JP2007013020A - 電子デバイス用パッケージ及び電子デバイスの製造方法 - Google Patents
電子デバイス用パッケージ及び電子デバイスの製造方法 Download PDFInfo
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- JP2007013020A JP2007013020A JP2005194646A JP2005194646A JP2007013020A JP 2007013020 A JP2007013020 A JP 2007013020A JP 2005194646 A JP2005194646 A JP 2005194646A JP 2005194646 A JP2005194646 A JP 2005194646A JP 2007013020 A JP2007013020 A JP 2007013020A
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 title claims description 4
- 239000002184 metal Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H—ELECTRICITY
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- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
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- H01L2224/0554—External layer
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
実装端子以外の外部端子を備える電子デバイス用パッケージに汎用性を持たせるパッケージを提供する。
【解決手段】
上記課題を解決するためのパッケージは、実装用の外部端子26以外に外部端子を備える電子デバイス用パッケージであって、前記外部端子26以外の外部端子と電気的に接続された内部端子18eと、前記内部端子18eと選択的に接続されるグランド接続用の外部端子26dに接続された内部端子18dとをパッケージ10内に配設したことを特徴とする。また、このような構成のパッケージ10では、実装用の外部端子26以外の外部端子をリッド14に設定すると良い。
【選択図】 図1
Description
Claims (5)
- 実装用端子以外に外部端子を備える電子デバイスのパッケージであって、
前記実装端子以外の外部端子と電気的に接続された内部端子と、前記内部端子と選択的に接続されるグランド接続用の外部実装端子に接続された内部端子とをパッケージ内に配設したことを特徴とする電子デバイス用パッケージ。 - 前記実装端子以外の外部端子と電気的に接続された内部端子と前記グランド接続用の外部実装端子に接続された内部端子との接続に金属ワイヤを用いたことを特徴とする請求項1に記載の電子デバイス用パッケージ。
- 実装用端子以外に外部端子を備える電子デバイスのパッケージであって、
前記実装端子以外の外部端子と電気的に接続された内部端子と、グランド接続用の外部実装端子に接続された内部端子とに選択的に分割される1つの内部端子をパッケージ内に配設したことを特徴とする電子デバイス用パッケージ。 - 前記実装端子以外の外部端子をパッケージの蓋体としたことを特徴とする請求項1乃至請求項3のいずれかに記載の電子デバイス用パッケージ。
- 請求項1乃至請求項4のいずれかに記載の電子デバイス用パッケージを用いて電子デバイスを製造する方法であって、
パッケージ内部に搭載する電子部品の仕様に応じて、
電子部品と前記実装端子以外の外部端子と電気的に接続された内部端子との電気的接続と、前記実装端子以外の外部端子と電気的に接続された内部端子と前記グランド接続用の外部実装端子に接続された内部端子との電気的接続とを、
選択的に実行することを特徴とする電子デバイスの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194646A JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
US11/427,570 US7317246B2 (en) | 2005-07-04 | 2006-06-29 | Package for electronic device and method for manufacturing electronic device |
CNB2006100957808A CN100464406C (zh) | 2005-07-04 | 2006-07-04 | 电子器件用封装及电子器件的制造方法 |
KR20060062256A KR100890074B1 (ko) | 2005-07-04 | 2006-07-04 | 전자 디바이스용 패키지 및 전자 디바이스의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194646A JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007013020A true JP2007013020A (ja) | 2007-01-18 |
JP5007494B2 JP5007494B2 (ja) | 2012-08-22 |
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ID=37588462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005194646A Expired - Fee Related JP5007494B2 (ja) | 2005-07-04 | 2005-07-04 | 電子デバイスの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7317246B2 (ja) |
JP (1) | JP5007494B2 (ja) |
KR (1) | KR100890074B1 (ja) |
CN (1) | CN100464406C (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8748653B2 (en) | 2007-08-17 | 2014-06-10 | Central Glass Company, Limited | Method for purification of optically active α-fluorocarboxylic acid esters |
US8754718B2 (en) | 2011-03-11 | 2014-06-17 | Seiko Epson Corporation | Piezoelectric device and electronic apparatus |
JPWO2020218335A1 (ja) * | 2019-04-22 | 2020-10-29 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014036081A (ja) * | 2012-08-08 | 2014-02-24 | Seiko Epson Corp | 電子デバイスの製造方法、電子デバイス、電子機器、および移動体 |
JP2017022473A (ja) * | 2015-07-08 | 2017-01-26 | セイコーエプソン株式会社 | 振動子及びその製造方法、発振器、電子機器、並びに、移動体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000040784A (ja) * | 1998-07-24 | 2000-02-08 | Fujitsu Ltd | 半導体装置及び半導体装置ユニット及びその製造方法 |
JP2000049565A (ja) * | 1998-05-29 | 2000-02-18 | Fujitsu Ltd | 弾性表面波フィルタ装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3406846B2 (ja) | 1998-08-31 | 2003-05-19 | 京セラ株式会社 | 温度補償型水晶発振器 |
JP2003318653A (ja) * | 2002-04-24 | 2003-11-07 | Daishinku Corp | 圧電振動デバイス |
JP4045181B2 (ja) * | 2002-12-09 | 2008-02-13 | 沖電気工業株式会社 | 半導体装置 |
JP4251070B2 (ja) | 2003-12-10 | 2009-04-08 | エプソントヨコム株式会社 | 圧電発振器、電子部品、及び圧電発振器の製造方法 |
JP4244865B2 (ja) * | 2004-06-03 | 2009-03-25 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
-
2005
- 2005-07-04 JP JP2005194646A patent/JP5007494B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-29 US US11/427,570 patent/US7317246B2/en active Active
- 2006-07-04 CN CNB2006100957808A patent/CN100464406C/zh not_active Expired - Fee Related
- 2006-07-04 KR KR20060062256A patent/KR100890074B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000049565A (ja) * | 1998-05-29 | 2000-02-18 | Fujitsu Ltd | 弾性表面波フィルタ装置 |
JP2000040784A (ja) * | 1998-07-24 | 2000-02-08 | Fujitsu Ltd | 半導体装置及び半導体装置ユニット及びその製造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8748653B2 (en) | 2007-08-17 | 2014-06-10 | Central Glass Company, Limited | Method for purification of optically active α-fluorocarboxylic acid esters |
US8754718B2 (en) | 2011-03-11 | 2014-06-17 | Seiko Epson Corporation | Piezoelectric device and electronic apparatus |
US9054604B2 (en) | 2011-03-11 | 2015-06-09 | Seiko Epson Corporation | Piezoelectric device and electronic apparatus |
US9160254B2 (en) | 2011-03-11 | 2015-10-13 | Seiko Epson Corporation | Piezoelectric device and electronic apparatus |
US9685889B2 (en) | 2011-03-11 | 2017-06-20 | Seiko Epson Corporation | Piezoelectric device and electronic apparatus |
US10715058B2 (en) | 2011-03-11 | 2020-07-14 | Seiko Epson Corporation | Piezoelectric device and electronic apparatus |
JPWO2020218335A1 (ja) * | 2019-04-22 | 2020-10-29 | ||
WO2020218335A1 (ja) * | 2019-04-22 | 2020-10-29 | 京セラ株式会社 | 電子部品収納用パッケージ、電子装置、および電子モジュール |
JP7128352B2 (ja) | 2019-04-22 | 2022-08-30 | 京セラ株式会社 | 電子部品収納用パッケージ、電子装置、および電子モジュール |
Also Published As
Publication number | Publication date |
---|---|
KR100890074B1 (ko) | 2009-03-24 |
KR20070004452A (ko) | 2007-01-09 |
US20070001288A1 (en) | 2007-01-04 |
US7317246B2 (en) | 2008-01-08 |
CN100464406C (zh) | 2009-02-25 |
CN1893036A (zh) | 2007-01-10 |
JP5007494B2 (ja) | 2012-08-22 |
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