2009543347A (ja) 2009-12-03
CA2656316C (en) 2015-02-24
CN101491169A (zh) 2009-07-22
BRPI0713873B1 (pt) 2018-11-13
EP2036417A2 (en) 2009-03-18
BRPI0713873A2 (pt) 2012-12-18
US7554804B2 (en) 2009-06-30
CA2656316A1 (en) 2008-01-10
JP5135340B2 (ja) 2013-02-06
WO2008005486A3 (en) 2008-02-28
WO2008005486A2 (en) 2008-01-10

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: SIEMENS BUILDING TECHNOLOGIES, INC. (US)

B25D Requested change of name of applicant approved

Owner name: SIEMENS INDUSTRY INC. (US)

B25A Requested transfer of rights approved

Owner name: SIEMENS AKTIENGESELLSCHAFT (DE)

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 13/11/2018, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2626 DE 04-05-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.