DK0760986T3 - Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden - Google Patents

Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden

Info

Publication number
DK0760986T3
DK0760986T3 DK95920907T DK95920907T DK0760986T3 DK 0760986 T3 DK0760986 T3 DK 0760986T3 DK 95920907 T DK95920907 T DK 95920907T DK 95920907 T DK95920907 T DK 95920907T DK 0760986 T3 DK0760986 T3 DK 0760986T3
Authority
DK
Denmark
Prior art keywords
pct
module
electronic circuit
electronic module
sec
Prior art date
Application number
DK95920907T
Other languages
English (en)
Inventor
Ake Gustafson
Original Assignee
Ake Gustafson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ake Gustafson filed Critical Ake Gustafson
Application granted granted Critical
Publication of DK0760986T3 publication Critical patent/DK0760986T3/da

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109Embedding of laminae within face of additional laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Textile Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Bipolar Transistors (AREA)
DK95920907T 1994-05-27 1995-05-29 Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden DK0760986T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94810312 1994-05-27
PCT/EP1995/002038 WO1995033246A1 (fr) 1994-05-27 1995-05-29 Procede de realisation d'un module electronique et module electronique obtenu selon ce procede

Publications (1)

Publication Number Publication Date
DK0760986T3 true DK0760986T3 (da) 1999-05-25

Family

ID=8218261

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95920907T DK0760986T3 (da) 1994-05-27 1995-05-29 Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden

Country Status (11)

Country Link
US (1) US5879502A (da)
EP (1) EP0760986B1 (da)
JP (1) JP3866282B2 (da)
AT (1) ATE170307T1 (da)
AU (1) AU684174B2 (da)
BR (1) BR9507775A (da)
CA (1) CA2190294C (da)
DE (1) DE69504336T2 (da)
DK (1) DK0760986T3 (da)
ES (1) ES2122620T3 (da)
WO (1) WO1995033246A1 (da)

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ATE464620T1 (de) * 1999-01-04 2010-04-15 Ident Technology Gmbh X Verbundmaterialeinheiten mit transponder
EP1035503B2 (de) * 1999-01-23 2010-03-03 X-ident technology GmbH RFID-Transponder mit bedruckbarer Oberfläche
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
DE19931189A1 (de) * 1999-07-07 2001-01-25 Meritor Automotive Gmbh Verfahren zur Herstellung von Bauteilen mit darin angeordneten elektrischen Leiterbahnen sowie danach hergestellte Bauteile, insbesondere als Türmodule für Kraftfahrzeuge
US6304232B1 (en) 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
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US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
ATE509326T1 (de) 2001-12-18 2011-05-15 L 1 Secure Credentialing Inc Mehrfachbildsicherheitsmerkmale zur identifikation von dokumenten und verfahren zu ihrer herstellung
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US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
CA2471457C (en) 2001-12-24 2011-08-02 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
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US7207494B2 (en) 2001-12-24 2007-04-24 Digimarc Corporation Laser etched security features for identification documents and methods of making same
AU2003221894A1 (en) 2002-04-09 2003-10-27 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
US6702185B1 (en) 2002-11-13 2004-03-09 Identicard Systems, Incorporated Identification device having an integrated circuit
US7135979B2 (en) * 2002-11-14 2006-11-14 Brady Worldwide, Inc. In-mold radio frequency identification device label
US7804982B2 (en) 2002-11-26 2010-09-28 L-1 Secure Credentialing, Inc. Systems and methods for managing and detecting fraud in image databases used with identification documents
US7712673B2 (en) 2002-12-18 2010-05-11 L-L Secure Credentialing, Inc. Identification document with three dimensional image of bearer
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JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
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JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
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Also Published As

Publication number Publication date
ATE170307T1 (de) 1998-09-15
ES2122620T3 (es) 1998-12-16
JPH10501475A (ja) 1998-02-10
JP3866282B2 (ja) 2007-01-10
DE69504336D1 (de) 1998-10-01
EP0760986A1 (fr) 1997-03-12
US5879502A (en) 1999-03-09
DE69504336T2 (de) 1999-01-21
AU2617095A (en) 1995-12-21
EP0760986B1 (fr) 1998-08-26
AU684174B2 (en) 1997-12-04
CA2190294C (fr) 2005-07-12
WO1995033246A1 (fr) 1995-12-07
BR9507775A (pt) 1997-08-19
CA2190294A1 (fr) 1995-12-07

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