JP2006317437A - インライン電子ビーム検査システム - Google Patents

インライン電子ビーム検査システム Download PDF

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Publication number
JP2006317437A
JP2006317437A JP2006125815A JP2006125815A JP2006317437A JP 2006317437 A JP2006317437 A JP 2006317437A JP 2006125815 A JP2006125815 A JP 2006125815A JP 2006125815 A JP2006125815 A JP 2006125815A JP 2006317437 A JP2006317437 A JP 2006317437A
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JP
Japan
Prior art keywords
inspection
substrate
chamber
prober
large area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006125815A
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English (en)
Japanese (ja)
Other versions
JP2006317437A5 (enExample
Inventor
Fayez E Abboud
イー アボード フェイズ
Sriram Krishnaswami
クリシャナスワミ スリラム
Benjamin M Johnston
エム ジョンストン ベンジャミン
Hung T Nguyen
ティー ヌグエン ハング
Matthias Brunner
ブルンネル マティアス
Ralf Schmitt
ラルフ　シュミット
John M White
エム ホワイト ジョン
Shinichi Kurita
栗田　真一
James C Hunter
シー ハンター ジェイムズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2006317437A publication Critical patent/JP2006317437A/ja
Publication of JP2006317437A5 publication Critical patent/JP2006317437A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2809—Scanning microscopes characterised by the imaging problems involved
    • H01J2237/2811—Large objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2006125815A 2005-04-29 2006-04-28 インライン電子ビーム検査システム Pending JP2006317437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67655805P 2005-04-29 2005-04-29
US11/375,625 US7535238B2 (en) 2005-04-29 2006-03-14 In-line electron beam test system

Publications (2)

Publication Number Publication Date
JP2006317437A true JP2006317437A (ja) 2006-11-24
JP2006317437A5 JP2006317437A5 (enExample) 2009-06-18

Family

ID=37195046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006125815A Pending JP2006317437A (ja) 2005-04-29 2006-04-28 インライン電子ビーム検査システム

Country Status (5)

Country Link
US (3) US7535238B2 (enExample)
JP (1) JP2006317437A (enExample)
KR (1) KR101255750B1 (enExample)
CN (1) CN1854743B (enExample)
TW (1) TWI277759B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7535238B2 (en) * 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US8115506B2 (en) * 2007-05-14 2012-02-14 Applied Materials, Inc. Localization of driver failures within liquid crystal displays
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
EP2390906A1 (en) 2010-05-26 2011-11-30 Applied Materials, Inc. Apparatus and method for electrostatic discharge (ESD) reduction
EP2732299A4 (en) 2011-07-15 2015-03-25 Orbotech Ltd ELECTRICAL TESTING OF ELECTRONIC DEVICES BY MEANS OF ELECTRON BEAM-INDUCED PLASMA STONES
KR102119930B1 (ko) * 2014-08-31 2020-06-08 케이엘에이 코포레이션 복수의 이동가능한 빔 칼럼을 갖는 이미징 장치 및 실질적으로 일치하도록 의도된 기판의 복수의 영역을 검사하는 방법
US11530962B2 (en) 2017-04-06 2022-12-20 Kyutaek Cho Automated functional testing systems and methods of making and using the same
US10663382B2 (en) * 2018-08-30 2020-05-26 Canada Scaffold Supply Co. Ltd. Testing apparatus for applying test load using vacuum pressure

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US20090195262A1 (en) 2009-08-06
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