JP2007523568A - デジタルカメラ用集積レンズ及びチップ・アセンブリ - Google Patents

デジタルカメラ用集積レンズ及びチップ・アセンブリ Download PDF

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Publication number
JP2007523568A
JP2007523568A JP2006554218A JP2006554218A JP2007523568A JP 2007523568 A JP2007523568 A JP 2007523568A JP 2006554218 A JP2006554218 A JP 2006554218A JP 2006554218 A JP2006554218 A JP 2006554218A JP 2007523568 A JP2007523568 A JP 2007523568A
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Japan
Prior art keywords
camera
lens
integrated circuit
lens assembly
integrated
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Pending
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JP2006554218A
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English (en)
Japanese (ja)
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JP2007523568A5 (enExample
Inventor
シッタラム ケイル ヴィドヤドハー
ワイジング タム サミュエル
シャングアン ドンカイ
Original Assignee
フレックストロニクス インターナショナル ユーエスエー，インコーポレーテッド
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Publication of JP2007523568A publication Critical patent/JP2007523568A/ja
Publication of JP2007523568A5 publication Critical patent/JP2007523568A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
    • H10F39/1515—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
JP2006554218A 2004-02-20 2005-02-18 デジタルカメラ用集積レンズ及びチップ・アセンブリ Pending JP2007523568A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/784,102 US7872686B2 (en) 2004-02-20 2004-02-20 Integrated lens and chip assembly for a digital camera
PCT/US2005/005139 WO2005081853A2 (en) 2004-02-20 2005-02-18 Integrated lens and chip assembly for a digital camera

Publications (2)

Publication Number Publication Date
JP2007523568A true JP2007523568A (ja) 2007-08-16
JP2007523568A5 JP2007523568A5 (enExample) 2008-04-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006554218A Pending JP2007523568A (ja) 2004-02-20 2005-02-18 デジタルカメラ用集積レンズ及びチップ・アセンブリ

Country Status (7)

Country Link
US (2) US7872686B2 (enExample)
EP (2) EP1726157A4 (enExample)
JP (1) JP2007523568A (enExample)
CN (2) CN101656218B (enExample)
CA (1) CA2556477A1 (enExample)
TW (1) TWI258052B (enExample)
WO (1) WO2005081853A2 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160046785A (ko) 2013-08-22 2016-04-29 소니 주식회사 촬상 장치, 제조 장치, 제조 방법, 전자 기기
KR20180122360A (ko) * 2016-02-18 2018-11-12 닝보 써니 오포테크 코., 엘티디. 일체형 패키징 공정 기반 카메라 모듈, 그 일체형 기저 부품 및 그 제조 방법
KR20190015388A (ko) * 2016-06-06 2019-02-13 닝보 써니 오포테크 코., 엘티디. 촬영 모듈의 몰딩회로기판과 그 제조설비 및 제조방법
KR20190015389A (ko) * 2016-06-06 2019-02-13 닝보 써니 오포테크 코., 엘티디. 촬영 모듈의 몰딩 회로기판의 제조설비 및 제조방법
JP2019519087A (ja) * 2016-03-12 2019-07-04 ニンボー サニー オプテック カンパニー，リミテッド アレイ撮像モジュール及び成形感光性アセンブリ、並びに電子機器向けのその製造方法

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
US7796187B2 (en) * 2004-02-20 2010-09-14 Flextronics Ap Llc Wafer based camera module and method of manufacture
JP2005284147A (ja) * 2004-03-30 2005-10-13 Fuji Photo Film Co Ltd 撮像装置
US20050264690A1 (en) * 2004-05-28 2005-12-01 Tekom Technologies, Inc. Image sensor
EP2218391A1 (en) * 2004-07-05 2010-08-18 Olympus Medical Systems Corp. Electronic endoscope
KR100677380B1 (ko) * 2004-11-05 2007-02-02 엘지전자 주식회사 슬라이드형 휴대 단말기의 카메라 렌즈 보호 장치
US20090213232A1 (en) * 2005-04-01 2009-08-27 Matsushita Electric Industrial Co., Ltd. Image pickup device
US7288757B2 (en) * 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
US7531773B2 (en) 2005-09-08 2009-05-12 Flextronics Ap, Llc Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group
US7469100B2 (en) 2005-10-03 2008-12-23 Flextronics Ap Llc Micro camera module with discrete manual focal positions
DE102006013164A1 (de) * 2006-03-22 2007-09-27 Robert Bosch Gmbh Verfahren zur Montage eines Kameramoduls und Kameramodul
US20070236591A1 (en) * 2006-04-11 2007-10-11 Tam Samuel W Method for mounting protective covers over image capture devices and devices manufactured thereby
US8092102B2 (en) * 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture
DE102006043323B4 (de) * 2006-09-15 2025-11-20 Robert Bosch Gmbh Drucksensor für eine Seitenaufprallsensierung und Verfahren zur Ausbildung einer Oberfläche eines Schutzmaterials für einen Drucksensor
US7983556B2 (en) * 2006-11-03 2011-07-19 Flextronics Ap Llc Camera module with contamination reduction feature
US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
CA2685080A1 (en) 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
US8488046B2 (en) * 2007-12-27 2013-07-16 Digitaloptics Corporation Configurable tele wide module
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
EP2394426A4 (en) 2009-02-06 2013-02-20 Magna Electronics Inc IMPROVED CAMERA FOR A VEHICLE
JP5487842B2 (ja) * 2009-06-23 2014-05-14 ソニー株式会社 固体撮像装置
US8265487B2 (en) * 2009-07-29 2012-09-11 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Half-duplex, single-fiber (S-F) optical transceiver module and method
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
US8760571B2 (en) 2009-09-21 2014-06-24 Microsoft Corporation Alignment of lens and image sensor
US10782187B2 (en) * 2010-07-08 2020-09-22 Cvg Management Corporation Infrared temperature measurement and stabilization thereof
KR20120079551A (ko) * 2011-01-05 2012-07-13 엘지이노텍 주식회사 초점 무조정 카메라 모듈
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
US9178093B2 (en) 2011-07-06 2015-11-03 Flextronics Ap, Llc Solar cell module on molded lead-frame and method of manufacture
TW201339630A (zh) * 2011-11-30 2013-10-01 安特永國際公司 設備與方法
JP2014138119A (ja) * 2013-01-17 2014-07-28 Sony Corp 半導体装置および半導体装置の製造方法
JP5958364B2 (ja) * 2013-01-28 2016-07-27 日立金属株式会社 光モジュール
CN104376616A (zh) * 2013-08-16 2015-02-25 深圳富泰宏精密工业有限公司 行车记录仪
US9258467B2 (en) * 2013-11-19 2016-02-09 Stmicroelectronics Pte Ltd. Camera module
US9467606B2 (en) * 2014-06-10 2016-10-11 Omnivision Technologies, Inc. Wafer level stepped sensor holder
CN104916008A (zh) * 2015-06-26 2015-09-16 深圳市安视达电子科技有限公司 行车记录仪
US10447900B2 (en) * 2015-08-06 2019-10-15 Apple Inc. Camera module design with lead frame and plastic moulding
US10750071B2 (en) * 2016-03-12 2020-08-18 Ningbo Sunny Opotech Co., Ltd. Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
CN109287131B (zh) * 2016-03-23 2022-07-19 赫普塔冈微光有限公司 光电模块组件和制造方法
KR101785458B1 (ko) * 2016-06-07 2017-10-16 엘지전자 주식회사 카메라 모듈 및 이를 구비하는 이동 단말기
CN108401093B (zh) * 2017-02-08 2024-03-08 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和制造方法以及电子设备
CN108461510A (zh) * 2017-02-22 2018-08-28 深圳市中兴微电子技术有限公司 一种摄像头模组及其制作方法
CN106998417A (zh) * 2017-03-24 2017-08-01 谢超 微型摄像模组制作工艺
JPWO2019026448A1 (ja) * 2017-07-31 2020-08-27 日本電産株式会社 遮光羽根、羽根駆動装置、および撮像装置
CN110914752A (zh) * 2017-07-31 2020-03-24 日本电产株式会社 遮光叶片、叶片驱动装置以及摄像装置
CN110945424A (zh) * 2017-07-31 2020-03-31 日本电产株式会社 遮光叶片、叶片驱动装置以及摄像装置
CN110475049B (zh) * 2018-05-11 2022-03-15 三星电机株式会社 相机模块及其制造方法
CN110611754A (zh) * 2018-06-15 2019-12-24 三赢科技（深圳）有限公司 摄像头模组
CN112384771B (zh) 2018-07-06 2024-07-09 浜松光子学株式会社 分光模块和分光模块的制造方法
EP3840353A4 (en) * 2018-08-21 2021-09-15 Ningbo Sunny Opotech Co., Ltd. CAMERA MODULE, SHAPED LIGHT SENSITIVE ARRANGEMENT AND MANUFACTURING METHOD FOR IT, AND ELECTRONIC DEVICE
US11094858B2 (en) * 2019-08-01 2021-08-17 Advanced Semiconductor Engineering, Inc. Tape, encapsulating process and optical device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001292365A (ja) * 2000-04-07 2001-10-19 Mitsubishi Electric Corp 撮像装置及びその製造方法
JP2002252796A (ja) * 2001-02-26 2002-09-06 Mitsubishi Electric Corp 撮像装置
JP2003078077A (ja) * 2001-09-05 2003-03-14 Sanyo Electric Co Ltd カメラモジュール
JP2003131112A (ja) * 2001-10-29 2003-05-08 Fujitsu Ltd カメラモジュール及びその製造方法

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
US5617131A (en) * 1993-10-28 1997-04-01 Kyocera Corporation Image device having a spacer with image arrays disposed in holes thereof
KR100437437B1 (ko) * 1994-03-18 2004-06-25 히다치 가세고교 가부시끼가이샤 반도체 패키지의 제조법 및 반도체 패키지
EP0773673A4 (en) * 1995-05-31 2001-05-23 Sony Corp IMAGE RECORDING DEVICE, METHOD FOR THE PRODUCTION THEREOF, IMAGE RECORDING ADAPTER, DEVICE AND METHOD FOR THE SIGNAL AND INFORMATION PROCESSING
NL1003315C2 (nl) 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
JP2000241696A (ja) * 1999-02-17 2000-09-08 Canon Inc 光学センサーパッケージの保持・取付け方法
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
JP2001188155A (ja) 1999-12-28 2001-07-10 Kuurii Components Kk 撮像素子の固定手段
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
EP1180718A1 (fr) * 2000-08-11 2002-02-20 EM Microelectronic-Marin SA Appareil de prise d'images de petites dimensions, notamment appareil photographique ou caméra
JP3725012B2 (ja) * 2000-08-17 2005-12-07 シャープ株式会社 レンズ一体型固体撮像装置の製造方法
JP3887162B2 (ja) * 2000-10-19 2007-02-28 富士通株式会社 撮像用半導体装置
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
US6798031B2 (en) * 2001-02-28 2004-09-28 Fujitsu Limited Semiconductor device and method for making the same
DE10109787A1 (de) * 2001-02-28 2002-10-02 Infineon Technologies Ag Digitale Kamera mit einem lichtempfindlichen Sensor
US20040012698A1 (en) * 2001-03-05 2004-01-22 Yasuo Suda Image pickup model and image pickup device
JP2003032525A (ja) * 2001-05-09 2003-01-31 Seiko Precision Inc 固体撮像装置
JP2003060948A (ja) * 2001-06-05 2003-02-28 Seiko Precision Inc 固体撮像装置
US6734419B1 (en) * 2001-06-28 2004-05-11 Amkor Technology, Inc. Method for forming an image sensor package with vision die in lens housing
JP4647851B2 (ja) 2001-08-07 2011-03-09 日立マクセル株式会社 カメラモジュール
JPWO2003015400A1 (ja) * 2001-08-07 2004-12-02 日立マクセル株式会社 カメラモジュール
JP4143304B2 (ja) 2002-01-24 2008-09-03 富士通株式会社 カメラモジュールの製造方法
JP2003333437A (ja) * 2002-05-13 2003-11-21 Rohm Co Ltd イメージセンサモジュールおよびその製造方法
US7304362B2 (en) * 2002-05-20 2007-12-04 Stmicroelectronics, Inc. Molded integrated circuit package with exposed active area
KR100718421B1 (ko) * 2002-06-28 2007-05-14 교세라 가부시키가이샤 소형 모듈 카메라, 카메라 모듈, 카메라 모듈 제조 방법 및 촬상 소자의 패키징 방법
AU2003256383A1 (en) * 2002-07-03 2004-01-23 Concord Camera Corp. Compact zoom lens barrel and system
US7564496B2 (en) * 2002-09-17 2009-07-21 Anteryon B.V. Camera device, method of manufacturing a camera device, wafer scale package
JP2004194223A (ja) 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
JP2004200965A (ja) 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
JP2004296453A (ja) * 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
US6741405B1 (en) * 2003-03-27 2004-05-25 Exquisite Optical Technology Co., Ltd Hood for a digital image collecting lens
US7122787B2 (en) * 2003-05-09 2006-10-17 Matsushita Electric Industrial Co., Ltd. Imaging apparatus with three dimensional circuit board
US7619683B2 (en) * 2003-08-29 2009-11-17 Aptina Imaging Corporation Apparatus including a dual camera module and method of using the same
US7199438B2 (en) * 2003-09-23 2007-04-03 Advanced Semiconductor Engineering, Inc. Overmolded optical package
KR100541654B1 (ko) * 2003-12-02 2006-01-12 삼성전자주식회사 배선기판 및 이를 이용한 고체 촬상용 반도체 장치
US7091571B1 (en) * 2003-12-11 2006-08-15 Amkor Technology, Inc. Image sensor package and method for manufacture thereof
JP2005210628A (ja) 2004-01-26 2005-08-04 Mitsui Chemicals Inc 撮像装置用半導体搭載用基板と撮像装置
US7796187B2 (en) * 2004-02-20 2010-09-14 Flextronics Ap Llc Wafer based camera module and method of manufacture
US7872686B2 (en) 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
JP4446773B2 (ja) * 2004-03-26 2010-04-07 富士フイルム株式会社 撮影装置
US7061106B2 (en) * 2004-04-28 2006-06-13 Advanced Chip Engineering Technology Inc. Structure of image sensor module and a method for manufacturing of wafer level package
JP5252770B2 (ja) * 2004-06-10 2013-07-31 三星電子株式会社 イメージセンサーパッケージの組立方法
JP2005352314A (ja) * 2004-06-11 2005-12-22 Canon Inc 撮像装置および電子機器
KR100652375B1 (ko) * 2004-06-29 2006-12-01 삼성전자주식회사 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법
KR100674911B1 (ko) * 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
JP2006053232A (ja) 2004-08-10 2006-02-23 Sony Corp 電子撮像装置
US20070058069A1 (en) * 2005-09-14 2007-03-15 Po-Hung Chen Packaging structure of a light sensation module
KR100770684B1 (ko) * 2006-05-18 2007-10-29 삼성전기주식회사 카메라 모듈 패키지
US8092102B2 (en) * 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001292365A (ja) * 2000-04-07 2001-10-19 Mitsubishi Electric Corp 撮像装置及びその製造方法
JP2002252796A (ja) * 2001-02-26 2002-09-06 Mitsubishi Electric Corp 撮像装置
JP2003078077A (ja) * 2001-09-05 2003-03-14 Sanyo Electric Co Ltd カメラモジュール
JP2003131112A (ja) * 2001-10-29 2003-05-08 Fujitsu Ltd カメラモジュール及びその製造方法

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KR102282687B1 (ko) * 2016-02-18 2021-07-28 닝보 써니 오포테크 코., 엘티디. 일체형 패키징 공정 기반 카메라 모듈, 그 일체형 기저 부품 및 그 제조 방법
KR20210095227A (ko) * 2016-02-18 2021-07-30 닝보 써니 오포테크 코., 엘티디. 일체형 패키징 공정 기반 카메라 모듈, 그 일체형 기저 부품 및 그 제조 방법
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KR102465474B1 (ko) * 2016-02-18 2022-11-09 닝보 써니 오포테크 코., 엘티디. 일체형 패키징 공정 기반 카메라 모듈, 그 일체형 기저 부품 및 그 제조 방법
JP2019519087A (ja) * 2016-03-12 2019-07-04 ニンボー サニー オプテック カンパニー，リミテッド アレイ撮像モジュール及び成形感光性アセンブリ、並びに電子機器向けのその製造方法
KR102262937B1 (ko) * 2016-06-06 2021-06-09 닝보 써니 오포테크 코., 엘티디. 촬영 모듈의 몰딩회로기판과 그 제조설비 및 제조방법
US11161291B2 (en) 2016-06-06 2021-11-02 Ningbo Sunny Opotech Co., Ltd. Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board
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KR20190015388A (ko) * 2016-06-06 2019-02-13 닝보 써니 오포테크 코., 엘티디. 촬영 모듈의 몰딩회로기판과 그 제조설비 및 제조방법
KR20190015389A (ko) * 2016-06-06 2019-02-13 닝보 써니 오포테크 코., 엘티디. 촬영 모듈의 몰딩 회로기판의 제조설비 및 제조방법
US11745401B2 (en) 2016-06-06 2023-09-05 Ningbo Sunny Opotech Co., Ltd. Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board
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US20110115974A1 (en) 2011-05-19
US7872686B2 (en) 2011-01-18
CA2556477A1 (en) 2005-09-09
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US8477239B2 (en) 2013-07-02
US20050185088A1 (en) 2005-08-25
TWI258052B (en) 2006-07-11
EP2265000A1 (en) 2010-12-22
EP1726157A4 (en) 2009-01-07
EP1726157A2 (en) 2006-11-29
CN101124813A (zh) 2008-02-13

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