JP2008084959A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2008084959A
JP2008084959A JP2006260949A JP2006260949A JP2008084959A JP 2008084959 A JP2008084959 A JP 2008084959A JP 2006260949 A JP2006260949 A JP 2006260949A JP 2006260949 A JP2006260949 A JP 2006260949A JP 2008084959 A JP2008084959 A JP 2008084959A
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Japan
Prior art keywords
semiconductor chip
semiconductor device
connection terminal
metal layer
wiring pattern
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JP2006260949A
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English (en)
Japanese (ja)
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JP2008084959A5 (enExample
Inventor
Koji Yamano
孝治 山野
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006260949A priority Critical patent/JP2008084959A/ja
Priority to KR1020070089769A priority patent/KR20080028279A/ko
Priority to US11/856,354 priority patent/US7884453B2/en
Priority to TW096135326A priority patent/TW200816414A/zh
Priority to CNA2007101541917A priority patent/CN101154641A/zh
Priority to EP07018974A priority patent/EP1906446A2/en
Publication of JP2008084959A publication Critical patent/JP2008084959A/ja
Publication of JP2008084959A5 publication Critical patent/JP2008084959A5/ja
Priority to US12/581,486 priority patent/US8211754B2/en
Pending legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2006260949A 2006-09-26 2006-09-26 半導体装置及びその製造方法 Pending JP2008084959A (ja)

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JP2006260949A JP2008084959A (ja) 2006-09-26 2006-09-26 半導体装置及びその製造方法
KR1020070089769A KR20080028279A (ko) 2006-09-26 2007-09-05 반도체 장치 및 그 제조 방법
US11/856,354 US7884453B2 (en) 2006-09-26 2007-09-17 Semiconductor device and manufacturing method thereof
TW096135326A TW200816414A (en) 2006-09-26 2007-09-21 Semiconductor device and manufacturing method thereof
CNA2007101541917A CN101154641A (zh) 2006-09-26 2007-09-24 半导体器件及其制造方法
EP07018974A EP1906446A2 (en) 2006-09-26 2007-09-26 Semiconductor device and manufacturing method thereof
US12/581,486 US8211754B2 (en) 2006-09-26 2009-10-19 Semiconductor device and manufacturing method thereof

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CN104576405B (zh) * 2014-12-16 2017-11-07 通富微电子股份有限公司 单层基板封装工艺
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JP6851239B2 (ja) * 2017-03-29 2021-03-31 エイブリック株式会社 樹脂封止型半導体装置およびその製造方法
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CN101154641A (zh) 2008-04-02
US20080073798A1 (en) 2008-03-27
EP1906446A2 (en) 2008-04-02
US8211754B2 (en) 2012-07-03
TW200816414A (en) 2008-04-01
US7884453B2 (en) 2011-02-08
KR20080028279A (ko) 2008-03-31

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