CN101491169B - 配置用于流过气流的电子模块和包括该电子模块的系统 - Google Patents
配置用于流过气流的电子模块和包括该电子模块的系统 Download PDFInfo
- Publication number
- CN101491169B CN101491169B CN200780024946.XA CN200780024946A CN101491169B CN 101491169 B CN101491169 B CN 101491169B CN 200780024946 A CN200780024946 A CN 200780024946A CN 101491169 B CN101491169 B CN 101491169B
- Authority
- CN
- China
- Prior art keywords
- capacitor
- flow
- air
- underframe
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 91
- 230000004807 localization Effects 0.000 claims 3
- 239000004020 conductor Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 7
- 239000012634 fragment Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229910001335 Galvanized steel Inorganic materials 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 239000008397 galvanized steel Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- -1 such as Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81806406P | 2006-06-30 | 2006-06-30 | |
US60/818,064 | 2006-06-30 | ||
US11/769,846 | 2007-06-28 | ||
US11/769,846 US7554804B2 (en) | 2006-06-30 | 2007-06-28 | Electronic module configured for air flow therethrough and system including same |
PCT/US2007/015462 WO2008005486A2 (en) | 2006-06-30 | 2007-07-02 | Electronic module configured for air flow therethrough and system including same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101491169A CN101491169A (zh) | 2009-07-22 |
CN101491169B true CN101491169B (zh) | 2016-02-03 |
Family
ID=38779674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780024946.XA Active CN101491169B (zh) | 2006-06-30 | 2007-07-02 | 配置用于流过气流的电子模块和包括该电子模块的系统 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7554804B2 (zh) |
EP (1) | EP2036417B1 (zh) |
JP (1) | JP5135340B2 (zh) |
CN (1) | CN101491169B (zh) |
AT (1) | ATE494766T1 (zh) |
BR (1) | BRPI0713873B1 (zh) |
CA (1) | CA2656316C (zh) |
DE (1) | DE602007011759D1 (zh) |
MX (1) | MX2009000038A (zh) |
WO (1) | WO2008005486A2 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7869211B2 (en) * | 2006-06-30 | 2011-01-11 | Siemens Industry, Inc. | Electronic module configured for failure containment and system including same |
US9192079B2 (en) * | 2008-09-26 | 2015-11-17 | Rockwell Automation Technologies, Inc. | Power electronic module cooling system and method |
US20100157527A1 (en) * | 2008-12-23 | 2010-06-24 | Ise Corporation | High-Power Ultracapacitor Energy Storage Pack and Method of Use |
US7837496B1 (en) | 2009-11-17 | 2010-11-23 | Hamilton Sundstrand Corporation | Contactor mounting assembly with improved thermal characteristics |
KR101189451B1 (ko) * | 2010-12-24 | 2012-10-09 | 엘지전자 주식회사 | 인버터 스택 |
EP2557676B1 (de) * | 2011-08-09 | 2014-02-26 | Siemens Aktiengesellschaft | Umrichteranordnung mit einem Luftkühlsystem |
CN203278615U (zh) | 2013-05-22 | 2013-11-06 | Abb技术有限公司 | 一种用于中高压变频器的功率模块及包含其的变频器 |
US9578786B1 (en) * | 2014-06-10 | 2017-02-21 | Amazon Technologies, Inc. | Computer system with bypass air plenum |
US9839156B2 (en) * | 2016-04-06 | 2017-12-05 | Hamilton Sundstrand Corporation | Circuit board assemblies |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5945746A (en) * | 1997-08-21 | 1999-08-31 | Tracewell Power, Inc. | Power supply and power supply/backplane assembly and system |
CN2384366Y (zh) * | 1999-07-09 | 2000-06-21 | 深圳奥特迅电力设备有限公司 | 具有良好散热和屏蔽功能的大功率高频开关电源 |
EP1162662A2 (en) * | 2000-06-05 | 2001-12-12 | METHODE ELECTRONICS, Inc. | Bus bar having embedded switching device |
CN2671220Y (zh) * | 2003-11-06 | 2005-01-12 | 袁忠杰 | 风冷大功率高频开关电源 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4027206A (en) * | 1975-01-27 | 1977-05-31 | L. H. Research | Electronic cooling chassis |
US5625545A (en) | 1994-03-01 | 1997-04-29 | Halmar Robicon Group | Medium voltage PWM drive and method |
US5680294A (en) * | 1995-03-28 | 1997-10-21 | The Whitaker Corporation | Pluggable power supply for card cage |
US6046921A (en) * | 1996-08-27 | 2000-04-04 | Tracewell; Larry L. | Modular power supply |
US5831847A (en) * | 1997-02-05 | 1998-11-03 | Jerome Industries Corp. | Power supply with separated airflows |
US5940288A (en) * | 1998-06-08 | 1999-08-17 | Tracewell Power, Inc. | Card cage mounted power supply with heat dissipating architecture |
US6081423A (en) * | 1998-12-22 | 2000-06-27 | The Esab Group, Inc. | Power supply with obliquely impinging airflow |
JP4388174B2 (ja) * | 1999-09-06 | 2009-12-24 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
US6198642B1 (en) * | 1999-10-19 | 2001-03-06 | Tracewell Power, Inc. | Compact multiple output power supply |
TWI260484B (en) * | 2003-08-12 | 2006-08-21 | Asustek Comp Inc | Heat sink for power device on computer motherboard |
US7019996B2 (en) * | 2003-10-16 | 2006-03-28 | Ballard Power Systems Corporation | Power converter employing a planar transformer |
JP4207755B2 (ja) * | 2003-11-07 | 2009-01-14 | 株式会社豊田自動織機 | 電子機器装置 |
US7113405B2 (en) * | 2004-05-27 | 2006-09-26 | Eaton Power Quality Corporation | Integrated power modules with a cooling passageway and methods for forming the same |
JP2006210516A (ja) * | 2005-01-26 | 2006-08-10 | Densei Lambda Kk | 電子機器の冷却構造 |
-
2007
- 2007-06-28 US US11/769,846 patent/US7554804B2/en active Active
- 2007-07-02 JP JP2009518360A patent/JP5135340B2/ja not_active Expired - Fee Related
- 2007-07-02 EP EP07796686A patent/EP2036417B1/en not_active Not-in-force
- 2007-07-02 CA CA2656316A patent/CA2656316C/en active Active
- 2007-07-02 DE DE602007011759T patent/DE602007011759D1/de active Active
- 2007-07-02 AT AT07796686T patent/ATE494766T1/de not_active IP Right Cessation
- 2007-07-02 WO PCT/US2007/015462 patent/WO2008005486A2/en active Application Filing
- 2007-07-02 MX MX2009000038A patent/MX2009000038A/es active IP Right Grant
- 2007-07-02 CN CN200780024946.XA patent/CN101491169B/zh active Active
- 2007-07-02 BR BRPI0713873A patent/BRPI0713873B1/pt not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5945746A (en) * | 1997-08-21 | 1999-08-31 | Tracewell Power, Inc. | Power supply and power supply/backplane assembly and system |
CN2384366Y (zh) * | 1999-07-09 | 2000-06-21 | 深圳奥特迅电力设备有限公司 | 具有良好散热和屏蔽功能的大功率高频开关电源 |
EP1162662A2 (en) * | 2000-06-05 | 2001-12-12 | METHODE ELECTRONICS, Inc. | Bus bar having embedded switching device |
CN2671220Y (zh) * | 2003-11-06 | 2005-01-12 | 袁忠杰 | 风冷大功率高频开关电源 |
Also Published As
Publication number | Publication date |
---|---|
JP2009543347A (ja) | 2009-12-03 |
EP2036417B1 (en) | 2011-01-05 |
US7554804B2 (en) | 2009-06-30 |
EP2036417A2 (en) | 2009-03-18 |
BRPI0713873B1 (pt) | 2018-11-13 |
DE602007011759D1 (de) | 2011-02-17 |
CN101491169A (zh) | 2009-07-22 |
JP5135340B2 (ja) | 2013-02-06 |
CA2656316A1 (en) | 2008-01-10 |
MX2009000038A (es) | 2009-01-23 |
BRPI0713873A8 (pt) | 2017-03-07 |
WO2008005486A2 (en) | 2008-01-10 |
WO2008005486A3 (en) | 2008-02-28 |
BRPI0713873A2 (pt) | 2012-12-18 |
US20080304235A1 (en) | 2008-12-11 |
ATE494766T1 (de) | 2011-01-15 |
CA2656316C (en) | 2015-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS BUILDING TECH AG Free format text: FORMER OWNER: SIEMENS INDUSTRIAL AUTOMATION, INC. Effective date: 20100818 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20100818 Address after: American Georgia Applicant after: SIEMENS INDUSTRY, Inc. Address before: Georgia, USA Applicant before: SIEMENS ENERGY & AUTOMATION, Inc. |
|
ASS | Succession or assignment of patent right |
Owner name: SIEMENS AKTIENGESELLSCHAFT Free format text: FORMER OWNER: SIEMENS BUILDING TECH AG Effective date: 20150612 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150612 Address after: Munich, Germany Applicant after: SIEMENS AG Address before: American Georgia Applicant before: SIEMENS INDUSTRY, Inc. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240328 Address after: Nuremberg, Germany Patentee after: Yinmengda Co.,Ltd. Country or region after: Germany Address before: Munich, Germany Patentee before: SIEMENS AG Country or region before: Germany |
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TR01 | Transfer of patent right |