CN101154641A - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

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Publication number
CN101154641A
CN101154641A CNA2007101541917A CN200710154191A CN101154641A CN 101154641 A CN101154641 A CN 101154641A CN A2007101541917 A CNA2007101541917 A CN A2007101541917A CN 200710154191 A CN200710154191 A CN 200710154191A CN 101154641 A CN101154641 A CN 101154641A
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China
Prior art keywords
semiconductor chip
metal layer
semiconductor device
wiring pattern
connection terminal
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CNA2007101541917A
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English (en)
Chinese (zh)
Inventor
山野孝治
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Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN101154641A publication Critical patent/CN101154641A/zh
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
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CN107408547A (zh) * 2015-03-03 2017-11-28 苹果公司 扇出型系统级封装件及其形成方法
CN111627867A (zh) * 2019-02-28 2020-09-04 富泰华工业（深圳）有限公司 芯片封装结构及其制作方法

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CN107408547A (zh) * 2015-03-03 2017-11-28 苹果公司 扇出型系统级封装件及其形成方法
CN107408547B (zh) * 2015-03-03 2019-12-24 苹果公司 扇出型系统级封装件及其形成方法
CN107408552A (zh) * 2015-04-07 2017-11-28 苹果公司 薄型低翘曲扇出封装件中的双面安装存储器集成
CN111627867A (zh) * 2019-02-28 2020-09-04 富泰华工业（深圳）有限公司 芯片封装结构及其制作方法

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TW200816414A (en) 2008-04-01
US7884453B2 (en) 2011-02-08
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