CN1893036A - 电子器件用封装及电子器件的制造方法 - Google Patents
电子器件用封装及电子器件的制造方法 Download PDFInfo
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Abstract
提供一种使具有安装端子以外的外部端子的电子器件用封装具有通用性的封装。用于解决上述课题的封装是除了安装用外部端子(26)以外还具有外部端子的电子器件用封装,其特征在于,在封装(10)内配设有:与所述安装用的外部端子(26)以外的外部端子电连接的内部端子(18e);和在与所述内部端子(18e)选择性地连接的接地用外部端子(26d)上连接的内部端子(18d)。并且,在这种结构的封装(10)中,可以把安装用的外部端子(26)以外的外部端子设定为盖(14)。
Description
技术领域
本发明涉及电子器件用封装及电子器件的制造方法,特别涉及作为内部安装部件具有可以进行数据改写的电子部件的电子器件用封装、及使用所述封装的电子器件的制造方法。
背景技术
电子器件的封装按照该器件的功能、安装于内部的电子部件的特性等进行了各种改进,开发了适合各种规格的形状、结构的封装。例如,专利文献1公开的封装是压电振荡器用的封装,但采用可以从外部对安装于内部的IC进行信息读写的结构。具体来讲,作为封装的外部端子,除用于安装在印刷基板等上的端子外,还设有用于控制IC的端子。
这种封装结构的改进,在解决以往的技术课题时是必然要进行的,本案申请人在进行技术开发时当然也不例外。实际上本案申请人发现了针对上述专利文献1公开的压电振荡器的课题,重复进行各种研究,结果开发了可以解决前述课题的压电振荡器。该发明的概况是把用于控制IC的端子用作压电振荡器的盖体,可以避免把压电振荡器安装在印刷基板等上时产生的短路等危险。
[专利文献1]日本特开2000-77943号公报
如上所述,重复进行了改进的用于电子器件的封装被认为对各种目的都非常有效。可是,为了解决一个课题而被特殊化的电子器件的封装结构在制造其他电子器件时缺乏通用性,这也是事实。实际上在专利文献1公开的封装中,在需要把IC控制用的外部端子用于其他用途时,必须重新设计封装的内部结构。
发明内容
本发明的目的在于,提供一种能够使设有安装端子以外的外部端子的电子器件用封装具有通用性的封装,并且提供有效利用该封装的电子器件的制造方法。
为了达到上述目的,本发明的电子器件用封装是除了安装用端子以外还具有外部端子的电子器件的封装,其特征在于,在封装内配设有:与所述安装用端子以外的外部端子电连接的内部端子;以及在与所述内部端子选择性地连接的接地用外部安装端子上连接的内部端子。通过形成这种结构的封装,所制造的封装至少可以形成为将所述内部端子彼此连接、和不将所述内部端子彼此连接的两种方式。因此,可以使具有一种基本结构的封装在制造阶段至少可以作为两种类型的封装被选择性地制造出来。即,可以使具有一种基本结构的封装具有通用性。
在如上所述的结构的电子器件用封装中,与所述安装用端子以外的外部端子电连接的内部端子、和与所述接地用外部安装端子连接的内部端子之间的连接,可以使用金属丝。如果通过使用金属丝的所谓引线接合将内部端子彼此连接,则可以在封装或电子器件的制造阶段容易地将内部端子彼此连接。
并且,为了达到上述目的,本发明的电子器件用封装是除了安装用端子以外还具有外部端子的电子器件的封装,其特征还可在于,在封装内配设有一个内部端子,该一个内部端子被选择性地划分为与所述安装用端子以外的外部端子电连接的内部端子、以及与接地用外部安装端子连接的内部端子。即使是这种结构的封装,所制造的封装也至少可以形成为将所述内部端子彼此连接、和不将所述内部端子彼此连接的两种方式。因此,可以使具有一种基本结构的封装在制造阶段至少可以作为两种类型的封装被选择性地制造出来。即,可以使具有一种基本结构的封装具有通用性。
并且,在如上所述构成的电子器件用封装中,可以把所述安装用端子以外的外部端子作为封装的盖体。通过使封装的盖体形成为接地的结构,可以期望获得屏蔽效应。
为了达到上述目的,本发明的电子器件的制造方法是使用以上所述的任一个电子器件用封装来制造电子器件的方法,其特征在于,根据安装在封装内部的电子部件的规格,选择性地执行电子部件和与所述安装用端子以外的外部端子电连接的内部端子之间的电连接,以及与所述安装用端子以外的外部端子电连接的内部端子和与所述接地用外部安装端子连接的内部端子之间的电连接。根据这种电子器件的制造方法,使用具有一种基本结构的封装,即可制造具有适应电子部件的规格的封装的两种电子部件。因此,可以有效使用上述电子器件用封装。
附图说明
图1是表示第1实施方式的电子器件用封装的第1规格例的概略图。
图2是表示第1实施方式的电子器件用封装的第2规格例的概略图。
图3是表示第2实施方式的电子器件用封装的结构的概略图。
图4是表示封装规格的应用示例的图。
具体实施方式
以下,参照附图对本发明的电子器件用封装、及使用该封装的电子器件的制造方法进行详细说明。另外,以下所示的实施方式是实施本发明后的优选方式,但本发明的技术范围不局限于以下实施方式。
首先,参照图1和图2说明本发明的电子器件用封装的第1实施方式。
本实施方式的封装10以内部安装电子部件16的封装基座(以下称为基座)12、和对安装了所述电子部件16的基座12进行密封的盖(盖体)14为基本结构。
所述基座12呈现为利用由陶瓷等绝缘部件构成的多个基板12a~12c形成的箱型,内部具有用于安装电子部件16的腔室。在形成各层的基板上设有与设计相对应的金属图形、通孔、凹坑等。设在基座12上的金属图形大致可以划分为设在基座内部的内部端子18(18a~18e)、设在基座外部的外部端子26b、26d(26a、26c)、以及连接这些端子的图形,所述通孔和凹坑发挥将所述内部端子18和所述外部端子26电连接的作用。在本实施方式中使用的基座12利用通孔(设在通孔内部的导电部件)28,将设于基板12b上表面的内部端子18a~18d、和设于基板12c下表面的外部端子26a~26d(26a、26c未图示)电连接。并且,本实施方式中设在基座12内部的内部端子18e与被引导到基座12上部的开口部的通孔30电连接。
本实施方式的封装10使用的盖14是金属制品,在构成基座12的材料为陶瓷时,最好选择热膨胀率接近的科瓦铁镍钴合金等构成部件。通过利用金属制作盖14,可以在基座12密封后使盖14自身成为连接内部端子18e的外部端子中的一个。
图1表示作为安装在封装10内部的电子部件16采用只具有基本连接焊盘(例如,控制来自电子器件的输出信号的端子:ST、接地端子:GND、输出来自电子器件的信号的端子:OUT、获取电源电压的端子:VDD)20a~20d的部件,并且接受了将作为外部端子设置的盖14接地(GND)的客户要求时的示例。另外,图1(A)是表示封装的平面的概略图,该图(B)是表示图(A)中的A-A剖面的概略图,该图(C)是表示图(A)中的B-B剖面的概略图。
在这种情况下,首先把符合客户要求的电子部件(例如IC)16安装的基座12的腔室内。电子部件16的安装可以使用未图示的粘接剂等。在把电子部件16安装在基座12内后,使用金属丝22将内部端子18a~18d与设在电子部件16上的连接焊盘20a~20d电连接(引线接合)。在进行引线接合时,设在电子部件16上的连接焊盘20a~20d分别连接与符合设计的外部端子(外部安装端子)26a~26d连接的内部端子18a~18d。在本实施方式的情况下,与作为GND连接用端子而设定的外部端子26d连接的内部端子18d相邻设置的内部端子18e,在封装10被密封后成为与盖14电连接的内部端子。因此,在具有上述要求的情况下,通过利用金属丝24将所述内部端子18e和内部端子18d电连接,在封装10被密封后,上述盖14与GND端子连接。通过将盖14连接GND,可以期望获得针对从封装10外部入射的电磁波的屏蔽效应。另外,在使利用金属构成的盖14处于电浮状态的情况下,在与设于基座12上的端子等之间,发挥作为所谓的电容器的作用,有时必须考虑储存在该电容器中的静电电容,但通过使盖14连接GND,可以避免这一点。因此,容易进行电子部件16等的控制。
另一方面,如图2所示,在要安装的电子部件16具有基本的连接焊盘20a~20d以外的连接焊盘(例如用于改写记录在电子部件内部的信息的写入控制焊盘:PE等)20e时,本实施方式的封装10将如下使用。另外,图2(A)是表示封装的平面的概略图,该图(B)是表示图(A)中的A-A剖面的概略图,该图(C)是表示图(A)中的B-B剖面的概略图。
把电子部件16安装在基座12内部的腔室内的步骤与图1所示相同。然后,对设在电子部件16上的连接焊盘20a~20e和设在基座12内部的内部端子18a~18e进行引线接合,以把电子部件16安装在腔室内。在本示例的情况下,由于采用使设在电子部件16上的连接焊盘20的数量与外部端子26以及连接作为外部端子的盖14的内部端子18的数量一致的结构,所以连接焊盘20a~20e连接到与满足各种目的的外部端子连接的内部端子18上。在本示例的情况下,作为写入控制焊盘(PE)的连接焊盘20e,连接与作为外部端子而设定的盖14连接的内部端子18e。
如以上列举的示例那样,本实施方式的封装10采用如下的结构:具有安装端子以外的外部端子(盖)14和与该外部端子(盖)14电连接的或者以其他方式连接的内部端子18e,根据需要使该内部端子18e选择性地连接其他内部端子18d等。通过采用这种结构,可以把根据安装在封装10内部的电子部件16的特性而特殊化的、被限定了使用目的的封装10用作可以安装具有其他特性的电子部件16的封装10。因此,可以使封装10具有通用性。
下面,参照图3对本发明的电子器件用封装的第2实施方式进行说明。另外,图3(A)表示封装的俯视图,该图(B)表示在图(A)中利用虚线包围的部分的放大图。本实施方式的封装的基本结构与上述第1实施方式的封装的结构相同。因此,对相同功能的部位,在附图上赋予相同符号并省略说明。
本实施方式的封装10通过改变构思,获得与根据封装的规格将内部端子彼此选择性地连接的第1实施方式的封装相同的效果。
本实施方式的封装采用针对设在基座上的一个内部端子18f连接多个外部端子(例如,盖14和被设置为GND连接用的外部端子26d)的结构。通过采用这种结构,在具有第1实施方式中作为示例列举的、采用只具有基本连接焊盘20的电子部件16并想将盖14接地的要求时,只将电子部件16的接地用连接焊盘20d连接内部端子18f即可。
另一方面,如图4所示,在采用具有基本连接焊盘以外的连接焊盘20e的电子部件16时,如图3(C)所示,使图3(B)中表示局部放大图的内部端子18的至少一部分故意断线(切断)即可。这样,封装10可以获得数量与设在电子部件16上的连接焊盘20相同的内部端子18,内部端子18连接使各种设定不同的外部端子26和盖14。另外,关于端子的切断,可以使用激光等切削图形,也可以使用其他方法。并且,关于内部端子的形状,不限于图3所示形状。另外,在本实施方式中为了简化说明,在内部端子18f只连接了盖14和被设定为GND连接用的外部端子26d,但其他的外部端子26也可以连接在同一内部端子上。该情况时,只要增加内部端子18f的切断部位、并划分为数量与所连接的外部端子26的数量对应的内部端子18即可。
在上述实施方式中,在相邻的内部端子18之间均进行了连接或切断,但也可以在分离的内部端子18之间进行连接或切断。但是,在分离的端子之间进行连接时,不得与其他内部端子18和连接用的金属丝22等接触。
并且,在上述实施方式中,均记载了在封装10内部只安装电子部件16的情况,但如图4所示,也可以安装压电振动片36来形成压电振荡器。并且,在实施方式中,在基座12内部安装电子部件16时均进行了引线接合,但如图4所示,在使用倒装片接合来安装电子部件时,也可以采用相同的结构。另外,图4(A)是表示封装的平面的概略图,该图(B)是表示图(A)中的A-A剖面的概略图,该图(C)是表示图(A)中的B-B剖面的概略图。
另外,在上述实施方式中说明了把盖14作为安装用端子以外的外部端子的情况,但安装用端子以外的外部端子当然也可以设定为盖14以外的端子。即使是这种结构的封装,作为本发明的电子器件用封装也没有变化。
Claims (5)
1.一种电子器件用封装,除了安装用端子以外还具有外部端子,其特征在于,
在封装内配设有:与所述安装用端子以外的外部端子电连接的内部端子;以及在与所述内部端子选择性地连接的接地用外部安装端子上连接的内部端子。
2.根据权利要求1所述的电子器件用封装,其特征在于,与所述安装用端子以外的外部端子电连接的内部端子、和与所述接地用外部安装端子连接的内部端子之间的连接,使用金属丝。
3.一种电子器件用封装,除安装用端子以外还具有外部端子,其特征在于,
在封装内配设有一个内部端子,该一个内部端子被选择性地划分为与所述安装用端子以外的外部端子电连接的内部端子、以及与接地用外部安装端子连接的内部端子。
4.根据权利要求1~3中任一项所述的电子器件用封装,其特征在于,把所述安装用端子以外的外部端子作为封装的盖体。
5.一种电子器件的制造方法,使用权利要求1~4中任一项所述的电子器件用封装来制造电子器件,其特征在于,
根据安装在封装内部的电子部件的规格,选择性地执行电子部件和与所述安装用端子以外的外部端子电连接的内部端子之间的电连接,以及与所述安装用端子以外的外部端子电连接的内部端子和与所述接地用外部安装端子连接的内部端子之间的电连接。
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