JP2008147516A - 薄膜トランジスタ及びその製造方法 - Google Patents
薄膜トランジスタ及びその製造方法 Download PDFInfo
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- JP2008147516A JP2008147516A JP2006334703A JP2006334703A JP2008147516A JP 2008147516 A JP2008147516 A JP 2008147516A JP 2006334703 A JP2006334703 A JP 2006334703A JP 2006334703 A JP2006334703 A JP 2006334703A JP 2008147516 A JP2008147516 A JP 2008147516A
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- 239000010409 thin film Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000010410 layer Substances 0.000 claims abstract description 202
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 96
- 229920005591 polysilicon Polymers 0.000 claims abstract description 96
- 239000010408 film Substances 0.000 claims abstract description 85
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000011229 interlayer Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229920002120 photoresistant polymer Polymers 0.000 claims description 39
- 229910021332 silicide Inorganic materials 0.000 claims description 10
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 18
- 238000000206 photolithography Methods 0.000 description 12
- 239000012535 impurity Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 238000000137 annealing Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 229910016006 MoSi Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000004380 ashing Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000007687 exposure technique Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
【解決手段】本発明の一態様にかかる薄膜トランジスタは、基板1上に形成され、チャネル領域、ソース領域、ドレイン領域を有するポリシリコン層3と、ポリシリコン層3の上層に形成され、ソース領域及びドレイン領域の少なくとも一部を覆う導電層4と、少なくともポリシリコン層3を含む領域を覆う領域に形成される層間絶縁膜7と、層間絶縁膜7を貫通し、導電層4が露出する深さで形成されるコンタクトホール8と、コンタクトホール8の壁面に沿って形成される配線層9とを備えるものである。
【選択図】図1
Description
以下では、図面を参照して本発明の実施の態様について説明する。図1に本実施の形態にかかる薄膜トランジスタ(以下、TFT素子と称す)の平面模式図を示す。図1に示すように、本実施の形態にかかるTFT素子は、ソース領域、ドレイン領域、チャネル領域を有している。ソース領域とドレイン領域はポリシリコン層3に形成される領域である。また、チャネル領域は、ゲート電極6の下層に位置するポリシリコン層3に形成される。
Claims (9)
- 基板上に形成され、チャネル領域、ソース領域、ドレイン領域を有するポリシリコン層と、
前記ポリシリコン層の上層に形成され、前記ソース領域及び前記ドレイン領域の少なくとも一部を覆う導電層と、
少なくとも前記ポリシリコン層を含む領域を覆う領域に形成される層間絶縁膜と、
前記層間絶縁膜を貫通し、前記導電層が露出する深さで形成されるコンタクトホールと、
前記コンタクトホールの壁面に沿って形成される配線層と、
を備える薄膜トランジスタ。 - 前記ポリシリコン層と前記導電層との界面にはシリサイド層が形成される請求項1に記載の薄膜トランジスタ。
- 前記導電層は、前記ポリシリコン層の上層に分離して形成される複数の島状領域を有し、前記複数の島状領域の面積の合計は、前記ポリシリコン層が形成される領域の面積よりも小さい請求項1又は2に記載の薄膜トランジスタ。
- 前記導電層の端部は、前記ポリシリコン層の端部よりも内側に形成される請求項1乃至3のいずれか1項に記載の薄膜トランジスタ。
- 前記導電層は、前記コンタクトホールの底面の面積よりも大きな面積を有し、前記配線層は、前記コンタクトホールを介して前記導電層と電気的に接続されている請求項1乃至5のいずれか1項に記載の薄膜トランジスタ。
- 前記ポリシリコン層は、底面と側壁とから成るテーパー角度が30°乃至40°であって、前記導電層は、底面と側壁とから成るテーパー角度が前記ポリシリコン層のテーパー角度以下である請求項1乃至4のいずれか1項に記載の薄膜トランジスタ。
- 前記導電層はモリブデン又はモリブデンを主成分とする合金膜である請求項1乃至6のいずれか1項に記載の薄膜トランジスタ。
- 請求項1乃至6に記載の薄膜トランジスタを有する表示装置。
- チャネル領域、ソース領域、ドレイン領域を有するポリシリコン層が基板上に形成される薄膜トランジスタの製造方法であって、
前記ポリシリコン層の上層に導電層を成長させる工程と、
前記導電層の上層に、前記ポリシリコン層の外周形状に応じてパターニングされ、前記ソース領域及び前記ドレイン領域が位置する領域の膜厚がその他の領域よりも厚いフォトレジスト膜を形成する工程と、
前記フォトレジスト膜を用いて前記ポリシリコン層を形成する工程と、
前記フォトレジスト膜のうち膜厚が薄い部分がなくなる程度に前記フォトレジスト膜を除去する工程と、
膜厚が薄い部分が除去された前記ポリシリコン層を用いて前記導電層を形成する工程と、
を備える薄膜トランジスタの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006334703A JP2008147516A (ja) | 2006-12-12 | 2006-12-12 | 薄膜トランジスタ及びその製造方法 |
TW096141812A TW200834931A (en) | 2006-12-12 | 2007-11-06 | Thin film transistor and method of manufacturing the same |
US11/946,309 US7906779B2 (en) | 2006-12-12 | 2007-11-28 | Thin film transistor and method of manufacturing the same |
KR1020070127302A KR100973736B1 (ko) | 2006-12-12 | 2007-12-10 | 박막트랜지스터 및 그 제조 방법 |
CNB2007103062796A CN100570895C (zh) | 2006-12-12 | 2007-12-12 | 薄膜晶体管及其制造方法 |
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JP2006334703A JP2008147516A (ja) | 2006-12-12 | 2006-12-12 | 薄膜トランジスタ及びその製造方法 |
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JP2008147516A true JP2008147516A (ja) | 2008-06-26 |
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JP2006334703A Pending JP2008147516A (ja) | 2006-12-12 | 2006-12-12 | 薄膜トランジスタ及びその製造方法 |
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Country | Link |
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US (1) | US7906779B2 (ja) |
JP (1) | JP2008147516A (ja) |
KR (1) | KR100973736B1 (ja) |
CN (1) | CN100570895C (ja) |
TW (1) | TW200834931A (ja) |
Cited By (3)
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JP2010283326A (ja) * | 2009-06-03 | 2010-12-16 | Lg Display Co Ltd | アレイ基板及びこれの製造方法 |
JP2015146460A (ja) * | 2010-02-19 | 2015-08-13 | 株式会社半導体エネルギー研究所 | トランジスタ |
US10128128B2 (en) | 2016-03-30 | 2018-11-13 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device having air gap between wirings for low dielectric constant |
Families Citing this family (6)
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KR101892264B1 (ko) * | 2011-09-19 | 2018-08-28 | 삼성디스플레이 주식회사 | 복수의 박막 트랜지스터를 갖는 표시 장치의 제조 방법 및 이 제조 방법에 의해 제조된 표시 장치 |
KR20140108026A (ko) | 2013-02-28 | 2014-09-05 | 삼성디스플레이 주식회사 | 박막 반도체 장치, 유기 발광 표시 장치, 및 이의 제조 방법 |
KR20150055919A (ko) | 2013-11-14 | 2015-05-22 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 그 제조 방법 및 이를 포함하는 유기 발광 표시 장치 |
CN105390443B (zh) * | 2015-12-03 | 2018-11-23 | 深圳市华星光电技术有限公司 | Tft基板的制作方法 |
CN109449210B (zh) * | 2018-09-19 | 2022-06-10 | 云谷(固安)科技有限公司 | 阵列基板及显示器件 |
KR20220022519A (ko) * | 2020-08-18 | 2022-02-28 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
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- 2007-11-28 US US11/946,309 patent/US7906779B2/en active Active
- 2007-12-10 KR KR1020070127302A patent/KR100973736B1/ko not_active IP Right Cessation
- 2007-12-12 CN CNB2007103062796A patent/CN100570895C/zh not_active Expired - Fee Related
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JP2010283326A (ja) * | 2009-06-03 | 2010-12-16 | Lg Display Co Ltd | アレイ基板及びこれの製造方法 |
JP2015146460A (ja) * | 2010-02-19 | 2015-08-13 | 株式会社半導体エネルギー研究所 | トランジスタ |
US10128128B2 (en) | 2016-03-30 | 2018-11-13 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device having air gap between wirings for low dielectric constant |
Also Published As
Publication number | Publication date |
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CN101236992A (zh) | 2008-08-06 |
TW200834931A (en) | 2008-08-16 |
US20080135849A1 (en) | 2008-06-12 |
CN100570895C (zh) | 2009-12-16 |
KR100973736B1 (ko) | 2010-08-04 |
KR20080054349A (ko) | 2008-06-17 |
US7906779B2 (en) | 2011-03-15 |
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