DE602007011759D1 - Für durchgehenden luftstrom konfiguriertes elektronisches modul und system damit - Google Patents

Für durchgehenden luftstrom konfiguriertes elektronisches modul und system damit

Info

Publication number
DE602007011759D1
DE602007011759D1 DE602007011759T DE602007011759T DE602007011759D1 DE 602007011759 D1 DE602007011759 D1 DE 602007011759D1 DE 602007011759 T DE602007011759 T DE 602007011759T DE 602007011759 T DE602007011759 T DE 602007011759T DE 602007011759 D1 DE602007011759 D1 DE 602007011759D1
Authority
DE
Germany
Prior art keywords
capacitors
electronic module
chassis
bus bars
air flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007011759T
Other languages
English (en)
Inventor
Jonathan Kunkle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Industry Inc
Original Assignee
Siemens Industry Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Industry Inc filed Critical Siemens Industry Inc
Publication of DE602007011759D1 publication Critical patent/DE602007011759D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Sampling And Sample Adjustment (AREA)
DE602007011759T 2006-06-30 2007-07-02 Für durchgehenden luftstrom konfiguriertes elektronisches modul und system damit Active DE602007011759D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US81806406P 2006-06-30 2006-06-30
US11/769,846 US7554804B2 (en) 2006-06-30 2007-06-28 Electronic module configured for air flow therethrough and system including same
PCT/US2007/015462 WO2008005486A2 (en) 2006-06-30 2007-07-02 Electronic module configured for air flow therethrough and system including same

Publications (1)

Publication Number Publication Date
DE602007011759D1 true DE602007011759D1 (de) 2011-02-17

Family

ID=38779674

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007011759T Active DE602007011759D1 (de) 2006-06-30 2007-07-02 Für durchgehenden luftstrom konfiguriertes elektronisches modul und system damit

Country Status (10)

Country Link
US (1) US7554804B2 (de)
EP (1) EP2036417B1 (de)
JP (1) JP5135340B2 (de)
CN (1) CN101491169B (de)
AT (1) ATE494766T1 (de)
BR (1) BRPI0713873B1 (de)
CA (1) CA2656316C (de)
DE (1) DE602007011759D1 (de)
MX (1) MX2009000038A (de)
WO (1) WO2008005486A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7869211B2 (en) * 2006-06-30 2011-01-11 Siemens Industry, Inc. Electronic module configured for failure containment and system including same
US9192079B2 (en) * 2008-09-26 2015-11-17 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
US20100157527A1 (en) * 2008-12-23 2010-06-24 Ise Corporation High-Power Ultracapacitor Energy Storage Pack and Method of Use
US7837496B1 (en) 2009-11-17 2010-11-23 Hamilton Sundstrand Corporation Contactor mounting assembly with improved thermal characteristics
KR101189451B1 (ko) * 2010-12-24 2012-10-09 엘지전자 주식회사 인버터 스택
EP2557676B1 (de) * 2011-08-09 2014-02-26 Siemens Aktiengesellschaft Umrichteranordnung mit einem Luftkühlsystem
CN203278615U (zh) 2013-05-22 2013-11-06 Abb技术有限公司 一种用于中高压变频器的功率模块及包含其的变频器
US9578786B1 (en) * 2014-06-10 2017-02-21 Amazon Technologies, Inc. Computer system with bypass air plenum
US9839156B2 (en) * 2016-04-06 2017-12-05 Hamilton Sundstrand Corporation Circuit board assemblies

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027206A (en) * 1975-01-27 1977-05-31 L. H. Research Electronic cooling chassis
US5625545A (en) * 1994-03-01 1997-04-29 Halmar Robicon Group Medium voltage PWM drive and method
US5680294A (en) * 1995-03-28 1997-10-21 The Whitaker Corporation Pluggable power supply for card cage
US6046921A (en) * 1996-08-27 2000-04-04 Tracewell; Larry L. Modular power supply
US5831847A (en) * 1997-02-05 1998-11-03 Jerome Industries Corp. Power supply with separated airflows
US5945746A (en) * 1997-08-21 1999-08-31 Tracewell Power, Inc. Power supply and power supply/backplane assembly and system
US5940288A (en) * 1998-06-08 1999-08-17 Tracewell Power, Inc. Card cage mounted power supply with heat dissipating architecture
US6295201B1 (en) * 1998-08-04 2001-09-25 Stratos Lightwave, Inc. Bus bar having embedded switching device
US6081423A (en) * 1998-12-22 2000-06-27 The Esab Group, Inc. Power supply with obliquely impinging airflow
CN2384366Y (zh) * 1999-07-09 2000-06-21 深圳奥特迅电力设备有限公司 具有良好散热和屏蔽功能的大功率高频开关电源
JP4388174B2 (ja) * 1999-09-06 2009-12-24 株式会社ソニー・コンピュータエンタテインメント 電子機器
US6198642B1 (en) * 1999-10-19 2001-03-06 Tracewell Power, Inc. Compact multiple output power supply
TWI260484B (en) * 2003-08-12 2006-08-21 Asustek Comp Inc Heat sink for power device on computer motherboard
US7019996B2 (en) * 2003-10-16 2006-03-28 Ballard Power Systems Corporation Power converter employing a planar transformer
CN2671220Y (zh) * 2003-11-06 2005-01-12 袁忠杰 风冷大功率高频开关电源
JP4207755B2 (ja) * 2003-11-07 2009-01-14 株式会社豊田自動織機 電子機器装置
US7113405B2 (en) * 2004-05-27 2006-09-26 Eaton Power Quality Corporation Integrated power modules with a cooling passageway and methods for forming the same
JP2006210516A (ja) * 2005-01-26 2006-08-10 Densei Lambda Kk 電子機器の冷却構造

Also Published As

Publication number Publication date
CA2656316C (en) 2015-02-24
MX2009000038A (es) 2009-01-23
CN101491169A (zh) 2009-07-22
EP2036417B1 (de) 2011-01-05
BRPI0713873B1 (pt) 2018-11-13
BRPI0713873A2 (pt) 2012-12-18
EP2036417A2 (de) 2009-03-18
WO2008005486A3 (en) 2008-02-28
US20080304235A1 (en) 2008-12-11
US7554804B2 (en) 2009-06-30
JP2009543347A (ja) 2009-12-03
CA2656316A1 (en) 2008-01-10
ATE494766T1 (de) 2011-01-15
CN101491169B (zh) 2016-02-03
WO2008005486A2 (en) 2008-01-10
JP5135340B2 (ja) 2013-02-06
BRPI0713873A8 (pt) 2017-03-07

Similar Documents

Publication Publication Date Title
DE602007011759D1 (de) Für durchgehenden luftstrom konfiguriertes elektronisches modul und system damit
TW200802400A (en) Thermal management using an on-die thermal sensor
ATE512574T1 (de) Direkt injizierte zwangskonvektionskühlung für elektronik
WO2008013850A3 (en) Staggered memory layout for improved cooling in reduced height enclosure
DE50301552D1 (de) Kühlanordnung
TW200802782A (en) Chip module for complete power train
TW200637470A (en) Heat-dissipating module of electronic device
WO2007131095A3 (en) Thermal management device for a memory module
TW200613970A (en) On board performance monitor and power control system
EA200702115A1 (ru) Панельное отопительное устройство
HK1073965A1 (en) Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
TW200741461A (en) Memory interface to bridge memory buses
WO2007041977A3 (de) Elektrisches modul
DE60106541D1 (de) LVDS Schaltungen, die für die Stromversorgung in Serie geschaltet sind
WO2008039886A3 (en) Main memory in a system with a memory controller configured to control access to non-volatile memory, and related technologies
TW200603386A (en) Interconnect structure with aluminum core
EP1691286A4 (de) Task-verwaltungsverfahren, task-verwaltungseinrichtung, integrierte halbleiterschaltung, elektronische einrichtung und task-verwaltungssystem
GB0618893D0 (en) Impingement cooling of components in an electronic system
TW200621140A (en) Memory cooler
SG144030A1 (en) Method and apparatus for providing void structures
TW200707279A (en) Task scheduling to devices with same connection address
TW200637977A (en) Fan noise attenuator
ATE547828T1 (de) Sammelschienenvorrichtung und damit montierte leiterplatte
RU2005138593A (ru) Устройство защиты выводов интегральных схем со структурой мдп от электростатических разрядов
TW200802762A (en) Heat sink, electronic device, and tuner apparatus