TWI258052B - Integrated lens and chip assembly for a digital camera - Google Patents

Integrated lens and chip assembly for a digital camera Download PDF

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Publication number
TWI258052B
TWI258052B TW094104486A TW94104486A TWI258052B TW I258052 B TWI258052 B TW I258052B TW 094104486 A TW094104486 A TW 094104486A TW 94104486 A TW94104486 A TW 94104486A TW I258052 B TWI258052 B TW I258052B
Authority
TW
Taiwan
Prior art keywords
camera
lens
integrated circuit
module
protective cover
Prior art date
Application number
TW094104486A
Other languages
English (en)
Chinese (zh)
Other versions
TW200530731A (en
Inventor
Vidyadhar Sitaram Kale
Samuel Waising Tam
Dongkai Shangguan
Original Assignee
Flextronics Int Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flextronics Int Usa Inc filed Critical Flextronics Int Usa Inc
Publication of TW200530731A publication Critical patent/TW200530731A/zh
Application granted granted Critical
Publication of TWI258052B publication Critical patent/TWI258052B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
    • H10F39/1515—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
TW094104486A 2004-02-20 2005-02-16 Integrated lens and chip assembly for a digital camera TWI258052B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/784,102 US7872686B2 (en) 2004-02-20 2004-02-20 Integrated lens and chip assembly for a digital camera

Publications (2)

Publication Number Publication Date
TW200530731A TW200530731A (en) 2005-09-16
TWI258052B true TWI258052B (en) 2006-07-11

Family

ID=34861402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104486A TWI258052B (en) 2004-02-20 2005-02-16 Integrated lens and chip assembly for a digital camera

Country Status (7)

Country Link
US (2) US7872686B2 (enExample)
EP (2) EP2265000A1 (enExample)
JP (1) JP2007523568A (enExample)
CN (2) CN101656218B (enExample)
CA (1) CA2556477A1 (enExample)
TW (1) TWI258052B (enExample)
WO (1) WO2005081853A2 (enExample)

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CN110914752A (zh) * 2017-07-31 2020-03-24 日本电产株式会社 遮光叶片、叶片驱动装置以及摄像装置
JPWO2019026448A1 (ja) * 2017-07-31 2020-08-27 日本電産株式会社 遮光羽根、羽根駆動装置、および撮像装置
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Also Published As

Publication number Publication date
CN101656218B (zh) 2012-02-08
WO2005081853A3 (en) 2007-08-02
TW200530731A (en) 2005-09-16
CN101656218A (zh) 2010-02-24
US20050185088A1 (en) 2005-08-25
US20110115974A1 (en) 2011-05-19
EP1726157A2 (en) 2006-11-29
US7872686B2 (en) 2011-01-18
JP2007523568A (ja) 2007-08-16
EP2265000A1 (en) 2010-12-22
US8477239B2 (en) 2013-07-02
EP1726157A4 (en) 2009-01-07
CA2556477A1 (en) 2005-09-09
WO2005081853A2 (en) 2005-09-09
CN101124813A (zh) 2008-02-13

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