JP2008258411A - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP2008258411A
JP2008258411A JP2007099221A JP2007099221A JP2008258411A JP 2008258411 A JP2008258411 A JP 2008258411A JP 2007099221 A JP2007099221 A JP 2007099221A JP 2007099221 A JP2007099221 A JP 2007099221A JP 2008258411 A JP2008258411 A JP 2008258411A
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JP
Japan
Prior art keywords
lead
semiconductor device
sealing resin
semiconductor chip
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007099221A
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English (en)
Japanese (ja)
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JP2008258411A5 (https=
Inventor
Yasumasa Kasuya
泰正 糟谷
基治 ▲芳▼我
Motoharu Haga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007099221A priority Critical patent/JP2008258411A/ja
Priority to US12/078,772 priority patent/US7608930B2/en
Publication of JP2008258411A publication Critical patent/JP2008258411A/ja
Publication of JP2008258411A5 publication Critical patent/JP2008258411A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2007099221A 2007-04-05 2007-04-05 半導体装置および半導体装置の製造方法 Pending JP2008258411A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007099221A JP2008258411A (ja) 2007-04-05 2007-04-05 半導体装置および半導体装置の製造方法
US12/078,772 US7608930B2 (en) 2007-04-05 2008-04-04 Semiconductor device and method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007099221A JP2008258411A (ja) 2007-04-05 2007-04-05 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008258411A true JP2008258411A (ja) 2008-10-23
JP2008258411A5 JP2008258411A5 (https=) 2010-05-06

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Country Status (2)

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US (1) US7608930B2 (https=)
JP (1) JP2008258411A (https=)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151069A (ja) * 2010-01-19 2011-08-04 Dainippon Printing Co Ltd 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法
JP2012109459A (ja) * 2010-11-18 2012-06-07 Dainippon Printing Co Ltd リードフレームおよびリードフレームの製造方法
JP2012114354A (ja) * 2010-11-26 2012-06-14 Dainippon Printing Co Ltd リードフレームおよびリードフレームの製造方法
JP2013236113A (ja) * 2013-08-27 2013-11-21 Dainippon Printing Co Ltd 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法
JP2013243409A (ja) * 2013-08-27 2013-12-05 Dainippon Printing Co Ltd 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法
JP2014207481A (ja) * 2014-07-18 2014-10-30 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP2015195389A (ja) * 2015-06-17 2015-11-05 大日本印刷株式会社 半導体装置およびその製造方法
US9362473B2 (en) 2010-11-02 2016-06-07 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
JP2017123479A (ja) * 2017-03-07 2017-07-13 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール
JP2017175131A (ja) * 2016-03-17 2017-09-28 ローム株式会社 半導体装置およびその製造方法
US9887331B2 (en) 2010-03-30 2018-02-06 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
JP2019176034A (ja) * 2018-03-29 2019-10-10 ローム株式会社 半導体装置および半導体装置の製造方法
JP2019220607A (ja) * 2018-06-21 2019-12-26 株式会社加藤電器製作所 半導体装置の製造方法
JP2021015860A (ja) * 2019-07-10 2021-02-12 新光電気工業株式会社 電子装置及び電子装置の製造方法
CN113614893A (zh) * 2019-03-08 2021-11-05 硅尼克斯公司 具有侧壁镀层的半导体封装
WO2022113661A1 (ja) * 2020-11-30 2022-06-02 ローム株式会社 半導体装置
KR102958018B1 (ko) * 2019-03-08 2026-04-27 실리코닉스 인코포레이티드 측벽 도금을 갖는 반도체 패키지

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JP5358089B2 (ja) * 2007-12-21 2013-12-04 スパンション エルエルシー 半導体装置
US8106502B2 (en) * 2008-11-17 2012-01-31 Stats Chippac Ltd. Integrated circuit packaging system with plated pad and method of manufacture thereof
US8569877B2 (en) * 2009-03-12 2013-10-29 Utac Thai Limited Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
TWI392065B (zh) * 2009-06-08 2013-04-01 乾坤科技股份有限公司 電子元件封裝模組
EP2361000A1 (en) * 2010-02-11 2011-08-24 Nxp B.V. Leadless chip package mounting method and carrier
US8329509B2 (en) * 2010-04-01 2012-12-11 Freescale Semiconductor, Inc. Packaging process to create wettable lead flank during board assembly
TWI419290B (zh) 2010-10-29 2013-12-11 日月光半導體製造股份有限公司 四方扁平無引腳封裝及其製作方法
US8502363B2 (en) * 2011-07-06 2013-08-06 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with solder joint enhancement element and related methods
US8674487B2 (en) 2012-03-15 2014-03-18 Advanced Semiconductor Engineering, Inc. Semiconductor packages with lead extensions and related methods
US9653656B2 (en) 2012-03-16 2017-05-16 Advanced Semiconductor Engineering, Inc. LED packages and related methods
US8716066B2 (en) * 2012-07-31 2014-05-06 Freescale Semiconductor, Inc. Method for plating a semiconductor package lead
US9059379B2 (en) 2012-10-29 2015-06-16 Advanced Semiconductor Engineering, Inc. Light-emitting semiconductor packages and related methods
JP6244147B2 (ja) * 2013-09-18 2017-12-06 エスアイアイ・セミコンダクタ株式会社 半導体装置の製造方法
US9773722B1 (en) 2014-05-07 2017-09-26 UTAC Headquarters Pte. Ltd. Semiconductor package with partial plating on contact side surfaces
US9741642B1 (en) 2014-05-07 2017-08-22 UTAC Headquarters Pte. Ltd. Semiconductor package with partial plating on contact side surfaces
US10242934B1 (en) 2014-05-07 2019-03-26 Utac Headquarters Pte Ltd. Semiconductor package with full plating on contact side surfaces and methods thereof
CN105895611B (zh) * 2014-12-17 2019-07-12 恩智浦美国有限公司 具有可湿性侧面的无引线方形扁平半导体封装
US10269686B1 (en) 2015-05-27 2019-04-23 UTAC Headquarters PTE, LTD. Method of improving adhesion between molding compounds and an apparatus thereof
US9806043B2 (en) 2016-03-03 2017-10-31 Infineon Technologies Ag Method of manufacturing molded semiconductor packages having an optical inspection feature
DE102017212457A1 (de) * 2017-07-20 2019-01-24 Infineon Technologies Ag Halbleitergehäuse mit Nickelplattierung und Verfahren zum Herstellen desselben
US20200227343A1 (en) * 2019-01-11 2020-07-16 Chang Wah Technology Co., Ltd. Semiconductor device package
WO2020185192A1 (en) 2019-03-08 2020-09-17 Siliconix Incorporated Semiconductor package having side wall plating
JP7368055B2 (ja) 2019-06-21 2023-10-24 ローム株式会社 半導体装置、および、半導体装置の実装構造
KR102564558B1 (ko) * 2021-11-30 2023-08-08 해성디에스 주식회사 프리 몰드 기판 및 프리 몰드 기판의 제조 방법
EP4340020A1 (en) * 2022-09-16 2024-03-20 Nexperia B.V. A method for manufacturing a semiconductor package assembly as well as a semiconductor package assembly obtained with this method

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JP2005033043A (ja) * 2003-07-08 2005-02-03 New Japan Radio Co Ltd リードフレームおよび半導体装置並びにそれらの製造方法
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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151069A (ja) * 2010-01-19 2011-08-04 Dainippon Printing Co Ltd 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法
US9887331B2 (en) 2010-03-30 2018-02-06 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9362473B2 (en) 2010-11-02 2016-06-07 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US9773960B2 (en) 2010-11-02 2017-09-26 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US9899583B2 (en) 2010-11-02 2018-02-20 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US9553247B2 (en) 2010-11-02 2017-01-24 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US9412923B2 (en) 2010-11-02 2016-08-09 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
JP2012109459A (ja) * 2010-11-18 2012-06-07 Dainippon Printing Co Ltd リードフレームおよびリードフレームの製造方法
JP2012114354A (ja) * 2010-11-26 2012-06-14 Dainippon Printing Co Ltd リードフレームおよびリードフレームの製造方法
JP2013243409A (ja) * 2013-08-27 2013-12-05 Dainippon Printing Co Ltd 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法
JP2013236113A (ja) * 2013-08-27 2013-11-21 Dainippon Printing Co Ltd 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法
JP2014207481A (ja) * 2014-07-18 2014-10-30 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP2015195389A (ja) * 2015-06-17 2015-11-05 大日本印刷株式会社 半導体装置およびその製造方法
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JP7228063B2 (ja) 2016-03-17 2023-02-22 ローム株式会社 半導体装置
JP2017175131A (ja) * 2016-03-17 2017-09-28 ローム株式会社 半導体装置およびその製造方法
JP2022087155A (ja) * 2016-03-17 2022-06-09 ローム株式会社 半導体装置
JP2017123479A (ja) * 2017-03-07 2017-07-13 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
JP2019176034A (ja) * 2018-03-29 2019-10-10 ローム株式会社 半導体装置および半導体装置の製造方法
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JP2019220607A (ja) * 2018-06-21 2019-12-26 株式会社加藤電器製作所 半導体装置の製造方法
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KR102958018B1 (ko) * 2019-03-08 2026-04-27 실리코닉스 인코포레이티드 측벽 도금을 갖는 반도체 패키지
JP2022531059A (ja) * 2019-03-08 2022-07-06 シリコニックス インコーポレイテッド 側壁メッキ層を有する半導体パッケージ
JP7286450B2 (ja) 2019-07-10 2023-06-05 新光電気工業株式会社 電子装置及び電子装置の製造方法
JP2021015860A (ja) * 2019-07-10 2021-02-12 新光電気工業株式会社 電子装置及び電子装置の製造方法
JPWO2022113661A1 (https=) * 2020-11-30 2022-06-02
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