MX9603163A - Soporte de datos con un modulo electronico y un metodo para producir el mismo. - Google Patents
Soporte de datos con un modulo electronico y un metodo para producir el mismo.Info
- Publication number
- MX9603163A MX9603163A MX9603163A MX9603163A MX9603163A MX 9603163 A MX9603163 A MX 9603163A MX 9603163 A MX9603163 A MX 9603163A MX 9603163 A MX9603163 A MX 9603163A MX 9603163 A MX9603163 A MX 9603163A
- Authority
- MX
- Mexico
- Prior art keywords
- data carrier
- electronic module
- producing
- card
- same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24934—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including paper layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31971—Of carbohydrate
- Y10T428/31993—Of paper
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
La invencion se refiere a un portador de datos que comprende un cuerpo de tarjeta de una capa o multiples capas en que esta empotrado un modulo electronico. Las capas del cuerpo de tarjeta consta de papel y/o carton y están conectadas por ejemplo mediante un adhesivo térmicamente activable o un adhesivo de contacto. Las tarjetas pueden ser producidas mediante tecnología continua, suministrandose las diferentes capas de tarjetas a partir de rollos sin fin, provistos de las ventanas necesarias para recibir los modulos y que finalmente se interconectan. Los modulos se insertan en los huecos resultantes. Son perforadas las tarjetas individuales.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4403513A DE4403513A1 (de) | 1994-02-04 | 1994-02-04 | Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte |
PCT/EP1995/000397 WO1995021423A1 (de) | 1994-02-04 | 1995-02-03 | Datenträger mit einem elektronischen modul und verfahren zur herstellung desselben |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9603163A true MX9603163A (es) | 1997-03-29 |
Family
ID=6509509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9603163A MX9603163A (es) | 1994-02-04 | 1995-02-03 | Soporte de datos con un modulo electronico y un metodo para producir el mismo. |
Country Status (14)
Country | Link |
---|---|
US (1) | US5888624A (es) |
EP (1) | EP0742926B2 (es) |
JP (1) | JPH09508330A (es) |
KR (1) | KR100408842B1 (es) |
CN (1) | CN1098506C (es) |
AT (1) | ATE168206T1 (es) |
AU (1) | AU1807395A (es) |
CA (1) | CA2182705C (es) |
DE (3) | DE9422424U1 (es) |
DK (1) | DK0742926T4 (es) |
ES (1) | ES2117854T5 (es) |
MX (1) | MX9603163A (es) |
RU (1) | RU2169389C2 (es) |
WO (1) | WO1995021423A1 (es) |
Families Citing this family (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19512725C1 (de) * | 1995-04-05 | 1996-09-12 | Orga Kartensysteme Gmbh | Ausweiskarte o.dgl. in Form einer Chipkarte |
DE19534480C2 (de) | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
GB2309933B (en) * | 1996-02-12 | 2000-02-23 | Plessey Telecomm | Contact card |
FR2749687B1 (fr) * | 1996-06-07 | 1998-07-17 | Solaic Sa | Carte a memoire et procede de fabrication d'une telle carte |
JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
DE19632117C1 (de) * | 1996-08-08 | 1997-12-18 | Siemens Ag | Datenträger zur kontaktlosen Übertragung von elektrischen Signalen |
DE19708617C2 (de) * | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
DE19721058A1 (de) * | 1997-05-20 | 1998-11-26 | Giesecke & Devrient Gmbh | Spritzgußkarte mit Dekorschicht |
EP0905657B1 (en) | 1997-09-23 | 2003-05-28 | STMicroelectronics S.r.l. | Currency note comprising an integrated circuit |
NL1008929C2 (nl) * | 1998-04-20 | 1999-10-21 | Vhp Ugchelen Bv | Uit papier vervaardigd substraat voorzien van een geïntegreerde schakeling. |
TW484101B (en) * | 1998-12-17 | 2002-04-21 | Hitachi Ltd | Semiconductor device and its manufacturing method |
FR2796183B1 (fr) * | 1999-07-07 | 2001-09-28 | A S K | Ticket d'acces sans contact et son procede de fabrication |
DE19935170A1 (de) * | 1999-07-28 | 2001-02-01 | Koenig & Bauer Ag | Verfahren zur Veredelung |
FR2801709B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude |
FR2801707B1 (fr) | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
FR2801708B1 (fr) | 1999-11-29 | 2003-12-26 | A S K | Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux |
DE10016715C1 (de) | 2000-04-04 | 2001-09-06 | Infineon Technologies Ag | Herstellungsverfahren für laminierte Chipkarten |
DE10032128A1 (de) * | 2000-07-05 | 2002-01-17 | Giesecke & Devrient Gmbh | Sicherheitspapier und daraus hergestelltes Wertdokument |
US6533181B1 (en) * | 2000-07-22 | 2003-03-18 | Roboric Vision Systems, Inc. | Direct marking of parts with encoded symbology method, apparatus and symbolody |
DE20014560U1 (de) | 2000-08-23 | 2000-10-26 | Smon, Branislav, 71686 Remseck | Flachmaterial, insbesondere zur Herstellung von Kreditkarten, Geldkarten, Telefonkarten o.dgl. |
JP2002092577A (ja) * | 2000-09-20 | 2002-03-29 | Hitachi Maxell Ltd | コンビカード及びその製造方法 |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
DE10139395A1 (de) * | 2001-08-10 | 2003-03-06 | Infineon Technologies Ag | Kontaktierung von Halbleiterchips in Chipkarten |
JP2003085525A (ja) * | 2001-09-13 | 2003-03-20 | Konica Corp | Icカード及びカード認証方法 |
FR2829857B1 (fr) * | 2001-09-14 | 2004-09-17 | A S K | Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique |
WO2003026010A1 (fr) | 2001-09-18 | 2003-03-27 | Nagra Id Sa | Étiquette électronique de faible épaisseur et procédé de fabrication d'une telle étiquette |
WO2003034103A1 (fr) * | 2001-10-12 | 2003-04-24 | Daicel Chemical Industries, Ltd. | Feuille de dosage de la lumiere et procede de fabrication de cette feuille |
PT1456810E (pt) | 2001-12-18 | 2011-07-25 | L 1 Secure Credentialing Inc | Características de segurança com imagens múltiplas para documentos de identificação e processo para as efectuar |
US20030211296A1 (en) * | 2002-05-10 | 2003-11-13 | Robert Jones | Identification card printed with jet inks and systems and methods of making same |
AU2002364746A1 (en) | 2001-12-24 | 2003-07-15 | Digimarc Id Systems, Llc | Systems, compositions, and methods for full color laser engraving of id documents |
EP1485867A4 (en) * | 2001-12-24 | 2012-02-22 | L 1 Secure Credentialing Inc | CONTACT CHIP CARDS HAVING A DOCUMENT CORE AND CONTACTLESS CHIP CARDS COMPRISING A MULTILAYER STRUCTURE, A PET IDENTIFICATION DOCUMENT, AND METHODS OF PRODUCING THE SAME |
WO2003055638A1 (en) | 2001-12-24 | 2003-07-10 | Digimarc Id Systems, Llc | Laser etched security features for identification documents and methods of making same |
US7815124B2 (en) | 2002-04-09 | 2010-10-19 | L-1 Secure Credentialing, Inc. | Image processing techniques for printing identification cards and documents |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
CA2471457C (en) | 2001-12-24 | 2011-08-02 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
JP3645222B2 (ja) * | 2002-01-22 | 2005-05-11 | 日立電子サービス株式会社 | Idチップ付き身分証明用写真 |
US6851617B2 (en) * | 2002-04-19 | 2005-02-08 | Avery Dennison Corporation | Laser imageable RFID label/tag |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
DE10232568A1 (de) * | 2002-07-18 | 2004-01-29 | Agfa-Gevaert Ag | Identitätskarte |
US6910635B1 (en) * | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
US7540426B1 (en) | 2002-11-07 | 2009-06-02 | American Express Travel Related Services Company, Inc. | Foldable transaction cards and methods of making the same |
US7804982B2 (en) | 2002-11-26 | 2010-09-28 | L-1 Secure Credentialing, Inc. | Systems and methods for managing and detecting fraud in image databases used with identification documents |
JP2004185208A (ja) * | 2002-12-02 | 2004-07-02 | Sony Corp | Icカード |
DE10304824A1 (de) * | 2003-01-31 | 2004-08-12 | Varta Microbattery Gmbh | Dünne elektronische Chipkarte |
WO2004095348A2 (en) | 2003-04-16 | 2004-11-04 | Digimarc Corporation | Three dimensional data storage |
DE10356153B4 (de) | 2003-12-02 | 2010-01-14 | Infineon Technologies Ag | Modul für kontaktlose Chipkarten oder Identifizierungssysteme |
US7721956B2 (en) | 2003-12-10 | 2010-05-25 | American Express Travel Related Services Company, Inc. | Foldable transaction card systems |
US7631812B2 (en) | 2003-12-10 | 2009-12-15 | Williams Troy P | Foldable transaction card systems |
DE102004011702B4 (de) | 2004-03-10 | 2006-02-16 | Circle Smart Card Ag | Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte |
US7744002B2 (en) * | 2004-03-11 | 2010-06-29 | L-1 Secure Credentialing, Inc. | Tamper evident adhesive and identification document including same |
DE202004003701U1 (de) * | 2004-03-12 | 2004-08-12 | Cubit Electronics Gmbh | Flacher Transponder |
DE102004018081A1 (de) | 2004-04-08 | 2005-10-27 | Giesecke & Devrient Gmbh | Sicherheitspapier |
FR2868987B1 (fr) | 2004-04-14 | 2007-02-16 | Arjo Wiggins Secutity Sas Soc | Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur |
KR100602621B1 (ko) * | 2004-06-16 | 2006-07-19 | 한국조폐공사 | 조립식 콤비카드 및 이의 제조방법 |
ES2373029T3 (es) * | 2004-06-16 | 2012-01-30 | Gemalto Sa | Documento electrónico blindado sin contacto. |
FR2877461B1 (fr) * | 2004-11-02 | 2007-05-18 | Gemplus Sa | Dispositif electronique personnalise du type cle usb et procede de fabrication d'un tel dispositif |
WO2006059732A1 (ja) | 2004-12-03 | 2006-06-08 | Hallys Corporation | インターポーザ接合装置 |
US20060146271A1 (en) * | 2005-01-04 | 2006-07-06 | Pennaz Thomas J | Universal display module |
CN101156508B (zh) | 2005-04-06 | 2010-08-18 | 哈里斯股份有限公司 | 电子部件的制造装置 |
US7599192B2 (en) * | 2005-04-11 | 2009-10-06 | Aveso, Inc. | Layered structure with printed elements |
US7821794B2 (en) | 2005-04-11 | 2010-10-26 | Aveso, Inc. | Layered label structure with timer |
US7810718B2 (en) * | 2005-05-12 | 2010-10-12 | Cubic Corporation | Variable thickness data card body |
DE102005032489B3 (de) * | 2005-07-04 | 2006-11-16 | Schweizer Electronic Ag | Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren |
JP2009526307A (ja) * | 2006-02-09 | 2009-07-16 | エブゲネヴィッチ バルチャイティス,バディム | 電気接点を備えたプラスチックカード |
US8061623B2 (en) * | 2006-02-09 | 2011-11-22 | Vadim Evgenevich Balchaytis | Plastic card provided with electrical contacts |
US20070237932A1 (en) * | 2006-04-05 | 2007-10-11 | Assa Abloy Ab | Thermally stable proximity identification card |
KR100891330B1 (ko) * | 2007-02-21 | 2009-03-31 | 삼성전자주식회사 | 반도체 패키지 장치와, 반도체 패키지의 제조방법과,반도체 패키지 장치를 갖는 카드 장치 및 반도체 패키지장치를 갖는 카드 장치의 제조 방법 |
EP2014463B1 (en) | 2007-06-22 | 2015-07-29 | Agfa-Gevaert N.V. | Smart information carrier and production process therefor. |
FR2932908B1 (fr) * | 2008-06-24 | 2012-11-16 | Arjowiggins Licensing Sas | Structure comportant un filigrane ou pseudo-filigrane et un dispositif a microcircuit integre. |
CA2741675A1 (en) * | 2008-10-23 | 2010-04-29 | Ocelot, Llc. | Data storage devices |
CN101582127B (zh) * | 2008-12-16 | 2011-07-27 | 北京大拙至诚科技发展有限公司 | 镶嵌式智能卡卡基及其制造方法 |
DE102009006341A1 (de) * | 2009-01-27 | 2010-07-29 | Giesecke & Devrient Gmbh | Datenträgeranordnung |
DE102009023405A1 (de) * | 2009-05-29 | 2010-12-02 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung tragbarer Datenträger |
DE102009032678A1 (de) * | 2009-07-09 | 2011-03-03 | Bundesdruckerei Gmbh | Verfahren und Vorrichtung zur Herstellung eines Inlays für einen Folienverbund sowie Folienverbund mit Inlay |
US8469271B2 (en) | 2009-10-22 | 2013-06-25 | Intellipaper, Llc | Electronic storage devices, programming methods, and device manufacturing methods |
US8469280B2 (en) | 2009-10-22 | 2013-06-25 | Intellipaper, Llc | Programming devices and programming methods |
US8561910B2 (en) | 2009-10-22 | 2013-10-22 | Intellipaper, Llc | Memory programming methods and memory programming devices |
DE102009050753A1 (de) * | 2009-10-27 | 2011-04-28 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Inlays für kartenförmige Datenträger |
EP2339511A1 (fr) * | 2009-12-17 | 2011-06-29 | Gemalto SA | Objet communicant avec sécurisation d'une interface de communication par contact |
DE102010011127A1 (de) * | 2010-03-11 | 2011-09-15 | Bundesdruckerei Gmbh | Klebstoffzusammensetzung für ein Sicherheits-und/oder Wertdokument mit einem Schaltkreis |
WO2011127328A2 (en) | 2010-04-07 | 2011-10-13 | Intellipaper, Llc | Electronic assemblies and methods of forming electronic assemblies |
FR2959581B1 (fr) | 2010-04-28 | 2012-08-17 | Arjowiggins Security | Insert fibreux constitue en une seule couche et equipe d'un dispositif electronique a communication sans contact. |
GB201012012D0 (en) * | 2010-07-16 | 2010-09-01 | Novalia Ltd | Laminate |
FR2963275B1 (fr) * | 2010-07-30 | 2012-08-17 | Arjowiggins Security | Carte multicouche comportant une couche externe fibreuse |
FR2964219B1 (fr) * | 2010-08-24 | 2012-09-21 | Oberthur Technologies | Carte a microcircuit comprenant une mini-carte |
FR2974925B1 (fr) | 2011-05-02 | 2013-06-14 | Oberthur Technologies | Procede de preparation d'un support de carte a base de cellulose pour minicarte |
FR2980137B1 (fr) | 2011-09-20 | 2014-12-05 | Oberthur Technologies | Procede de personnalisation d'un article et article obtenu par un tel procede |
JP2014534493A (ja) * | 2011-09-28 | 2014-12-18 | ジェマルト・テクノロジーズ・アジア・リミテッド | 超小型回路が備えられたデータキャリアを製造する方法 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
FR2985345B1 (fr) * | 2011-12-29 | 2021-11-26 | Oberthur Technologies | Procede de fabrication d'une carte de petite epaisseur detachable d'une plaque de grande epaisseur |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
RU2510437C1 (ru) * | 2012-11-07 | 2014-03-27 | Федеральное Государственное Унитарное Предприятие "Гознак" (Фгуп "Гознак") | Защищенное от подделки многослойное изделие и способ его изготовления |
DE102013002536A1 (de) | 2013-02-14 | 2014-08-14 | Colorplast Ag | Verfahren zur Herstellung einer Papierträgerkarte mit heraustrennbarer integrierter Chipmodulkarte und Papierträgerkarte aus Papier mit heraustrennbarer integrierter Chipmodulkarte |
CN103246913B (zh) * | 2013-05-28 | 2018-04-03 | 上海中卡智能卡有限公司 | 一种生产ic智能卡的方法 |
DE102013009971A1 (de) | 2013-06-14 | 2014-12-18 | Bielomatik Leuze Gmbh + Co. Kg | Herstellungsverfahren für tragbare Datenträger |
FR3009636B1 (fr) * | 2013-08-06 | 2015-09-04 | Oberthur Technologies | Carte a puce et procede de fabrication d'une telle carte a puce |
FR3011506A1 (fr) | 2013-10-04 | 2015-04-10 | Arjowiggins Security | Structure de securite multicouche |
DE102014000133B4 (de) * | 2014-01-13 | 2015-10-15 | Melzer Maschinenbau Gmbh | Verfahren und Einrichtung zur Bearbeitung eines Substrats |
US20150286921A1 (en) * | 2014-04-03 | 2015-10-08 | Infineon Technologies Ag | Chip card substrate and method of forming a chip card substrate |
DE102014007930A1 (de) * | 2014-05-27 | 2015-12-03 | Giesecke & Devrient Gmbh | Datenträgerherstellungsverfahren und Bearbeitungsvorrichtung |
DE102014012394A1 (de) * | 2014-08-21 | 2016-02-25 | Giesecke & Devrient Gmbh | Datenträger mit Teilstück |
EP3091482B1 (en) * | 2015-05-08 | 2018-12-12 | Giesecke+Devrient Mobile Security GmbH | Method for producing a data carrier and data carrier |
WO2017030964A1 (en) | 2015-08-14 | 2017-02-23 | Matthew Stern | Two-piece transaction card construction |
CN105760926A (zh) * | 2016-02-01 | 2016-07-13 | 上海哲山电子科技有限公司 | 有源智能卡的制造方法及有源智能卡 |
NO343888B1 (no) * | 2016-10-13 | 2019-07-01 | Terje Ernst Mikalsen | Anvendelse av karbondioksid (CO2) fra et landfast oppdrettsanlegg til fremstilling av metanol og/eller metan. |
CN108073972A (zh) * | 2017-12-29 | 2018-05-25 | 靖州鑫兴智能科技有限公司 | 一种双界面芯片ic卡及其制备方法 |
CN110349868A (zh) * | 2019-06-25 | 2019-10-18 | 姜凤明 | 电子芯片封装方法 |
DE102020127160A1 (de) * | 2020-10-15 | 2022-04-21 | exceet Card Austria GmbH | Chipkarte |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2920012C2 (de) * | 1979-05-17 | 1988-09-29 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
ATE4593T1 (de) * | 1979-07-03 | 1983-09-15 | Duphar International Research B.V | Pyrazolin-derivate, verfahren zur herstellung dieser verbindungen sowie insektizide zusammensetzung auf der basis dieser verbindungen. |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
GB2105952A (en) * | 1981-08-11 | 1983-03-30 | Standard Telephones Cables Ltd | Antitheft label |
US4413254A (en) * | 1981-09-04 | 1983-11-01 | Sensormatic Electronics Corporation | Combined radio and magnetic energy responsive surveillance marker and system |
DE3239597A1 (de) * | 1982-10-26 | 1984-04-26 | Marco Polo Industries & Merchandising Co., Ltd., Kowloon | Toenende postkarte |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
JPS625367U (es) * | 1985-03-16 | 1987-01-13 | ||
JPS625363U (es) * | 1985-03-25 | 1987-01-13 | ||
JPS61188871U (es) * | 1985-05-16 | 1986-11-25 | ||
DE3528686A1 (de) * | 1985-08-09 | 1987-02-12 | Oldenbourg Graphik R | Verfahren und herstellung einer ausweiskarte und ausweiskarte |
US4846922A (en) * | 1986-09-29 | 1989-07-11 | Monarch Marking Systems, Inc. | Method of making deactivatable tags |
FR2609821B1 (fr) * | 1987-01-16 | 1989-03-31 | Flonic Sa | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
JPH01108095A (ja) * | 1987-10-20 | 1989-04-25 | Ryoden Kasei Co Ltd | Icカード |
DE3804361C1 (es) * | 1988-02-12 | 1988-09-29 | Deutsche Bundespost, Vertreten Durch Den Praesidenten Des Fernmeldetechnischen Zentralamtes, 6100 Darmstadt, De | |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
US5059950A (en) * | 1990-09-04 | 1991-10-22 | Monarch Marking Systems, Inc. | Deactivatable electronic article surveillance tags, tag webs and method of making tag webs |
DE4040770C2 (de) * | 1990-12-19 | 1999-11-11 | Gao Ges Automation Org | Datenträger mit integriertem Schaltkreis |
DE4142392C2 (de) * | 1991-12-20 | 2003-10-16 | Gao Ges Automation Org | Verfahren und Vorrichtung zum Herstellen von spritzgegossenen Chipkarten mit bereichsweise reduzierter Wandstärke |
DE4206445A1 (de) * | 1992-02-27 | 1993-09-02 | Klaus Hossfeld | Telefonmarkentraeger, naemlich telefonkarte mit auswechselbarem chip |
US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
-
1994
- 1994-02-04 DE DE9422424U patent/DE9422424U1/de not_active Expired - Lifetime
- 1994-02-04 DE DE4403513A patent/DE4403513A1/de not_active Withdrawn
-
1995
- 1995-02-03 MX MX9603163A patent/MX9603163A/es unknown
- 1995-02-03 EP EP95909671A patent/EP0742926B2/de not_active Expired - Lifetime
- 1995-02-03 AU AU18073/95A patent/AU1807395A/en not_active Abandoned
- 1995-02-03 DE DE59502764T patent/DE59502764D1/de not_active Expired - Lifetime
- 1995-02-03 KR KR1019960704220A patent/KR100408842B1/ko not_active IP Right Cessation
- 1995-02-03 RU RU96117590/09A patent/RU2169389C2/ru not_active IP Right Cessation
- 1995-02-03 DK DK95909671T patent/DK0742926T4/da active
- 1995-02-03 JP JP7520392A patent/JPH09508330A/ja active Pending
- 1995-02-03 CA CA002182705A patent/CA2182705C/en not_active Expired - Lifetime
- 1995-02-03 CN CN95192323A patent/CN1098506C/zh not_active Expired - Lifetime
- 1995-02-03 AT AT95909671T patent/ATE168206T1/de active
- 1995-02-03 WO PCT/EP1995/000397 patent/WO1995021423A1/de active IP Right Grant
- 1995-02-03 ES ES95909671T patent/ES2117854T5/es not_active Expired - Lifetime
- 1995-02-03 US US08/682,781 patent/US5888624A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU1807395A (en) | 1995-08-21 |
DK0742926T3 (da) | 1999-04-19 |
ES2117854T5 (es) | 2007-11-16 |
DE4403513A1 (de) | 1995-08-10 |
EP0742926B1 (de) | 1998-07-08 |
RU96117590A (ru) | 1998-11-27 |
EP0742926B2 (de) | 2007-06-27 |
CA2182705C (en) | 2007-05-01 |
ATE168206T1 (de) | 1998-07-15 |
KR100408842B1 (ko) | 2004-03-26 |
DE9422424U1 (de) | 2002-02-21 |
CN1144571A (zh) | 1997-03-05 |
ES2117854T3 (es) | 1998-08-16 |
WO1995021423A1 (de) | 1995-08-10 |
DK0742926T4 (da) | 2007-07-16 |
DE59502764D1 (de) | 1998-08-13 |
EP0742926A1 (de) | 1996-11-20 |
CN1098506C (zh) | 2003-01-08 |
RU2169389C2 (ru) | 2001-06-20 |
US5888624A (en) | 1999-03-30 |
JPH09508330A (ja) | 1997-08-26 |
CA2182705A1 (en) | 1995-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX9603163A (es) | Soporte de datos con un modulo electronico y un metodo para producir el mismo. | |
US5518787A (en) | Construction for a laminated card or label | |
EP0638873B1 (en) | Sheet-framed IC card carrier and method for producing the same | |
CA2134400A1 (en) | Card intermediate and method | |
AU6238396A (en) | Card-shaped data carrier for contactless applications with acomponent and a transmission system for the contactless applcations, method of producing such a card-shaped data carrier and module therefor | |
WO2003096258A3 (en) | Identification card printer-assembler for over-the-counter card issuing | |
CA2158284A1 (en) | Form with selectively spaced appliance labels | |
MY116336A (en) | Security card and method for making same. | |
ATE245545T1 (de) | Laminat | |
CA2260581A1 (en) | Peel off redemption coupon card with microprocessor chip and tracking system | |
AU9353498A (en) | Method for making an electronic module or label, resulting electronic module or label and medium containing such module or label | |
CA2320417A1 (en) | Applications for electronic reusable paper | |
AU687978B2 (en) | Form with detachable card, support and covering material therefor, and process for producing the same | |
EP0869408A4 (en) | LAMINATE WITH RELIEF HOLOGRAM AND LABEL FOR PREPARING SUCH LAMINATE WITH RELIEF HOLOGRAM | |
EP0646895A3 (en) | Thin smart card and method of making the same. | |
HUP9903550A3 (en) | Method for producing electronic module containing at least one electronic component, and electonic module formed as a chip card produced by the method | |
DE69816110D1 (de) | Vorrichtung und verfahren zur automatisierten herstellung von personenspezifischen karten und taschen | |
CA2467705A1 (en) | Business card stock with peel off labels, and method | |
MY127652A (en) | Pressure-sensitive adhesive sheet | |
ZA971894B (en) | Identification medium with a passive electronic data carrier. | |
EP0919369A3 (de) | Verfahren zum Herstellen von Laminiertaschen und Laminiertasche | |
MY114913A (en) | Bonding apparatus for cutting label continuum having labels formed thereon and bonding label to object | |
AU1278300A (en) | Contactless electronic module, chip card comprising same, and methods for makingsame | |
CA2293410A1 (en) | A method and an apparatus for bringing together and joining plastic cards and card carriers | |
EP0906834A3 (de) | Nummerierte Datenträger und Verfahren zu ihrer Herstellung |